# US 9,437,839 B2 · Method for manufacturing electronic device and electronic device manufactured thereby > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,437,839 B2 - Document ID: US9437839B2 - Status: Granted - Kind: B2 - Application number: 14/727,903 - Filed: 2015-06-02 - Published: 2015-12-24 - Granted: 2016-09-06 - Earliest claimed: 2014-06-19 - Assignees: Panasonic Intellectual Property Management Co., Ltd. - Applicants: Panasonic Intellectual Property Management Co., Ltd. - Inventors: Noriaki Fukumoto - Web page: https://patentgrep.com/patent/US9437839B2 ## CPC - H10K 71/80: using temporary substrates - H10K 59/8722: {Peripheral sealing arrangements, e.g. adhesives, sealants} - H10K 59/873: {Encapsulations} - H10K: ORGANIC ELECTRIC SOLID-STATE DEVICES ## Abstract On a support substrate, an adhesive layer is formed from a material which decreases an adhesion force thereof to the support substrate when absorbing moisture. In addition, a resin substrate is formed on the adhesive layer, and a sealing layer is formed which seals at least a portion of a laminate structure including the adhesive layer and the resin substrate at which the adhesive layer is exposed. An electronic element is formed above the resin substrate. After a part of a sealing structure including the sealing layer and the support substrate is removed so as to expose the adhesive layer, moisture is supplied to the adhesive layer. An electronic device including the electronic element and the resin substrate is peeled away from the support substrate. ## Claims ### Claim 1 A method for manufacturing an electronic device, the method comprising: fixing a resin substrate to a support substrate with an adhesive layer interposed therebetween to form a laminate structure including the adhesive layer and the resin substrate; forming a sealing layer that seals at least a portion of the laminate structure at which the adhesive layer is exposed to form a sealing structure including the sealing layer and the support substrate; forming an electronic element above the resin substrate to form the electronic device including the electronic element and the resin substrate; exposing the adhesive layer by removing a part of the sealing structure; supplying moisture to the adhesive layer; and peeling the electronic device from the support substrate, wherein the adhesive layer contains as a primary component, a material which decreases an adhesion force thereof to the support substrate when absorbing moisture. ### Claim 2 (depends on 1) The method for manufacturing an electronic device according to claim 1, wherein the part of the sealing structure which is removed includes a part of the adhesive layer located around the electronic element and a part of the resin substrate located around the electronic element. ### Claim 3 (depends on 1) The method for manufacturing an electronic device according to claim 1, wherein a surface of the support substrate includes a hydroxy group, and the material of the adhesive layer has a high water absorption rate as compared to that of a material of the resin substrate. ### Claim 4 (depends on 3) The method for manufacturing an electronic device according to claim 3, wherein the support substrate is a glass substrate. ### Claim 5 (depends on 1) The method for manufacturing an electronic device according to claim 1, wherein the material of the adhesive layer satisfies in accordance with an ASTM D570 test method, at least one selected from the group of a water absorption rate of 1.5% or more by water immersion at 23° C. for 24 hours and a water absorption rate of 1% or more in an equilibrium state at 50° C. and a relative humidity of 60%. ### Claim 6 (depends on 5) The method for manufacturing an electronic device according to claim 5, wherein the adhesive layer contains as the primary component, a polyimide or a poly(imide amide). ### Claim 7 (depends on 1) The method for manufacturing an electronic device according to claim 1, the method further comprising: after the electronic element is formed and before the part of the sealing structure is removed, forming an element covering layer which covers an upper surface and a peripheral surface of the electronic element and which is adhered to the sealing layer so as to be present at an inner side of the adhesive layer when viewed in plan, wherein the sealing layer is formed so as to cover the resin substrate, the electronic element is formed on the sealing layer, and the part of the sealing structure which is removed includes a portion of the sealing layer present at an outer side of the element covering layer and at the inner side of the adhesive layer when viewed in plan. ### Claim 8 (depends on 1) The method for manufacturing an electronic device according to claim 1, the method further comprising: after the electronic element is formed and before the part of the sealing structure is removed, forming an element covering layer which covers an upper surface and a peripheral surface of the electronic element and which is adhered to the sealing layer so as to be present at an inner side of the adhesive layer when viewed in plan; and removing a portion of the element covering layer present on the portion of the sealing layer which is removed, wherein the sealing layer is formed so as to cover the resin substrate, the electronic element is formed on the sealing layer, and the part of the sealing structure which is removed includes a portion of the sealing layer present at an outer side of the electron element and at the inner side of the adhesive layer when viewed in plan. ### Claim 9 (depends on 1) The method for manufacturing an electronic device according to claim 1, wherein the resin substrate is a porous substrate including a plurality of pores therein, the sealing layer is formed so as to cover the resin substrate, and the part of the sealing structure which is removed includes a part of the sealing layer covering the resin substrate. ### Claim 10 (depends on 1) The method for manufacturing an electronic device according to claim 1, wherein the adhesive layer extends in a peripheral direction of the support substrate from the electronic element, the sealing layer is formed so as to cover the resin substrate, and the part of the sealing structure which is removed includes a portion of the sealing layer present at an outer side of the electronic element, the method further comprising: removing a portion of the adhesive layer present under the portion of the sealing layer which is removed. ### Claim 11 (depends on 1) The method for manufacturing an electronic device according to claim 1, wherein a thickness of the adhesive layer is smaller than a thickness of the resin substrate. ### Claim 12 (depends on 1) The method for manufacturing an electronic device according to claim 1, wherein a thickness of the adhesive layer is 5 μm or less. ### Claim 13 (depends on 1) The method for manufacturing an electronic device according to claim 1, wherein by removing the part of the sealing structure, the adhesive layer is partially exposed to moisture supplied to the adhesive layer. ### Claim 14 (depends on 1) The method for manufacturing an electronic device according to claim 1, wherein the electronic element is an organic electroluminescence element comprising two facing electrodes and an organic functional layer which is located between the two facing electrodes and which includes an organic electroluminescence light emitting layer. ### Claim 15 An electronic device comprising: a resin substrate including a first surface and a second surface opposite to the first surface; an adhesive layer arranged on the first surface of the resin substrate; a sealing layer arranged on the second surface of the resin substrate, and including a third surface in contact with the resin substrate and a fourth surface opposite to the third surface; an electronic element arranged on the fourth surface of the sealing layer; and an element sealing layer covering the electronic element, wherein the adhesive layer satisfies in accordance with an ASTM D570 test method, at least one selected from the group of a water absorption rate of 1.5% or more by water immersion at 23° C. for 24 hours and a water absorption rate of 1% or more in an equilibrium state at 50° C. and a relative humidity of 60%.