# US 9,437,577 B2 · Package on package structure with pillar bump pins and related method thereof

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- Number: US 9,437,577 B2
- Document ID: US9437577B2
- Status: Granted
- Kind: B2
- Application number: 14/273,553
- Filed: 2014-05-09
- Published: 2015-11-12
- Granted: 2016-09-06
- Earliest claimed: 2014-05-09
- Assignees: Mediatek Inc.
- Applicants: Mediatek Inc.
- Inventors: Wen-Sung Hsu; Shih-Chin Lin
- Web page: https://patentgrep.com/patent/US9437577B2

## CPC

- H10W 90/00: Package configurations
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/811: {Multiple chips on leadframes}
- H10W 70/40: Leadframes
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/07236: {Soldering or alloying}
- H10W 72/07254: {changes in dispositions}
- H10W 72/242: {relative to the surface, e.g. recessed, protruding}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/726: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A package on package (POP) structure includes at least a first package and a second package. The first package has a plurality of pillar bump pins. The second package has a plurality of pads connected to the pillar bump pins, respectively. A method of forming a package on package (POP) structure includes at least the following steps: providing a first package with a plurality of pillar bump pins; providing a second package with a plurality of pads; and forming the POP structure by connecting the pillar bump pins to the pads.

## Claims

### Claim 1

A package on package (POP) structure, comprising:
a first package, having a plurality of pillar bump pins; and
a second package, having a plurality of pads connected to the pillar bump pins, respectively, having at least one die inside, wherein a middle part of one of the pillar bump pins is pillar and a top part of the pillar bump pin is an elongated bump, and the top part of the one of the pillar bump pins is formed before the first package is connected to the second package; and the plurality of pillar bump pins are not overlaid with the at least one die of the second package.

### Claim 2 (depends on 1)

The POP structure of claim 1, wherein the pillar bump pins are copper pillar bump pins.

### Claim 3 (depends on 1)

The POP structure of claim 1, wherein the first package is for a memory die.

### Claim 4 (depends on 1)

The POP structure of claim 1, wherein the second package is a no-lead package.

### Claim 5 (depends on 1)

The POP structure of claim 1, wherein the second package is a leadframe package.

### Claim 6

A method of forming a package on package (POP) structure, comprising:
providing a first package with a plurality of pillar bump pins, wherein a middle part of one of the pillar bump pins is pillar and a top part of the pillar bump pin is an elongated bump;
providing a second package with a plurality of pads, wherein the second package has at least one die inside; and
forming the POP structure by connecting the pillar bump pins to the pads;
wherein the top part of the one of the pillar bump pins is formed before the first package is connected to the second package; and the plurality of pillar bump pins are not overlaid with the at least one die of the second package.

### Claim 7 (depends on 6)

The method of claim 6, wherein the pillar bump pins are copper pillar bump pins.

### Claim 8 (depends on 6)

The method of claim 6, wherein the first package is for a memory die.

### Claim 9 (depends on 6)

The method of claim 6, wherein the second package is a no-lead package.

### Claim 10 (depends on 6)

The method of claim 6, wherein the second package is a leadframe package.