# US 9,437,626 B2 · Millimetre wave integrated circuits with thin film transistors

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- Number: US 9,437,626 B2
- Document ID: US9437626B2
- Status: Granted
- Kind: B2
- Application number: 14/756,093
- Filed: 2015-08-03
- Published: 2016-01-07
- Granted: 2016-09-06
- Earliest claimed: 2013-09-09
- Applicants: Ishiang Shih; Cindy X. Qiu; Chunong Qiu; Yi-Chi Shih
- Inventors: Ishiang Shih; Cindy X. Qiu; Chunong Qiu; Yi-Chi Shih
- Web page: https://patentgrep.com/patent/US9437626B2

## CPC

- H10D 86/021: {of multiple TFTs}
- H10D 1/47: Resistors having no potential barriers
- H10D 1/68: Capacitors having no potential barriers
- H10D 30/673: {characterised by the shapes, relative sizes or dispositions of the gate electrodes}
- H10D 62/80: characterised by the materials
- H10D 86/411: {characterised by materials, geometry or structure of the substrates}
- H10D 86/423: {comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO}
- H10D 86/441: {Interconnections, e.g. scanning lines}
- H10D 86/481: {integrated with passive devices, e.g. auxiliary capacitors}
- H10D 86/60: wherein the TFTs are in active matrices
- H10D 99/00: Subject matter not provided for in other groups of this subclass
- H10P 14/3434: {being oxide semiconductor materials (Group IIB-VIA semiconductor materials H10P14/3424)}
- H10P 50/282: {of inorganic materials}
- H10P 95/00: Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
- H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

MMIC circuits with thin film transistors are provided without the need of grinding and etching of the substrate after the fabrication of active and passive components. Furthermore, technology for active devices based on non-toxic compound semiconductors is provided. The success in the MMIC methods and structures without substrate grinding/etching and the use of semiconductors without toxic elements for active components will reduce manufacturing time, decrease economic cost and environmental burden. MMIC structures are provided where the requirements for die or chip attachment, alignment and wire bonding are eliminated completely or minimized. This will increase the reproducibility and reduce the manufacturing time for the MMIC circuits and modules.

## Claims

### Claim 1

A fabrication method for a MMIC with a thin film transistor of a planar semiconductor channel layer, a thin film capacitor and a thin film resistor where post fabrication substrate grinding and etching is not needed comprises:
selecting a dielectric substrate;
depositing a first dielectric layer having a first dielectric layer thickness;
etching selectively portions of said first dielectric layer to form a first metal gate head portion cavity and a first capacitor electrode cavity;
depositing a first metal layer having a first metal layer thickness substantially greater than said first dielectric layer thickness;
performing a first chemical and mechanical polishing to create a first metal gate head portion and a first capacitor electrode, said first metal gate head portion and said first capacitor electrode are embedded in said first dielectric layer;
depositing a second dielectric layer with a second dielectric layer thickness;
etching selectively a portion of said second dielectric layer to form a first metal gate stem portion cavity;
depositing a second metal layer having a second metal layer thickness substantially greater than said second dielectric layer thickness;
performing a second chemical and mechanical polishing to create a first metal gate stem portion, said first metal gate stem portion is embedded in said second dielectric layer and is in direct electric contact with said first metal gate head portion;
depositing a third dielectric layer having a third dielectric layer thickness;
depositing and patterning a first thin film resistor layer having a first thin film resistor layer thickness;
depositing and patterning a first semiconductor channel layer having a first semiconductor channel layer thickness;
depositing and patterning a drain ledge layer and a source ledge layer having a ledge layer thickness and a ledge layer gap;
depositing and patterning a drain, a source and a second capacitor electrode, said second capacitor electrode overlaps at least a portion of said first capacitor electrode;
depositing and patterning a first resistor contact and a second resistor contact;
depositing a fourth dielectric layer for protection and passivation of said thin film transistor;
depositing a resistor dielectric layer for protection and passivation of said thin film resistor; and
depositing a back metal layer on a back side of said dielectric substrate to complete the fabrication processes of a MMIC.

### Claim 2 (depends on 1)

A fabrication method for a MMIC with a thin film transistor of a planar semiconductor channel layer, a thin film capacitor and a thin film resistor as defined in claim 1, wherein material of said first semiconductor channel layer is selected from a material group comprising: metal oxide, metal oxide nitride, metal nitride with metal being selected from a group of In, Zn, Sn, Ga and their alloys, deposition of said metal oxide, metal oxinitride and metal nitride may be achieved by sputtering, reactive sputtering, ion sputtering, MOCVD and MBE.

### Claim 3 (depends on 1)

A fabrication method for a MMIC with a thin film transistor of a planar semiconductor channel layer, a thin film capacitor and a thin film resistor as defined in claim 1, wherein material of said drain ledge layer and source ledge layer being selected from a group of metal oxide, metal oxide nitride and metal nitride, wherein said metal is selected from a group of In, Zn, Ga, Sn and their alloys, conductivity of said drain ledge layer and source ledge layer is controlled to be substantially high through adjusting stoichiometry or by impurity doping.

### Claim 4 (depends on 1)

A fabrication method for a MMIC with a thin film transistor of a planar semiconductor channel layer, a thin film capacitor and a thin film resistor as defined in claim 1, wherein said dielectric substrate is selected from a group comprising: alumina, silica glass and plastic.

### Claim 5 (depends on 1)

A fabrication method for a MMIC with a thin film transistor of a planar semiconductor channel layer, a thin film capacitor and a thin film resistor as defined in claim 1, wherein materials of said first dielectric layer, second dielectric layer, third dielectric layer, fourth dielectric layer and resistor dielectric layer is selected from a group of silicon oxide, silicon oxinitride, silicon nitride, hafnium oxide, aluminum oxide or their mixtures.

### Claim 6 (depends on 1)

A fabrication method for a MMIC with a thin film transistor of a planar semiconductor channel layer, a thin film capacitor and a thin film resistor as defined in claim 1, wherein said first thin film resistor layer is selected from a material group of tantalum oxide and nickel-chromium alloy.

### Claim 7 (depends on 1)

A fabrication method for a MMIC with a thin film transistor of a planar semiconductor channel layer, a thin film capacitor and a thin film resistor as defined in claim 1, sheet resistance of said first thin film resistor layer being regulated by controlling resistivity of said first thin film resistor layer and said first thin film resistor layer thickness.

### Claim 8 (depends on 1)

A fabrication method for a MMIC with a thin film transistor of a planar semiconductor channel layer, a thin film capacitor and a thin film resistor as defined in claim 1, capacitance of said thin film capacitor is defined by overlapping area of said first capacitor electrode and said second capacitor electrode, second dielectric layer thickness, third dielectric layer thickness and dielectric constant of said second and third dielectric layers.