# US 9,437,911 B1 · Compliant high speed interconnects > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,437,911 B1 - Document ID: US9437911B1 - Status: Granted - Kind: B1 - Application number: 14/718,765 - Filed: 2015-05-21 - Granted: 2016-09-06 - Earliest claimed: 2015-05-21 - Assignees: Harris Corporation - Applicants: Harris Corporation - Inventors: Lawrence W. Shacklette; Michael R. Weatherspoon; Joshua P. Bruckmeyer; Arthur Wilson - Web page: https://patentgrep.com/patent/US9437911B1 ## CPC - H01P 3/06: Coaxial lines - G02B 6/4267: {Reduction of thermal stress, e.g. by selecting thermal coefficient of materials} - G02B 6/4277: {Protection against electromagnetic interference [EMI], e.g. shielding means (shielding of electric apparatus H05K9/00, of instruments G12B17/00)} - G02F 1/0356: {controlled by a high-frequency electromagnetic wave component in an electric waveguide structure} - H01P 11/005: {Manufacturing coaxial lines} - H10W 72/00: Interconnections or connectors in packages - H10W 90/293: {characterised by non-galvanic coupling between the chips, e.g. capacitive coupling} - H01P 5/085: {Coaxial-line/strip-line transitions} - H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B) - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS - G02F: OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Systems (100) and methods (900) for providing a compliant micro-coaxial interconnect with an integrated circuit or other electronic device. The methods comprise: forming a well (108) in a first substrate (102) having a first Coefficient of Thermal Expansion (“CTE”); forming at least one three-dimensional micro-coaxial interconnect (100) on the first substrate so as to have a cantilevered end portion (110) disposed over the well; and using a first coupler (606) to electrically couple the cantilevered end portion to a second substrate (604) having a second CTE different from the first CTE. The cantilevered end portion has an angled joint (302) so that at least one of a pushing force and a pulling force applied thereby to the first coupler is minimized when mismatching movements of the first and second substrates occur. ## Claims ### Claim 1 An Integrated Circuit (“IC”), comprising: a first substrate having a first Coefficient of Thermal Expansion (“CTE”) and a well formed therein; at least one three-dimensional micro-coaxial interconnect formed on the first substrate so as to have a cantilevered end portion disposed over the well; and a first coupler electrically coupling the cantilevered end portion to a second substrate having a second CTE different from the first CTE; wherein the cantilevered end portion has a first angled joint so that at least one of a pushing force and a pulling force applied thereby to the first coupler is minimized when mismatching movements of the first and second substrates occur. ### Claim 2 (depends on 1) The IC according to claim 1, wherein the first coupler electrically couples a conductive core of the cantilevered end portion to the second substrate. ### Claim 3 (depends on 2) The IC according to claim 2, wherein a second coupler electrically couples a shield of the cantilevered end portion to the second substrate. ### Claim 4 (depends on 1) The IC according to claim 1, wherein the three-dimensional micro-coaxial interconnect is formed using a semiconductor lithography based process. ### Claim 5 (depends on 1) The IC according to claim 1, wherein the micro-coaxial interconnect comprises a three-dimensional structure defined by an elongate conductive shield, an elongate conductive core disposed within the elongate conductive shield, an air gap between the elongate conductive shield and the elongate conductive core, and a plurality of dielectric straps suspending the elongate conductive core within the elongate conductive shield. ### Claim 6 (depends on 1) The IC according to claim 1, wherein the first angled joint is defined by a first portion of the three-dimensional micro-coaxial interconnect that is angled relative to a second portion of the three-dimensional micro-coaxial interconnect by at least ten degrees. ### Claim 7 (depends on 1) The IC according to claim 1, wherein the first angled joint resides along the cantilevered end portion of the three-dimensional micro-coaxial interconnect. ### Claim 8 (depends on 1) The IC according to claim 1, wherein the three-dimensional micro-coaxial interconnect comprises a second angled joint which allows movement of the cantilevered end portion in a direction different from a direction which is allowed by the first angled joint. ### Claim 9 (depends on 1) The IC according to claim 1, wherein the coupler is solder or a conductive adhesive. ### Claim 10 (depends on 1) The IC according to claim 1, wherein the cantilevered end portion has a serpentine geometry or a zigzag geometry. ### Claim 11 A method for providing a mechanically compliant micro-coaxial interconnect with an Integrated Circuit (“IC”) or other electronic device, comprising: forming a well in a first substrate having a first Coefficient of Thermal Expansion (“CTE”); forming at least one three-dimensional micro-coaxial interconnect on the first substrate so as to have a cantilevered end portion disposed over the well; and using a first coupler to electrically couple the cantilevered end portion to a second substrate having a second CTE different from the first CTE; wherein the cantilevered end portion has a first angled joint so that at least one of a pulling force and a pushing force applied thereby to the first coupler is minimized when mismatching movements of the first and second substrates occur. ### Claim 12 (depends on 11) The method according to claim 11, wherein the first coupler electrically couples a conductive core of the cantilevered end portion to the second substrate. ### Claim 13 (depends on 12) The method according to claim 12, wherein a second coupler electrically couples a shield of the cantilevered end portion to the second substrate. ### Claim 14 (depends on 11) The method according to claim 11, wherein the three-dimensional micro-coaxial interconnect is formed using a semiconductor lithography based process. ### Claim 15 (depends on 11) The method according to claim 11, wherein the three-dimensional micro-coaxial interconnect comprises a three-dimensional structure defined by an elongate conductive shield, an elongate conductive core disposed within the elongate conductive shield, an air gap between the elongate conductive shield and the elongate conductive core, and a plurality of dielectric straps suspending the elongate conductive core within the elongate conductive shield. ### Claim 16 (depends on 11) The method according to claim 11, wherein the first angled joint is defined by a first portion of the three-dimensional micro-coaxial interconnect that is angled relative to a second portion of the three-dimensional micro-coaxial interconnect by at least ten degrees. ### Claim 17 (depends on 11) The method according to claim 11, wherein the first angled joint resides along the cantilevered end portion of the three-dimensional micro-coaxial interconnect. ### Claim 18 (depends on 11) The method according to claim 11, wherein the three-dimensional micro-coaxial interconnect comprises a second angled joint which allows movement of the cantilevered end portion in a direction different from a direction which is allowed by the first angled joint. ### Claim 19 (depends on 11) The method according to claim 11, wherein the coupler is solder or a conductive adhesive.