# US 9,437,791 B2 · Light emitting device package > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,437,791 B2 - Document ID: US9437791B2 - Status: Granted - Kind: B2 - Application number: 14/105,439 - Filed: 2013-12-13 - Published: 2014-06-19 - Granted: 2016-09-06 - Earliest claimed: 2012-12-14 - Assignees: LG Innotek Co., Ltd. - Applicants: LG Innotek Co., Ltd. - Inventors: Byung Mok Kim; Young Jin No; Bo Hee Kang; Hiroshi Kodaira - Web page: https://patentgrep.com/patent/US9437791B2 ## CPC - H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls - H10W 40/228: {the projecting parts being wire-shaped or pin-shaped} - H10W 70/635: {Through-vias} - H10W 70/655: Fan-out layouts - H10W 70/656: Fan-in layouts - H10W 70/685: comprising multiple insulating layers - H10W 72/01551: {Changing the shapes of bond wires} - H10W 72/075: {of bond wires} - H10W 72/5363: {the connected ends being wedge-shaped} - H10W 72/583: {Reinforcing structures} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Disclosed is a light emitting device package including a package body including at least one electrode pad disposed on a surface thereof, a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire, and a via hole electrode passing through the package body, wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, the light emitting device package further includes a bonding ball disposed on the stitch, and the via hole electrode non-overlaps the stitch and the bonding ball in a vertical direction. ## Claims ### Claim 1 A light emitting device package comprising: a package body including at least one electrode pad disposed on a surface thereof, the package body including at least one ceramic layer; a via hole electrode passing through the package body; a heat dissipation portion disposed in the package body; an anti-crack portion disposed on the heat dissipation portion and the at least one ceramic layer; and a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire, wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, and a bonding ball is disposed on the stitch, wherein the heat dissipation portion is made of a material different from a material of the package body, wherein a width of an upper surface of the heat dissipation portion is bigger than a width of a lower surface of the heat dissipation portion, wherein the package body includes a first ceramic layer, a second ceramic layer, and a third ceramic layer, wherein the second ceramic layer is the anti-crack portion, wherein the second ceramic layer is disposed with an opening on the third ceramic layer, wherein the light emitting device is disposed on an exposed region of the third ceramic layer, wherein the third ceramic layer is disposed between the first ceramic layer and the anti-crack portion, wherein a lower surface of the third ceramic layer contacts the heat dissipation portion and the first ceramic layer, and wherein an upper surface of the third ceramic layer contacts the anti-crack portion and the light emitting device. ### Claim 2 (depends on 1) The light emitting device package according to claim 1, wherein the via hole electrode non-overlaps the stitch and the bonding ball in a vertical direction. ### Claim 3 (depends on 1) The light emitting device package according to claim 1, wherein the wire has a diameter of 1/40 to 1.5/40 millimeters. ### Claim 4 (depends on 1) The light emitting device package according to claim 1, wherein the bonding ball comprises: a body contacting the stitch; and a tail disposed on the body. ### Claim 5 (depends on 1) The light emitting device package according to claim 1, wherein the stitch has a line width of 0.3 to 0.35 millimeters. ### Claim 6 (depends on 1) The light emitting device package according to claim 1, wherein a distance from the light emitting device to the via hole electrode is longer than a distance from the light emitting device to the electrode pad. ### Claim 7 (depends on 1) The light emitting device package according to claim 1, further comprising a wall portion of the package body. ### Claim 8 (depends on 1) The light emitting device package according to claim 1, wherein the via hole electrode is disposed in each of the ceramic layers. ### Claim 9 (depends on 1) The light emitting device package according to claim 1, wherein the via hole electrode is electrically connected to the electrode pad and the light emitting device is connected to the electrode pad through the wire. ### Claim 10 (depends on 1) The light emitting device package according to claim 1, wherein the via hole electrode is adjacent to an end of the package body. ### Claim 11 (depends on 1) The light emitting device package according to claim 1, wherein the via hole electrode is disposed on at least one portion of edges of the package body. ### Claim 12 (depends on 1) The light emitting device package according to claim 1, wherein a ratio of a diameter of the wire to a width of the electrode pad is 1:2 to 1:3. ### Claim 13 (depends on 1) The light emitting device package according to claim 1, wherein the via hole electrode comprises: a frame disposed at a periphery of the via hole electrode; and a conductive layer disposed in the frame. ### Claim 14 A light emitting device package comprising: a package body including at least one electrode pad disposed on a surface thereof; a heat dissipation portion disposed in the package body; a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire; and a wire electrically connected to the light emitting device and the electrode pad, wherein a bonding ball is disposed on the wire in regions in which the wire contacts the light emitting device and the electrode pad, wherein a recess is disposed on a surface of the electrode pad in a region in which the electrode pad contacts the wire, wherein the package body includes a first ceramic layer, a second ceramic layer, and a third ceramic layer, wherein the second ceramic layer is the anti-crack portion, wherein the second ceramic layer is disposed with an opening on the third ceramic layer, wherein the light emitting device is disposed on an exposed region of the third ceramic layer, wherein the third ceramic layer is disposed between the first ceramic layer and the anti-crack portion, wherein a lower surface of the third ceramic layer contacts the heat dissipation portion and the first ceramic layer, and wherein an upper surface of the third ceramic layer contacts the anti-crack portion and the light emitting device. ### Claim 15 (depends on 14) The light emitting device package according to claim 14, wherein the bonding ball comprises: a body contacting the wire; and a tail disposed on the body. ### Claim 16 (depends on 14) The light emitting device package according to claim 14, wherein a ratio of a diameter of the wire to a width of the electrode pad is 1:2 to 1:3. ### Claim 17 (depends on 14) The light emitting device package according to claim 14, wherein a diameter of the wire in regions in which the wire contacts the light emitting device and the electrode pad is longer than a diameter of the wire in other regions. ### Claim 18 (depends on 14) The light emitting device package according to claim 14, wherein the electrode pad includes a frame and a conductive layer disposed in the frame, and the conductive layer is disposed in a region corresponding to the bonding ball.