# US 9,437,671 B2 · Power and signal extender and related circuit board

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- Number: US 9,437,671 B2
- Document ID: US9437671B2
- Status: Granted
- Kind: B2
- Application number: 14/630,652
- Filed: 2015-02-25
- Published: 2016-06-02
- Granted: 2016-09-06
- Earliest claimed: 2014-11-27
- Assignees: Novatek Microelectronics Corp.
- Applicants: NOVATEK Microelectronics Corp.
- Inventors: Chia-Ta Lai
- Web page: https://patentgrep.com/patent/US9437671B2

## CPC

- H10D 99/00: Subject matter not provided for in other groups of this subclass
- H01P 3/08: Microstrips; Strip lines
- H10W 72/00: Interconnections or connectors in packages
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H01P: WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE (operating at optical frequencies G02B)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A power and signal extender, which is utilized on a circuit board for preventing a power or a signal on the circuit board from influencing an integrity of a ground plane on the circuit board, includes a first pin, coupled to a first transmission wire of the circuit board, for receiving the power or the signal from the first transmission wire; and a second pin, coupled to a second transmission wire of the circuit board, for outputting the power or the signal to the second transmission wire.

## Claims

### Claim 1

A power and signal extender, on a circuit board, for preventing a power or a signal on the circuit board from influencing an integrity of a ground plane on the circuit board, the power and signal extender comprising:
a first pin, coupled to a first transmission wire of the circuit board, for receiving the power or the signal from the first transmission wire; and
a second pin, coupled to a second transmission wire of the circuit board, for outputting the power or the signal to the second transmission wire;
wherein the circuit board is a double sided board, which comprises:
a first layer, for deploying the first transmission wire and the second transmission wire for transmitting the power or the signal; and
a second layer, for deploying the ground plane;
wherein the power and signal extender is coupled to the first layer, so that the power or the signal passes through the power and signal extender rather than passing through the second layer.

### Claim 2 (depends on 1)

The power and signal extender of claim 1, wherein the power and signal extender is inside a package, and the package comprises:
a substrate;
a third transmission wire, deployed on the substrate, for transmitting the power or the signal; and
a die, deployed on the substrate;
wherein the power and the signal do not pass through the die.

### Claim 3 (depends on 2)

The power and signal extender of claim 2, wherein the package is utilized for an active element or a passive element, and the first pin and the second pin are not required for operations of the active element or the passive element and are reserved in the package as a transmission path for transmitting the power or the signal inside the power and signal extender.

### Claim 4 (depends on 1)

The power and signal extender of claim 1, wherein the power and the signal do not undergo any signal processing in the power and signal extender.

### Claim 5

A circuit board, comprising:
a first transmission wire, for transmitting a power or a signal;
a second transmission wire, for transmitting the power or the signal; and
a power and signal extender, for preventing the power or the signal from influencing an integrity of a ground plane on the circuit board, the power and signal extender comprising:
a first pin, coupled to the first transmission wire, for receiving the power or the signal from the first transmission wire; and
a second pin, coupled to the second transmission wire, for outputting the power or the signal to the second transmission wire;
wherein the circuit board is a double sided board, which comprises:
a first layer, for deploying the first transmission wire and the second transmission wire for transmitting the power or the signal; and
a second layer, for deploying the ground plane;
wherein the power and signal extender is coupled to the first layer, so that the power or the signal passes through the power and signal extender rather than passing through the second layer.

### Claim 6 (depends on 5)

The circuit board of claim 5, wherein the power and signal extender is inside a package, and the package comprises:
a substrate;
a third transmission wire, deployed on the substrate, for transmitting the power or the signal; and
a die, deployed on the substrate;
wherein the power and the signal do not pass through the die.

### Claim 7 (depends on 6)

The circuit board of claim 6, wherein the package is utilized for an active element or a passive element, and the first pin and the second pin are not required for operations of the active element or the passive element and are reserved in the package as a transmission path for transmitting the power or the signal inside the power and signal extender.

### Claim 8 (depends on 5)

The circuit board of claim 5, wherein the power and the signal do not undergo any signal processing in the power and signal extender.