# US 9,437,787 B2 · Semiconductor light emitting device

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- Number: US 9,437,787 B2
- Document ID: US9437787B2
- Status: Granted
- Kind: B2
- Application number: 14/361,216
- Filed: 2013-05-29
- Published: 2014-12-04
- Granted: 2016-09-06
- Earliest claimed: 2012-06-18
- Assignees: Sharp Kabushiki Kaisha
- Applicants: Sharp Kabushiki Kaisha
- Inventors: Takeshi Kamikawa
- Web page: https://patentgrep.com/patent/US9437787B2

## CPC

- H10H 20/8512: {Wavelength conversion materials}
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10W 72/30: Die-attach connectors
- H10H 20/8506: {Containers}
- H10H 20/8515: {not being in contact with the bodies}
- H10H 20/856: Reflecting means
- H10H 20/8581: {characterised by their material}
- H10W 72/07554: {changes in dispositions}
- H10W 72/536: {the connected ends being ball-shaped}
- H10W 72/5363: {the connected ends being wedge-shaped}
- H10W 72/547: {Dispositions of multiple bond wires}
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor light emitting device includes: a semiconductor light emitting element including a transparent substrate; a reflective substrate on which the semiconductor light emitting element is mounted; an adhesive layer containing a fluorescent substance, for fixing the semiconductor light emitting element on the reflective substrate; and a sealing member containing a fluorescent substance, for sealing the semiconductor light emitting element. In the semiconductor light emitting device, the adhesive layer has a thickness equal to or smaller than average particle size of the fluorescent substance contained in the sealing member.

## Claims

### Claim 1

A semiconductor light emitting device, comprising:
a semiconductor light emitting element including a transparent substrate;
a substrate on which said semiconductor light emitting element is mounted;
an adhesive layer containing a fluorescent substance, for fixing said semiconductor light emitting element on said substrate; and
a sealing member containing a fluorescent substance, for sealing said semiconductor light emitting element; wherein
the fluorescent substance contained in the adhesive layer has an average particle diameter smaller than an average particle diameter of the fluorescent substance contained in the sealing member; and
said adhesive layer has a thickness equal to or smaller than an average particle diameter of said fluorescent substance contained in said sealing member.

### Claim 2 (depends on 1)

The semiconductor light emitting device according to claim 1, wherein
average particle diameter of the fluorescent substance contained in said adhesive layer is at most 200 nm.

### Claim 3 (depends on 2)

The semiconductor light emitting device according to claim 2, wherein
average particle diameter of the fluorescent substance contained in said adhesive layer is at most 100 nm.

### Claim 4 (depends on 1)

The semiconductor light emitting device according to claim 1, wherein
said substrate has a light reflecting surface; and
said semiconductor light emitting element is mounted on said light reflecting surface.

### Claim 5 (depends on 1)

The semiconductor light emitting device according to claim 1, wherein
the fluorescent substance contained in said adhesive layer emits fluorescent light having longer emission wavelength than the fluorescent substance contained in said sealing member.

### Claim 6 (depends on 1)

The semiconductor light emitting device according to claim 1, wherein
said transparent substrate is any of a sapphire substrate, a nitride-based semiconductor substrate and an SiC substrate.

### Claim 7 (depends on 1)

The semiconductor light emitting device according to claim 1 wherein
said adhesive layer is formed of silicone resin.