# US 9,437,579 B2 · Multiple die face-down stacking for two or more die

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- Number: US 9,437,579 B2
- Document ID: US9437579B2
- Status: Granted
- Kind: B2
- Application number: 14/689,346
- Filed: 2015-04-17
- Published: 2015-08-06
- Granted: 2016-09-06
- Earliest claimed: 2011-04-21
- Assignees: Tessera, Inc.
- Applicants: Tessera, Inc.
- Inventors: Belgacem Haba; Wael Zohni; Richard Dewitt Crisp; Ilyas Mohammed; Frank Lambrecht
- Web page: https://patentgrep.com/patent/US9437579B2

## CPC

- H10W 90/00: Package configurations
- H10W 70/20: Conductive package substrates serving as an interconnection, e.g. metal plates (leadframes H10W70/40)
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/68: Shapes or dispositions thereof
- H10W 72/701: {Tape-automated bond [TAB] connectors}
- H10W 72/853: {On the same surface}
- H10W 72/865: {Die-attach connectors and bond wires}
- H10W 72/9445: {Top-view layouts, e.g. mirror arrays}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/117: {the substrate having spherical bumps for external connection}
- H10W 80/743: {having disposition changed during the connecting}
- H10W 90/20: Configurations of stacked chips
- H10W 90/24: at least one of the stacked chips being laterally offset from a neighbouring stacked chip, e.g. chip stacks having a staircase shape
- H10W 90/288: {characterised by arrangements for thermal management of the stacked chips}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A microelectronic assembly can include a substrate having first and second surfaces each extending in first and second transverse directions, a peripheral edge extending in the second direction, first and second openings extending between the first and second surfaces, and a peripheral region of the second surface extending between the peripheral edge and one of the openings. The assembly can also include a first microelectronic element having a front surface facing the first surface, a rear surface opposite therefrom, and an edge extending between the front and rear surfaces. The assembly can also include a second microelectronic element having a front surface facing the rear surface of the first microelectronic element and projecting beyond the edge of the first microelectronic element. The assembly can also include a plurality of terminals exposed at the second surface, at least one of the terminals being disposed at least partially within the peripheral region.

## Claims

### Claim 1

A microelectronic assembly, comprising:
a substrate having first and second opposed surfaces each extending in first and second transverse directions, the substrate having first and second dielectric elements spaced apart from one another in at least one of the first or second transverse directions;
an opening defined by an open area between adjacent opposed edges of the first and second dielectric elements, the adjacent opposed edges each having a first dimension extending in the first direction, the opening having a second dimension in the second direction shorter than the first dimension;
a microelectronic element having a front surface, a rear surface opposite from the front surface, and bond pads at the front surface, one of the front or rear surfaces facing toward the first surface; and
a plurality of terminals exposed at the second surface and electrically connected with the bond pads of the microelectronic element, the terminals configured for connecting the microelectronic assembly to at least one component external to the assembly.

### Claim 2 (depends on 1)

The microelectronic assembly of claim 1, wherein the substrate further includes a dielectric region extending between the adjacent opposed edges of the first and second dielectric elements, the first surface of the substrate including a top surface of the dielectric region, the second surface including a bottom surface of the dielectric region.

### Claim 3 (depends on 1)

The microelectronic assembly of claim 1, wherein the dielectric region has a higher Young's modulus in a plane of the substrate than the dielectric elements.

### Claim 4 (depends on 1)

The microelectronic assembly of claim 1, wherein the front surface of the microelectronic element faces toward the first surface, and the bond pads at the front surface of the microelectronic element are aligned with the opening.

### Claim 5 (depends on 1)

The microelectronic assembly of claim 1, wherein the terminals include first and second terminals exposed at the bottom surface of the respective first and second dielectric elements, and wherein at least some of the bond pads of the microelectronic element are electrically connected to the first and second terminals.

### Claim 6 (depends on 1)

The microelectronic assembly of claim 1, wherein the microelectronic element at least partially overlies the top surface of each of the first and second dielectric elements.

### Claim 7 (depends on 1)

The microelectronic assembly of claim 1, wherein the microelectronic has first and second opposed edges, and the microelectronic element has at least one row of five or more of the bond pads extending in the first direction in a central region of the front surface thereof, each central region extending a middle third of a distance between the respective first and second edges.

### Claim 8 (depends on 1)

The microelectronic assembly of claim 1, wherein the substrate has a peripheral edge extending between the first and second surfaces and in the second direction and a peripheral region of the second surface extending between the peripheral edge and the opening, and
wherein at least one of the terminals is disposed at least partially within the peripheral region such that a straight line extending in the first direction and passing through the at least one terminal passes through or over the opening.

### Claim 9 (depends on 8)

The microelectronic assembly of claim 8, wherein the peripheral edge is a first peripheral edge, the peripheral region is a first peripheral region, and the at least one of the terminals is a first terminal,
wherein the substrate has a second peripheral edge opposite the first peripheral edge extending between the first and second surfaces and in the second direction, and the substrate has a second peripheral region of the second surface extending between the second peripheral edge and the opening, and
wherein at least one of the terminals is a second terminal disposed at least partially within the second peripheral region such that a straight line extending in the first direction and passing through the second terminal passes through or over the opening.

### Claim 10 (depends on 9)

The microelectronic assembly of claim 9, wherein the first dielectric element includes portions of both the first and second peripheral regions.

### Claim 11 (depends on 10)

The microelectronic assembly of claim 10, wherein the second dielectric element includes portions of both the first and second peripheral regions.

### Claim 12 (depends on 1)

The microelectronic assembly of claim 1, wherein the bond pads of the microelectronic element are electrically connected to the terminals by leads having portions aligned with the opening.

### Claim 13 (depends on 12)

The microelectronic assembly of claim 12, wherein the leads include wire bonds extending through the opening.

### Claim 14 (depends on 1)

A system comprising a microelectronic assembly according to claim 1 and one or more other electronic components electrically connected to the microelectronic assembly.

### Claim 15 (depends on 14)

The system of claim 14, further comprising a housing, the microelectronic assembly and the other electronic components being mounted to the housing.