# US 9,437,716 B2 · Semiconductor device comprising a graphene wire

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- Number: US 9,437,716 B2
- Document ID: US9437716B2
- Status: Granted
- Kind: B2
- Application number: 14/803,751
- Filed: 2015-07-20
- Published: 2015-11-12
- Granted: 2016-09-06
- Earliest claimed: 2012-09-21
- Assignees: Kabushiki Kaisha Toshiba
- Applicants: Kabushiki Kaisha Toshiba
- Inventors: Makoto Wada; Yuichi Yamazaki; Akihiro Kajita; Atsunobu Isobayashi; Tatsuro Saito
- Web page: https://patentgrep.com/patent/US9437716B2

## CPC

- H10D 48/383: {Quantum effect devices, e.g. of devices using quantum reflection, diffraction or interference effects}
- B82Y 30/00: Nanotechnology for materials or surface science, e.g. nanocomposites
- H10W 20/43: Layouts of interconnections
- H10W 20/435: {Cross-sectional shapes or dispositions of interconnections}
- H10W 20/4462: {Carbon or carbon-containing materials, e.g. graphene}
- C01B 32/186: by chemical vapour deposition [CVD]
- Y10S 977/734: Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
- Y10S 977/932: for electronic or optoelectronic application
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- B82Y: SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- C01B: NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; {METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C}
- Y10S: TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

## Abstract

According to one embodiment, a semiconductor device includes a catalyst underlying layer formed on a substrate including semiconductor elements formed thereon and processed in a wiring pattern, a catalyst metal layer that is formed on the catalyst underlying layer and whose width is narrower than that of the catalyst underlying layer, and a graphene layer growing with a sidewall of the catalyst metal layer set as a growth origin and formed to surround the catalyst metal layer.

## Claims

### Claim 1

A semiconductor device comprising:
a metal layer provided above a substrate comprising a semiconductor element, the metal layer extending in a first longitudinal direction and having a convex cross-sectional surface in a plane perpendicular to the first longitudinal direction; and
a graphene layer provided on the metal layer to surround a side surface and an upper surface of a convex portion of the metal layer, the graphene layer having a curved cross-sectional surface and extending in the first longitudinal direction,
wherein the metal layer comprises a first portion which is flat and a second portion which is convex, and
wherein the second portion has a tapered shape whose widths of upper and lower surfaces are different, and has surface (111) alignment.

### Claim 2 (depends on 1)

The semiconductor device of claim 1, wherein the first portion is an underlying layer, and the second portion is a catalyst layer.

### Claim 3 (depends on 1)

The semiconductor device of claim 1, wherein an end portion of the graphene layer contacts at least one of an upper surface of the first portion and a side surface of the second portion.

### Claim 4 (depends on 1)

The semiconductor device of claim 1, wherein a facet is provided on a side surface of the second portion, and an end portion of the graphene layer contacts the facet.

### Claim 5 (depends on 1)

The semiconductor device of claim 1, wherein the upper surface of the second portion is narrower than the lower surface of the second portion.

### Claim 6 (depends on 1)

The semiconductor device of claim 1, wherein the graphene layer is formed in a roll shape.

### Claim 7 (depends on 6)

The semiconductor device of claim 6, wherein the metal layer comprises a first portion which is flat and a second portion which is convex, and a width of the first portion is set according to a required roll diameter of the graphene layer.

### Claim 8

A semiconductor device comprising:
a metal layer provided above a substrate comprising a semiconductor element, the metal layer extending in a first longitudinal direction; and
a graphene layer provided on the metal layer to surround a side surface and an upper surface of the metal layer, the graphene layer extending in the first longitudinal direction and having a convex cross-sectional surface with respect to the metal layer in a plane perpendicular to the first longitudinal direction,
wherein the metal layer comprises a first portion having a first width and including the upper surface, and a second portion which is provided on the first portion and which has a second width smaller than the first width, the second portion having a tapered shape whose widths of upper and lower surfaces are different, and has surface (111) alignment, and
wherein the graphene layer comprises a plurality of graphene sheets which are stacked, and a portion of end portions of the graphene sheets is in contact with the upper surface of the first portion of the metal layer.

### Claim 9 (depends on 8)

The semiconductor device of claim 8, wherein the first portion is an underlying layer, and the second portion is a catalyst layer.

### Claim 10 (depends on 8)

The semiconductor device of claim 8, wherein a facet is provided on a side surface of the second portion, and another portion of end portions of the graphene sheets is in contact with the facet.

### Claim 11 (depends on 8)

The semiconductor device of claim 8, wherein the upper surface of the second portion is narrower than the lower surface of the second portion.

### Claim 12 (depends on 8)

The semiconductor device of claim 8, wherein the graphene layer is formed in a roll shape.

### Claim 13 (depends on 12)

The semiconductor device of claim 12, wherein the width of the first portion is set according to a required roll diameter of the graphene layer.
