# US 9,439,280 B2 · LED module with circuit board having a plurality of recesses for preventing total internal reflection

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- Number: US 9,439,280 B2
- Document ID: US9439280B2
- Status: Granted
- Kind: B2
- Application number: 14/474,797
- Filed: 2014-09-02
- Published: 2015-03-05
- Granted: 2016-09-06
- Earliest claimed: 2013-09-04
- Assignees: Advanced Optoelectronic Technology, Inc.
- Applicants: Advanced Optoelectronic Technology, Inc.
- Inventors: Chung-Min Chang; Chien-Lin Chang-Chien; Ya-Ting Wu; Zheng-Hua Yang
- Web page: https://patentgrep.com/patent/US9439280B2

## CPC

- H05K 1/0274: {Optical details, e.g. printed circuits comprising integral optical means (H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42)}
- H10W 90/00: Package configurations
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H05K 2201/09036: Recesses or grooves in insulating substrate
- H05K 2201/10106: Light emitting diode [LED]
- H05K 2201/2054: Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
- H10H 20/856: Reflecting means
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

An light emitting diode (LED) module includes a circuit board, a plurality of LED chips arranged on and electrically connected to the circuit board, and an encapsulant arranged on the circuit board and covering the LED chips, a plurality of first recesses defined in a first surface of the circuit board.

## Claims

### Claim 1

An LED (light emitting diode) module comprising:
a circuit board;
a plurality of LED chips arranged on and electrically connected to the circuit board; and
an encapsulant arranged on the circuit board and covering the LED chips, a plurality of first recesses defined in a first surface of the circuit board;
wherein the first recesses each have a pair of inclined surfaces, the first recesses form a net, the LED chip is mounted in the net and surrounded by the first recesses alternated with each other, and a plurality of refractive parts are arranged on the first recesses.

### Claim 2 (depends on 1)

The LED module of claim 1, wherein the first recesses are defined between the LED chips.

### Claim 3 (depends on 2)

The LED module of claim 2, wherein each first recess is defined between two adjacent LED chips.

### Claim 4 (depends on 1)

The LED module of claim 1, wherein a first edge and a second edge are defined in each inclined surface, a distance between the first edge and a second surface of the encapsulant is less than that between the second edge and the second surface of the encapsulant, the second surface is a top surface of the encapsulant and does not touch the circuit board.

### Claim 5 (depends on 4)

The LED module of claim 4, wherein a cross section of each first recess is V-shaped.

### Claim 6 (depends on 4)

The LED module of claim 4, wherein each inclined surface intersects on the first surface of the circuit board at the first edge.

### Claim 7 (depends on 6)

The LED module of claim 6, wherein the two inclined surfaces of each first recess intersect at the second edge.

### Claim 8 (depends on 7)

The LED module of claim 7, wherein a distance between the first edge and an optic axis of a neighboring LED chip is larger than or equal to a half of a width of the LED chip horizontal to the circuit board.

### Claim 9 (depends on 8)

The LED module of claim 8, where in an angle between a normal line of each inclined surface and the optic axis of the neighboring LED chip is less than 90°.

### Claim 10 (depends on 1)

The LED module of claim 1, wherein a pair of refractive surfaces are defined in each refractive part.

### Claim 11 (depends on 10)

The LED module of claim 10, wherein an angle between a normal line of each refractive surface and an optic axis of the neighboring LED chip is less than 90°.

### Claim 12 (depends on 1)

The LED module of claim 1, wherein a plurality of second recesses are defined in gaps of the first recesses.

### Claim 13 (depends on 12)

The LED module of claim 12, wherein the second recesses are defined between the LED chips.

### Claim 14 (depends on 13)

The LED module of claim 13, each second recess is a conical recess or a truncated conical recess.

### Claim 15 (depends on 1)

The LED module of claim 1, wherein the encapsulant comprises a plurality of photoluminescence properties.

### Claim 16 (depends on 15)

The LED module of claim 15, wherein a refractive index of the encapsulant is in a range from 1.4 to 1.5.