# US 9,439,002 B2 · Integrated package forming wide sense gap micro electro-mechanical system microphone and methodologies for fabricating the same

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- Number: US 9,439,002 B2
- Document ID: US9439002B2
- Status: Granted
- Kind: B2
- Application number: 14/540,219
- Filed: 2014-11-13
- Published: 2016-05-19
- Granted: 2016-09-06
- Earliest claimed: 2014-11-13
- Assignees: InvenSense, Inc.
- Applicants: Invensense, Inc.
- Inventors: Renata Berger; Sushil Bharatan; Jeremy Parker; Aleksey S. Khenkin
- Web page: https://patentgrep.com/patent/US9439002B2

## CPC

- H04R 19/04: Microphones (H04R19/01 takes precedence)
- H04R 19/005: {using semiconductor materials}
- H04R 23/00: Transducers other than those covered by groups H04R9/00 - H04R21/00 {(diaphragms for transducers of the distributed-mode type H04R7/045)}
- H04R 31/00: Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)}
- H04R 2201/003: Mems transducers or their use
- H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K)

## Abstract

A micro electro-mechanical system (MEMS) microphone is provided. The microphone includes: a package substrate having a port disposed through the package substrate, wherein the port is configured to receive acoustic waves; and a lid coupled to the substrate and forming a package. The MEMS microphone also includes a MEMS acoustic sensor disposed in the package and positioned such that the acoustic waves receivable at the port are incident on the MEMS acoustic sensor. The MEMS acoustic sensor includes: a back plate positioned over the port at a first location within the package; and a diaphragm positioned at a second location within the package, wherein a distance between the first location and the second location forms a defined sense gap, and wherein the MEMS microphone is designed to withstand a bias voltage between the diaphragm and the back plate greater than or equal to about 15 volts.

## Claims

### Claim 1

A micro electro-mechanical system (MEMS) microphone, comprising:
a package substrate having a port disposed through the package substrate, wherein the port is configured to receive acoustic waves;
a lid mounted to the package substrate and forming a package; and
a MEMS acoustic sensor disposed in the package and coupled to the package substrate, wherein the MEMS acoustic sensor is positioned such that the acoustic waves receivable at the port are incident on the MEMS acoustic sensor, and wherein the MEMS acoustic sensor comprises:
a back plate positioned over the port at a first location within the package; and
a diaphragm positioned at a second location within the package, wherein a distance between the first location and the second location forms a defined sense gap, and wherein the MEMS microphone is designed to withstand a bias voltage between the diaphragm and the back plate greater than 20 volts.

### Claim 2 (depends on 1)

The MEMS microphone of claim 1, further comprising:
an application specific integrated circuit (ASIC) disposed within the package and electrically coupled to, and configured to process information generated by, the MEMS acoustic sensor.

### Claim 3 (depends on 1)

The MEMS microphone of claim 1, wherein a width of the defined sense gap is at least 3 microns, wherein the width is a distance between the first location and the second location.

### Claim 4 (depends on 1)

The MEMS microphone of claim 1, wherein the back plate and at least a portion of the diaphragm are substantially parallel to one another.

### Claim 5 (depends on 1)

The MEMS microphone of claim 1, further comprising a post coupled between the diaphragm and the back plate.

### Claim 6 (depends on 1)

The MEMS microphone of claim 1, wherein a resonant frequency of the diaphragm is greater than or equal to about 32 kilohertz.

### Claim 7 (depends on 1)

The MEMS microphone of claim 1, wherein the MEMS microphone has a resonant frequency within a range from about 20 kilohertz to about 40 kilohertz.

### Claim 8 (depends on 1)

The MEMs microphone of claim 1, wherein the diaphragm includes at least one spring.