# US 9,437,912 B2 · 3-D integrated package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,437,912 B2 - Document ID: US9437912B2 - Status: Granted - Kind: B2 - Application number: 14/691,552 - Filed: 2015-04-20 - Published: 2016-01-14 - Granted: 2016-09-06 - Earliest claimed: 2012-03-09 - Assignees: Finisar Corporation - Applicants: Finisar Corporation - Inventors: Yunpeng Song; Yongsheng Liu; Hongyu Deng - Web page: https://patentgrep.com/patent/US9437912B2 ## CPC - H01P 5/08: for linking dissimilar lines or devices (H01P1/16, H01P5/04 take precedence; linking lines of the same kind but with different dimensions H01P5/02) - H01P 1/047: {Strip line joints} - H01P 3/003: {Coplanar lines} - H01P 3/08: Microstrips; Strip lines - H05K 1/0243: {Printed circuits associated with mounted high frequency components} - H05K 1/112: {directly combined with via connections} - H05K 1/0227: {Split or nearly split shielding or ground planes} - H05K 1/0251: {related to vias or transitions between vias and transmission lines} - H05K 2201/09236: Parallel layout - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes. ## Claims ### Claim 1 An electronics package comprising: a plurality of transition layers, each transition layer including: an insulating layer; a signal via configured to pass through the insulating layer and that is electrically coupled with the signal via of an adjacent transition layer; a ground plane having a signal cut configured to provide clearance between the ground plane and the signal via; and a plurality of ground vias each configured to electrically couple the ground plane of the transition layer with the ground plane of an adjacent transition layer; and an electrically conductive transmission line including: a coplanar waveguide portion electrically coupled to a microstrip portion; the signal vias of the plurality of transition layers; and a signal pin electrically coupled to the signal vias, wherein the signal pin is configured to be electrically coupled to a printed circuit board (PCB) via a PCB signal trace deposited on the PCB. ### Claim 2 (depends on 1) The electronics package of claim 1, wherein the signal via of the insulating layer and the signal via of the adjacent transition layer are staggered. ### Claim 3 (depends on 1) The electronics package of claim 1, wherein the signal via of the insulating layer and the signal via of the adjacent transition layer are axially aligned. ### Claim 4 (depends on 1) The electronics package of claim 1, further comprising a capacitor electrically coupled to the microstrip portion. ### Claim 5 (depends on 4) The electronics package of claim 4, further comprising a ground plane adjacent to the capacitor, the adjacent ground plane including a capacitor ground cut adjacent to the capacitor. ### Claim 6 (depends on 1) The electronics package of claim 1, wherein the ground plane is located at a face of the insulating layer. ### Claim 7 (depends on 1) The electronics package of claim 1, further comprising a ground plane adjacent to a package-PCB interface, the adjacent ground plane including a transition ground cut configured to provide clearance between the adjacent ground plane and the signal pin. ### Claim 8 (depends on 7) The electronics package of claim 7, wherein the transition ground cut is located at an edge of the adjacent ground plane. ### Claim 9 (depends on 7) The electronics package of claim 7, wherein the transition ground cut is substantially rectangular. ### Claim 10 (depends on 1) The electronics package of claim 1, wherein the signal cuts are substantially circular. ### Claim 11 (depends on 1) The electronics package of claim 1, wherein the electronics package includes a ceramic material. ### Claim 12 (depends on 1) A high-speed transponder comprising a printed circuit board (PCB) electrically coupled to the electronics package of claim 1 and an optoelectronic circuit package. ### Claim 13 Multiple component circuitry comprising: a printed circuit board (PCB); a PCB signal trace deposited on the PCB; and an electronics package including: a plurality of transition layers, each transition layer including: an insulating layer; a signal via configured to pass through the insulating layer and that is electrically coupled with the signal via of an adjacent transition layer; a ground plane having a signal cut configured to provide clearance between the ground plane and the signal via; and a plurality of ground vias each configured to electrically couple the ground plane of the transition layer with the ground plane of an adjacent transition layer; and an electrically conductive transmission line including: a coplanar waveguide portion electrically coupled to a microstrip portion; the signal vias of the plurality of transition layers; and a signal pin electrically coupled to the signal vias and electrically coupled to the PCB via the PCB signal trace. ### Claim 14 (depends on 13) The multiple component circuitry of claim 13, further comprising an optoelectronic circuit package electrically coupled to the PCB via the PCB signal trace. ### Claim 15 (depends on 14) The multiple component circuitry of claim 14, wherein the signal via of the insulating layer and the signal via of the adjacent transition layer are staggered. ### Claim 16 (depends on 14) The multiple component circuitry of claim 14, wherein the signal via of the insulating layer and the signal via of the adjacent transition layer are axially aligned. ### Claim 17 (depends on 14) The multiple component circuitry of claim 14, the electronics package further including a capacitor electrically coupled to the microstrip portion. ### Claim 18 (depends on 17) The multiple component circuitry of claim 17, the electronics package further including a ground plane adjacent to the capacitor, the adjacent ground plane including a capacitor ground cut adjacent to the capacitor. ### Claim 19 (depends on 14) The multiple component circuitry of claim 14, the electronics package further including a ground plane adjacent to a package-PCB interface, the adjacent ground plane including a transition ground cut configured to provide clearance between the adjacent ground plane and the signal pin. ### Claim 20 (depends on 14) The multiple component circuitry of claim 14, wherein the signal cuts are substantially circular.