# US 9,437,797 B2 · Cooling structure of heating element and power conversion device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,437,797 B2 - Document ID: US9437797B2 - Status: Granted - Kind: B2 - Application number: 14/818,962 - Filed: 2015-08-05 - Published: 2016-03-31 - Granted: 2016-09-06 - Earliest claimed: 2014-09-29 - Assignees: Hitachi, Ltd. - Applicants: Hitachi, Ltd. - Inventors: Daisuke Matsumoto; Akira Mima; Tetsuya Kawashima; Yuuichi Mabuchi; Yukio Hattori; Hiroshi Kamizuma; Ryouhei Miyagawa; Tomonori Ichikawa - Web page: https://patentgrep.com/patent/US9437797B2 ## CPC - H05K 7/209: {Heat transfer by conduction from internal heat source to heat radiating structure (H05K7/20909 takes precedence)} - H05K 7/20336: {Heat pipes, e.g. wicks or capillary pumps} - H05K 7/20409: {Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing} - H10N 10/17: characterised by the structure or configuration of the cell or thermocouple forming the device - H10N 10/81: Structural details of the junction - H10W 40/228: {the projecting parts being wire-shaped or pin-shaped} - H10W 40/60: Securing means for detachable heating or cooling arrangements, e.g. clamps - H10W 40/73: for cooling by change of state - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A cooling structure of a heating element includes: the heating element having at least one cooling surface from which a plurality of pin fins project; a heat receiving plate which has a shape complying with the cooling surface and in which holes are formed at positions facing each pin fin, each pin fin being movably inserted into the holes; a cooler which has a pair of clamping members that sandwich therebetween the heating element and the heat receiving plate while pressing the heating element and the heat receiving plate, and which cools the heat receiving plate; and a space securing part which is provided on the heat receiving plate and suppresses a distance between the pair of clamping members so as not to apply a pressing force by the clamping members to the heating element. ## Claims ### Claim 1 A cooling structure of a heating element, comprising: the heating element having at least one cooling surface from which a plurality of pin fins project; a heat receiving plate in which holes are formed at positions facing the pin fins, the pin fins being movably inserted into the holes; a cooler which has a pair of clamping members that sandwich therebetween the heat receiving plate while pressing the heat receiving plate, and which cools the heat receiving plate; and a space securing part which is provided on the heat receiving plate and suppresses a distance between the pair of clamping members so as not to apply a pressing force by the clamping members to the heating element. ### Claim 2 (depends on 1) The cooling structure of the heating element, according to claim 1, wherein the heating element has the cooling surface on two opposite surfaces thereof, and the heat receiving plate has a shape complying with the cooling surface on the two surfaces, the holes being formed at the positions facing each of the pin fins which project from the cooling surface on the two surfaces. ### Claim 3 (depends on 1) The cooling structure of the heating element, according to claim 1, further comprising a heat conducting agent filled between the pin fins and the heat receiving plate. ### Claim 4 (depends on 1) The cooling structure of the heating element, according to claim 1, wherein the distance between the pair of clamping members suppressed by the space securing part is greater than a thickness of the heating element inclusive of the pin fins. ### Claim 5 (depends on 1) The cooling structure of the heating element, according to claim 1, wherein each of the holes has a columnar shape. ### Claim 6 (depends on 1) The cooling structure of the heating element, according to claim 1, wherein some of the plurality of pin fins are movably inserted into one of the holes. ### Claim 7 (depends on 1) The cooling structure of the heating element, according to claim 1, wherein in the heat receiving plate, both of a hole into which some of the plurality of pin fins are movably inserted, and a hole into which one pin fin is movably inserted, are formed. ### Claim 8 (depends on 1) The cooling structure of the heating element, according to claim 1, wherein the cooler includes heat dissipating fins and heat pipes connected to the clamping members and the heat dissipating fins. ### Claim 9 (depends on 1) The cooling structure of the heating element, according to claim 1, wherein the cooler includes heat dissipating fins joined to the clamping members. ### Claim 10 (depends on 1) The cooling structure of the heating element, according to claim 1, wherein the cooler includes distribution channels for refrigerant joined to the clamping members, and heat dissipating fins joined to the distribution channels. ### Claim 11 A cooling structure of a heating element, comprising: the heating element having at least one cooling surface from which a plurality of pin fins project; a pair of clamping members in each of which holes are formed at positions facing the pin fins, the pin fins being movably inserted into the holes, the clamping members sandwiching therebetween the heating element; and a space securing part which suppresses a distance between the pair of clamping members so as not to apply a pressing force by the clamping members to the heating element. ### Claim 12 A power converter unit comprising a plurality of semiconductor devices for a power conversion device, each semiconductor device having cooling surfaces from which a plurality of pin fins project, on both opposite surfaces thereof, and having electric terminals on one side surface which abuts on the cooling surfaces; a plurality of heat receiving plates in each of which holes are formed at positions facing the pin fins, the pin fins being movably inserted into the holes, and each of which is attached to a corresponding one of the cooling surfaces; a plurality of coolers including a plurality of clamping members that sandwich therebetween the plurality of heat receiving plates while pressing the heat receiving plates, a plurality of heat dissipating fins that lie next to each other on the opposite side of the side surface having the electric terminals relative to each of the semiconductor devices for the power conversion device, and at least one heat pipe that connects the clamping members with a corresponding plurality of heat dissipating fins, the plurality of coolers cooling the plurality of heat receiving plates, respectively; and a plurality of space securing parts which are provided for each of the plurality of heat receiving plates and suppress distances between the clamping members so as not to apply a pressing force by the clamping members to the semiconductor devices for the power conversion device, wherein the side surfaces on which the plurality of semiconductor devices for the power conversion device have the electric terminals are arranged on the same plane, and cooling wind is fed by a blower to the plurality of heat dissipating fins from a reverse side of the same plane. ### Claim 13 (depends on 12) A power conversion device comprising a plurality of power converter units, each being the power converter unit according to claim 12, the plurality of power converter units being arranged side by side to allow the coolers to lie next to each other.