# US 9,437,933 B2 · Sensor device with helical antenna and related system and method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,437,933 B2 - Document ID: US9437933B2 - Status: Granted - Kind: B2 - Application number: 12/755,123 - Filed: 2010-04-06 - Published: 2011-10-06 - Granted: 2016-09-06 - Earliest claimed: 2010-04-06 - Assignees: Honeywell International Inc. - Applicants: Ion Georgescu; Dana E. Guran; Ioan Pavelescu; Cornel Cobianu - Inventors: Ion Georgescu; Dana E. Guran; Ioan Pavelescu; Cornel Cobianu - Web page: https://patentgrep.com/patent/US9437933B2 ## CPC - H01Q 11/08: Helical antennas - H01Q 1/3233: {particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems} - H01Q 1/38: formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface H01Q15/142)} - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) ## Abstract An apparatus includes a sensor that receives a first electrical signal and provides a second electrical signal in response to the first electrical signal. The second electrical signal is based on at least one parameter monitored by the sensor. The apparatus also includes an antenna that converts first wireless signals into the first electrical signal and that converts the second electrical signal into second wireless signals. The antenna includes a substrate, conductive traces, and conductive interconnects. The conductive traces are formed on first and second surfaces of the substrate. The conductive interconnects couple the conductive traces, and the conductive interconnects and the conductive traces form at least one helical arm of the antenna. The conductive traces could be formed in various ways, such as by etching or direct printing. The conductive interconnects could also be formed in various ways, such as by filling vias in the substrate or direct printing. ## Claims ### Claim 1 An apparatus comprising: a sensor configured to receive a first electrical signal and to provide a second electrical signal in response to the first electrical signal, the second electrical signal based on at least one parameter monitored by the sensor; and an antenna configured to convert first wireless signals into the first electrical signal and to convert the second electrical signal into second wireless signals, the antenna comprising: a single substrate comprising a first half and a second half; a plurality of conductive traces on first and second surfaces of the first half of the single substrate, the first and second surfaces being opposite and external surfaces of the single substrate; a plurality of conductive interconnects coupling the conductive traces, the conductive interconnects and the conductive traces forming at least one helical arm of the antenna; and first and second ground plates, the first ground plate on a first surface of the second half of the single substrate and the second ground plate on a second surface of the second half of the single substrate; wherein, on each of the opposite and external surfaces of the single substrate, all surface area defined between the conductive traces on the first half of the single substrate substantially equals a surface area of one of the ground plates on the second half of the single substrate. ### Claim 2 (depends on 1) The apparatus of claim 1, wherein the conductive traces and the conductive interconnects form one helical arm of a monopole antenna. ### Claim 3 (depends on 2) The apparatus of claim 2, wherein the antenna further comprises at least one additional conductive interconnect coupling the first and second ground plates. ### Claim 4 (depends on 1) The apparatus of claim 1, wherein the conductive interconnects comprise conductive material in vias through the single substrate. ### Claim 5 (depends on 1) The apparatus of claim 1, wherein the conductive interconnects comprise conductive material on sides of the single substrate, the sides between the first and second surfaces of the first half of the single substrate. ### Claim 6 (depends on 1) The apparatus of claim 1, wherein the sensor comprises a surface acoustic wave (SAW) sensor. ### Claim 7 (depends on 1) The apparatus of claim 1, wherein the sensor is directly connected to at least one of the first and second ground plates. ### Claim 8 A system comprising: a sensor device configured to receive first wireless signals and to transmit second wireless signals in response to the first wireless signals, the sensor device comprising an antenna, the antenna comprising: a single substrate comprising a first half and a second half; a plurality of conductive traces on first and second surfaces of the first half of the single substrate, the first and second surfaces being opposite and external surfaces of the single substrate; a plurality of conductive interconnects coupling the conductive traces, the conductive interconnects and the conductive traces forming at least one helical arm of the antenna; and first and second ground plates, the first ground plate on a first surface of the second half of the single substrate and the second ground plate on a second surface of the second half of the single substrate; and a sensor monitor configured to transmit the first wireless signals to the sensor and to receive the second wireless signals from the sensor; wherein, on each of the opposite and external surfaces of the single substrate, all surface area defined between the conductive traces on the first half of the single substrate substantially equals a surface area of one of the ground plates on the second half of the single substrate. ### Claim 9 (depends on 8) The system of claim 8, further comprising: a controller configured to analyze data associated with the second wireless signals and to control a process system based on the analysis. ### Claim 10 (depends on 8) The system of claim 8, wherein the conductive traces and the conductive interconnects form one helical arm of a monopole antenna. ### Claim 11 (depends on 10) The system of claim 10, wherein the antenna further comprises at least one additional conductive interconnect coupling the first and second ground plates. ### Claim 12 (depends on 8) The system of claim 8, wherein the conductive interconnects comprise conductive material in vias through the single substrate. ### Claim 13 (depends on 8) The system of claim 8, wherein the conductive interconnects comprise conductive material on sides of the single substrate, the sides between the first and second surfaces of the first half of the single substrate. ### Claim 14 (depends on 8) The system of claim 8, wherein the sensor comprises a surface acoustic wave (SAW) sensor. ### Claim 15 (depends on 8) The system of claim 8, wherein the sensor is directly connected to at least one of the first and second ground plates. ### Claim 16 A method comprising: receiving first wireless signals at a sensor device; and responsive to receiving the first wireless signals, transmitting second wireless signals from the sensor device; wherein the sensor device comprises an antenna, the antenna comprising: a single substrate comprising a first half and a second half; a plurality of conductive traces on first and second surfaces of the first half of the single substrate, the first and second surfaces being opposite and external surfaces of the single substrate; a plurality of conductive interconnects coupling the conductive traces, the conductive interconnects and the conductive traces forming at least one helical arm of the antenna; and first and second ground plates, the first ground plate on a first surface of the second half of the single substrate and the second ground plate on a second surface of the second half of the single substrate; wherein, on each of the opposite and external surfaces of the single substrate, all surface area defined between the conductive traces on the first half of the single substrate substantially equals a surface area of one of the ground plates on the second half of the single substrate. ### Claim 17 (depends on 16) The method of claim 16, wherein the conductive traces and the conductive interconnects form one helical arm of a monopole antenna. ### Claim 18 (depends on 17) The method of claim 17, wherein the antenna further comprises at least one additional conductive interconnect coupling the first and second ground plates. ### Claim 19 (depends on 16) The method of claim 16, wherein the sensor is directly connected to at least one of the first and second ground plates.