# US 9,438,199 B2 · Component package including matching circuit and matching method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,438,199 B2 - Document ID: US9438199B2 - Status: Granted - Kind: B2 - Application number: 14/478,295 - Filed: 2014-09-05 - Published: 2015-09-24 - Granted: 2016-09-06 - Earliest claimed: 2014-03-18 - Assignees: Electronics and Telecommunications Research Institute - Applicants: Electronics and Telecommunications Research Institute - Inventors: Dong Min Kang; Seong Il Kim; Sang Heung Lee; Chull Won Ju; Ho Kyun Ahn; Hyung Sup Yoon; Jong Won Lim - Web page: https://patentgrep.com/patent/US9438199B2 ## CPC - H03H 7/38: Impedance-matching networks - H01P 1/2039: {Galvanic coupling between Input/Output} - H01P 5/12: Coupling devices having more than two ports (H01P5/04 takes precedence) - H10W 44/601: {Capacitive arrangements (H10W44/20 takes precedence)} - H05K 1/025: {Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance (H05K1/024 and H05K1/0243 take precedence; for semiconductor devices H10W44/20)} - H05K 2201/09781: Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Provided herein is a component package including a matching unit and a matching method thereof, the matching unit including: a substrate; a transmission line formed on the substrate, the transmission line being connected to a terminal of the component package; a bonding wire electrically connecting the transmission line and a central component; and a capacitor unit having a plurality of capacitors electrically connected with the transmission line by wiring connection, wherein an inductance of the matching unit is variable by adjusting a length of the bonding wire, and a capacitance of the matching unit is variable by increasing or reducing the number of capacitors electrically connected to the transmission line, of among the capacitors inside the capacitor unit, by extending or cutting off the wiring connection. ## Claims ### Claim 1 A component package, comprising: a central component; external terminals provided in both sides of the component package, a matching unit including a substrate disposed inside the component package between the central component and one of the external terminals, a transmission line formed on the substrate, a first side of the transmission line being connected to said one of the external terminals of the component package, bonding wires electrically connecting the transmission line and the central component such that first ends of the bonding wires are connected to the central component and second ends of the bonding wires are commonly connected to a second side of the transmission line, a capacitor unit including a plurality of capacitors arranged in a matrix format within the substrate, the capacitor unit being spaced apart from the transmission line and the bonding wires, and a wiring connector separated from the bonding wires and electrically connecting at least one of the capacitors to the transmission line to form a capacitance commonly applied to the bonding wires, wherein an inductance of the matching unit is defined by a length of the bonding wires, and the capacitance of the matching unit is defined by the number of the capacitors connected to the transmission line by the wiring connector. ### Claim 2 (depends on 1) The component package according to claim 1, wherein the length of the bonding wires is adjusted by increasing or reducing a width of the substrate. ### Claim 3 (depends on 1) The component package according to claim 1, wherein the matching unit includes more than one capacitor unit and more than one wiring connector. ### Claim 4 (depends on 1) The component package according to claim 1, wherein said one of the external terminals is an input terminal of the component package, and the matching unit is an input matching unit disposed between the input terminal and the central component. ### Claim 5 (depends on 1) The component package according to claim 1, wherein said one of the external terminals is an output terminal of the component package, and the matching unit is an output matching unit disposed between the output terminal and the central component. ### Claim 6 (depends on 1) The component package according to claim 1, wherein said at least one of the capacitors are connected in series or parallel to the transmission line by the wiring connector. ### Claim 7 (depends on 1) The component package according to claim 1, wherein the central component is a power component used for generating, transmitting, converting and controlling power. ### Claim 8 (depends on 7) The component package according to claim 7, wherein the central component is a GaN power component. ### Claim 9 (depends on 1) The component package according to claim 1, wherein the external terminals include an input terminal, and an output terminal, and the component package includes a first matching unit disposed between the input terminal and the central component, and a second matching unit between the output terminal and the central component. ### Claim 10 A matching method of a component package including a central component, external terminals provided in both sides of the component package, a matching unit including a substrate disposed inside the component package between the central component and one of the external terminals, a transmission line formed on the substrate, a first side of the transmission line being connected to said one of the external terminals of the component package, bonding wires electrically connecting the transmission line and the central component such that first ends of the bonding wires are connected to the central component and second ends of the bonding wires are connected to the transmission line, a capacitor unit including a plurality of capacitors arranged in a matrix format within the substrate, the capacitor unit being spaced apart from the transmission line and the bonding wires, and a wiring connector separated from the bonding wires and electrically connecting at least one of the capacitors to the transmission line to form a capacitance commonly applied to the bonding wires, the method comprising: adjusting an inductance of the matching unit by adjusting a length of the bonding wires electrically connecting the transmission line with the central component; and adjusting the capacitance by increasing or decreasing in a length of the wiring connector connected between the transmission line and the capacitors or between the capacitors in order to adjust the number of the capacitors electrically connected to the transmission line. ### Claim 11 (depends on 10) The method according to claim 10, further comprising determining whether or not desired matching characteristics have been achieved; and repeating said adjusting the inductance and the capacitance, according to a result of the determining.