# US 9,437,806 B2 · Piezoelectric thin film, method of manufacturing the same, piezoelectric thin film manufacturing apparatus and liquid ejection head

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- Number: US 9,437,806 B2
- Document ID: US9437806B2
- Status: Granted
- Kind: B2
- Application number: 14/549,839
- Filed: 2014-11-21
- Published: 2015-06-04
- Granted: 2016-09-06
- Earliest claimed: 2013-12-02
- Assignees: Canon Kabushiki Kaisha
- Applicants: Canon Kabushiki Kaisha
- Inventors: Motokazu Kobayashi; Yoshinori Kotani; Naoyuki Koketsu
- Web page: https://patentgrep.com/patent/US9437806B2

## CPC

- B41J 2/14233: {of film type, deformed by bending and disposed on a diaphragm}
- B41J 2/161: {of film type, deformed by bending and disposed on a diaphragm}
- B41J 2/164: {thin film formation}
- B41J 2/1642: {thin film formation by CVD [chemical vapor deposition]}
- B41J 2/1646: {thin film formation by sputtering}
- H10N 30/074: by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N 30/077: by liquid phase deposition
- H10N 30/704: {based on piezoelectric or electrostrictive films or coatings}
- H10N 30/8554: {Lead-zirconium titanate [PZT] based}
- B41J 2002/1425: {Embedded thin film piezoelectric element}
- H10N 30/2047: {Membrane type}
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR

## Abstract

A piezoelectric thin film is manufactured by sequentially executing: a step of coating a substrate by applying a coating solution containing an organic solvent and a piezoelectric thin film precursor to form a coating layer; a step of evaporating the organic solvent from the coating layer in a windless environment to obtain a dried coating layer containing the piezoelectric thin film precursor; and a step of heating the dried coating layer to form a piezoelectric thin film from the dried coating layer containing the piezoelectric thin film precursor.

## Claims

### Claim 1

A piezoelectric thin film manufacturing method comprising:
a step of preparing a substrate having a coating layer formed thereon, the coating layer containing an organic solvent and a piezoelectric thin film precursor;
a step of obtaining a dried coating layer containing the piezoelectric thin film precursor by evaporating the organic solvent from the coating layer in a state where a shield plate is arranged between an exhaust port for expelling an exhaust of the evaporated organic solvent and the substrate; and
a step of heating the dried coating layer to form a piezoelectric thin film from the dried coating layer containing the piezoelectric thin film precursor.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the shield plate is arranged around the substrate so as to extend in a direction intersecting the substrate.

### Claim 3 (depends on 1)

The method according to claim 1, wherein the organic solvent is evaporated from the coating layer by heating a rear surface of the substrate in the step of obtaining the dried coating layer.
