# US 9,437,581 B2 · LED module

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- Number: US 9,437,581 B2
- Document ID: US9437581B2
- Status: Granted
- Kind: B2
- Application number: 14/404,092
- Filed: 2013-05-24
- Published: 2015-04-23
- Granted: 2016-09-06
- Earliest claimed: 2012-05-31
- Assignees: Panasonic Intellectual Property Management Co., Ltd.
- Applicants: Panasonic Intellectual Property Management Co., Ltd.
- Inventors: Yoji Urano; Akifumi Nakamura; Hayato Ioka; Ryoji Imai; Jun Goda; Toru Hirano; Masanori Suzuki; Hideaki Hyuga
- Web page: https://patentgrep.com/patent/US9437581B2

## CPC

- H10W 90/00: Package configurations
- H10H 20/8506: {Containers}
- H10H 20/851: Wavelength conversion means
- H10H 20/8515: {not being in contact with the bodies}
- H10H 20/853: characterised by their shape
- H10H 20/856: Reflecting means
- H10H 20/857: Interconnections, e.g. lead-frames, bond wires or solder balls
- F21K 9/27: Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
- F21S 8/02: of recess-mounted type, e.g. downlighters (specially adapted for vehicle exteriors F21S41/00-F21S45/00)
- F21Y 2115/10: Light-emitting diodes [LED]
- H10H 20/882: {Scattering means (H10H20/82 takes precedence)}
- H10W 72/01515: {Forming coatings}
- H10W 72/075: {of bond wires}
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- F21K: NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21S: NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21Y: INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED

## Abstract

The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.

## Claims

### Claim 1

An LED module comprising:
a light-diffusing substrate having light-transmissive properties;
at least one LED chip bonded to a first surface of the light-diffusing substrate with a transparent first bond in-between;
a color converter facing the first surface to cover the at least one LED chip; and
a mounting substrate,
the color converter comprising a transparent material containing phosphor which, when excited by light emitted from the at least one LED chip, emits light having a different color from the at least one LED chip, and
a diffuse reflection layer diffusely reflecting light emitted from the at least one LED chip and light emitted from the phosphor, and the diffuse reflection layer being positioned facing a second surface of the light-diffusing substrate, wherein:
the light-diffusing substrate includes a first ceramic layer on top of a porous layer comprising a ceramic and a glass component, and the light-diffusing substrate includes a surface and an interior and has a planar size greater than a planar size of the at least one LED chip, and
a plurality of rays of light emitted from the at least one LED chip toward the light-diffusing substrate are diffused by the interior of the light-diffusing substrate and emerge outside through a peripheral part of the first surface of the light-diffusing substrate.

### Claim 2 (depends on 1)

The LED module of claim 1, wherein:
the at least one LED chip includes a face in a thickness direction and a first electrode and a second electrode which are connected to the face;
the mounting substrate includes a patterned wiring conductor electrically connected to the first electrode and the second electrode of the at least one LED chip through respective wires, and a resin part placed facing a rear face of the patterned wiring conductor;
the patterned wiring conductor is opaque;
the resin part has electrically-insulating properties;
the diffuse reflection layer faces a front face of the patterned wiring conductor;
the diffuse reflection layer includes through holes allowing passage of respective second ends of the wires having first ends respectively bonded to the first electrode and the second electrode.

### Claim 3 (depends on 2)

The LED module of claim 2, wherein the patterned wiring conductor covers most of a surface of the resin part close to the light-diffusing substrate; and
the diffuse reflection layer covers most of the patterned wiring conductor in a plan view.

### Claim 4 (depends on 1)

The LED module of claim 1, wherein:
the at least one LED chip includes a face in a thickness direction and a first electrode and a second electrode which are connected to the face;
the mounting substrate includes a patterned wiring conductor electrically connected to the first electrode and the second electrode of the at least one LED chip through respective wires, and a resin part placed facing a rear face of the patterned wiring conductor;
the patterned wiring conductor is opaque;
the resin part has electrically-insulating properties; and
the diffuse reflection layer faces the second surface of the light-diffusing substrate, and an opposite side of the diffuse reflection layer from the light-diffusing substrate is bonded to a front face of the patterned wiring conductor by a transparent second bond.