# US 9,438,003 B2 · Solid-state laser > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,438,003 B2 - Document ID: US9438003B2 - Status: Granted - Kind: B2 - Application number: 14/628,772 - Filed: 2015-02-23 - Published: 2015-06-18 - Granted: 2016-09-06 - Earliest claimed: 2012-08-23 - Assignees: Trumpf Laser GmbH - Applicants: Trumpf Laser GmbH - Inventors: Sven-Silvius Schad; Elke Dolores Kaiser - Web page: https://patentgrep.com/patent/US9438003B2 ## CPC - H01S 3/042: for solid state lasers {(H01S3/0401 takes precedence)} - H01S 3/0405: {Conductive cooling, e.g. by heat sinks or thermo-electric elements} - H01S 3/0604: {in the form of a plate or disc} - H01S 3/0621: {Coatings on the end-faces, e.g. input/output surfaces of the laser light} - H01S 3/094084: {with pump light recycling, i.e. with reinjection of the unused pump light, e.g. by reflectors or circulators} - H01S: DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL ## Abstract A solid-state laser arrangement includes a plate-like solid body including a laser-active medium, a heat sink, a layer of adhesive between a carrier face of the heat sink and the plate-like solid body, and a reflective coating on a side of the plate-like solid body facing the adhesive layer, in which the adhesive layer is completely shielded from radiation from the plate-like solid body by a radiation-impermeable region between the side of the plate-like solid body facing the adhesive layer and the carrier face of the heat sink. ## Claims ### Claim 1 A solid-state laser arrangement comprising: a plate-like solid body including a laser-active medium; a heat sink; an adhesive layer between a carrier face of the heat sink and the plate-like solid body, the adhesive layer terminating flush with a peripheral edge of the plate-like solid body along an edge of the adhesive layer, wherein both the peripheral edge of the plate-like solid body and the edge of the adhesive layer are inclined relative to the carrier face of the heat sink at the same, inclination angle (α) that is different from 90°; and a reflective coating on a side of the plate-like solid body facing the adhesive layer, wherein the adhesive layer is completely shielded from radiation from the plate-like solid body by a radiation-impermeable region between the side of the plate-like solid body facing the adhesive layer and the carrier face of the heat sink. ### Claim 2 (depends on 1) The solid-state laser arrangement according to claim 1, wherein the radiation-impermeable region comprises a region of the reflective coating extending continuously over the plate-like solid body. ### Claim 3 (depends on 1) The solid-state laser arrangement according to claim 1, wherein the radiation-impermeable region comprises an absorber layer between the plate-like solid body and the adhesive layer. ### Claim 4 (depends on 1) The solid-state laser arrangement according to claim 1, wherein the radiation-impermeable region terminates flush with the plate-like solid body. ### Claim 5 (depends on 1) The solid-state laser arrangement according to claim 1, further comprising a stop layer on the carrier face and/or on the peripheral edge of the plate-like solid body, wherein the stop layer prevents wetting by the adhesive layer. ### Claim 6 (depends on 1) The solid-state laser arrangement according to claim 1, further comprising: a focusing device arranged to focus pump radiation onto the plate-like solid body. ### Claim 7 (depends on 1) The solid-state laser arrangement according to claim 1, wherein the reflective coating has a thickness between 1 μm and 10 μm. ### Claim 8 (depends on 1) The solid-state laser arrangement according to claim 1, wherein the adhesive layer has a thickness of less than 5.0 μm. ### Claim 9 (depends on 1) The solid-state laser arrangement according to claim 1, wherein the adhesive of the adhesive layer is selected from the group consisting of silicate adhesives, acrylate adhesives and dual-component adhesives. ### Claim 10 (depends on 1) The solid-state laser arrangement according to claim 1, wherein the heat sink is composed of a material selected from the group consisting of carbides, metals, diamond and diamond-containing materials. ### Claim 11 A method for producing a laser amplification arrangement, the method comprising: applying a reflective coating to a plate-like solid body; applying an adhesive layer between the plate-like solid body and a carrier face of a heat sink; forming an radiation-impermeable region between a side of the plate-like solid body facing the adhesive layer and the carrier face of the heat sink; and removing a portion of each of the plate-like solid body and the adhesive layer so that the adhesive layer terminates flush with the plate-like solid body, and so that a peripheral edge of the plate-like solid body forms an inclination angle (α) that is different from 90° with the side of the plate-like solid body facing the adhesive layer. ### Claim 12 (depends on 11) The method according to claim 11, wherein forming the radiation-impermeable region comprises forming a continuous region of the reflecting coating over the solid body. ### Claim 13 (depends on 11) The method according to claim 11, wherein, forming the radiation-impermeable region comprises applying an absorber layer to the reflective coating and/or to the solid body. ### Claim 14 (depends on 11) The method according to claim 11, further comprising: applying an adhesive stop layer to a portion of the carrier face, and/or to the peripheral edge of the plate-like solid body, wherein the adhesive stop layer prevents wetting of the adhesive layer. ### Claim 15 (depends on 11) The method according to claim 11, further comprising: removing a portion of the adhesive layer protruding beyond the plate-like solid body by a solvent and/or by an etching process. ### Claim 16 (depends on 11) The method according to claim 11, wherein removing the portion of the plate-like solid body and adhesive layer comprises applying a thermal processing beam to the plate-like solid body and adhesive layer. ### Claim 17 (depends on 11) The method according to claim 11, wherein removing the portion of each of the plate-like solid body and the adhesive layer results in both the peripheral edge of the plate-like solid body and an edge of the adhesive layer that is flush with the peripheral edge of the plate-like solid body being oriented at the same non-90° inclination angle (α) with respect to the carrier face of the heat sink.