# US 9,437,653 B2 · Stress sensing devices and methods

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- Number: US 9,437,653 B2
- Document ID: US9437653B2
- Status: Granted
- Kind: B2
- Application number: 14/491,035
- Filed: 2014-09-19
- Published: 2015-01-01
- Granted: 2016-09-06
- Earliest claimed: 2010-03-01
- Assignees: Infineon Technologies AG
- Applicants: Infineon Technologies AG
- Inventors: Udo Ausserlechner; Mario Motz
- Web page: https://patentgrep.com/patent/US9437653B2

## CPC

- H10N 39/00: Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
- G01B 7/18: {using change in resistance}
- G01L 1/18: using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
- G01L 1/2293: {of the semi-conductor type}
- H10N 30/302: {Sensors}
- H10N 30/875: {Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins}
- H10N: ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- G01B: MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01L: MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE (weighing G01G)

## Abstract

Embodiments relate to stress sensors and methods of sensing stress. In an embodiment, a stress sensor comprises a vertical resistor. The vertical resistor can comprise, for example, an n-type resistor and can have various operating modes. The various operating modes can depend on a coupling configuration of terminals of the resistor and can provide varying piezo-coefficients with very similar temperature coefficients of resistances. Comparisons of resistances and piezo-coefficients in differing operating modes can provide a measure of mechanical stresses acting on the device.

## Claims

### Claim 1

A stress sensing device comprising:
a semiconductor substrate;
a layer arranged within the semiconductor substrate,
a plurality of contacts arranged on a first side of the layer, wherein
a first resistive element formed within the layer between a first pair of contacts of the plurality of contacts;
a second resistive element formed within the layer between a second pair of contacts of the plurality of contacts;
wherein the first resistive element and the second resistive element show a substantially identical response to temperature changes, and a ratio of the first and second resistive elements varies with applied mechanical stress.

### Claim 2 (depends on 1)

The stress sensing device according to claim 1, wherein the contacts of the first pair of contacts are arranged closer to each other than contacts of the second pair of contacts.

### Claim 3 (depends on 1)

The sensor device of claim 1, wherein the contacts are contact diffusions.

### Claim 4 (depends on 1)

The stress sensing device according to claim 1, wherein the first pair of contacts comprises at least one contact of the plurality of contacts that is different from the contacts of the second pair of contacts.

### Claim 5 (depends on 1)

The stress sensing device according to claim 1, wherein the contacts of the first pair of contacts are different from the contacts of the second pair of contacts.

### Claim 6 (depends on 1)

The stress sensing device according to claim 1, wherein the first resistive element is different from the second resistive element.

### Claim 7 (depends on 1)

The stress sensing device according to claim 1, wherein the layer is n-doped or p-doped.

### Claim 8 (depends on 1)

The stress sensing device according to claim 1 further comprising isolating trenches or cups.

### Claim 9 (depends on 1)

The stress sensing device according to claim 1, wherein the layer has a depth, and wherein contacts of the first pair of contacts are spaced apart at a distance smaller or substantially equal to the depth, while contacts of the second pair of contacts are spaced at a distance substantially larger than the depth.

### Claim 10 (depends on 9)

The stress sensing device according to claim 9, wherein for a current flowing through the second resistive element, a horizontal current contribution will dominate over a vertical current contribution.

### Claim 11 (depends on 10)

The stress sensing device according to claim 10, comprising a low ohmic layer in ohmic contact to the layer and arranged on the opposite side of the first side.

### Claim 12 (depends on 9)

The stress sensing device according to claim 9, wherein for a current flowing through the second resistive element, a vertical current contribution will dominate over a horizontal current contribution.

### Claim 13 (depends on 1)

The stress sensing device according to claim 1, wherein an isolating region is arranged on the first side of the layer between contacts of the first pair of contacts or between contacts of the second pair of contacts.

### Claim 14

A sensor device comprising:
a layer; and
at least three contacts spaced apart from one another in the layer, the at least three contacts being coupleable in a first configuration for a first operating mode of the sensor device in which a current in the layer has a first ratio of horizontal to vertical components with respect to a die surface, and
in a second configuration different from the first for a second operating mode of the sensor device in which a current in the layer has a second ratio of horizontal to vertical components, wherein a ratio of a resistance between at least two of the contacts in the first operating mode and a resistance between at least two of the contacts in the second operating mode is related to mechanical stress in the sensor device.

### Claim 15 (depends on 14)

The sensor device of claim 14, further comprising at least one isolation region, the at least one isolation region arranged between first and second ones of the at least three contacts or arranged between second and third ones of the at least three contacts.

### Claim 16 (depends on 15)

The sensor device of claim 15, wherein the at least one isolation region comprises isolation wells.

### Claim 17 (depends on 1)

The sensor device of claim 1, further comprising a buried layer under an active layer.

### Claim 18 (depends on 1)

The sensor device of claim 1, wherein the at least three contacts are arranged symmetrically about an axis in the layer.

### Claim 19 (depends on 1)

The sensor device of claim 1, wherein at least one of the at least three contacts is selected from the group consisting of: an n+S/D diffusion and an n-CMOS well.

### Claim 20 (depends on 1)

The sensor device of claim 1, wherein the sensor device is rotationally symmetrical.

### Claim 21 (depends on 1)

A method of sensing mechanical stress using the stress sensing device of claim 1, the method comprising comparing a resistance of the first resistive element with a resistance of the second resistive element, wherein the comparison result indicates an amount of mechanical stress.