# US 9,437,571 B2 · Bonding device

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- Number: US 9,437,571 B2
- Document ID: US9437571B2
- Status: Granted
- Kind: B2
- Application number: 14/547,912
- Filed: 2014-11-19
- Published: 2015-06-18
- Granted: 2016-09-06
- Earliest claimed: 2013-12-12
- Assignees: Shibuya Kogyo Co., Ltd.
- Applicants: Shibuya Kogyo Co., Ltd.
- Inventors: Hiroyuki Yasuyoshi; Eiji Tanaka
- Web page: https://patentgrep.com/patent/US9437571B2

## CPC

- B23K 3/02: Soldering irons; Bits
- B23K 26/06: Shaping the laser beam, e.g. by masks or multi-focusing
- B29C 65/1664: {making use of several radiators}
- B23K 2101/36: Electric or electronic devices
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07178: {Means for aligning}
- H10W 72/07235: {Applying EM radiation, e.g. induction heating or using a laser}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A bonding device includes: a plurality of laser oscillators that oscillate laser beams; a plurality of guide beam parts that guide the laser beams oscillated from the laser oscillators; a bonding tool that is irradiated and heated by the laser beams guided from the guide beam parts so that an electronic part held on the bonding tool is heated by the laser beams and is bonded to a base plate. The bonding tool is segmented into a plurality of heat regions, each of the heat regions is irradiated by the laser beams that are guided through the guide beam parts so that some of the heat regions are heated at a temperature different from other heat regions, and an insulation part is disposed at a middle section between two of the heat regions, the insulation part suppressing a heat transfer between the heat regions.

## Claims

### Claim 1

A bonding device, comprising:
a plurality of laser oscillators that oscillate laser beams;
a plurality of guide beam parts that guide the laser beams oscillated from the laser oscillators;
a bonding tool that is irradiated and heated by the laser beams guided from the guide beam parts so that an electronic part held on the bonding tool is heated by the laser beams and is bonded to a base plate, wherein
the bonding tool is segmented into a plurality of heat regions,
each of the heat regions is irradiated by the laser beams that are guided through the guide beam parts so that some of the heat regions are heated at a temperature different from other heat regions,
the electronic part is in a polygon shape having a plurality of corners,
the heat regions are segmented into corner regions, outer regions and inner regions, the corner regions that correspond to the corners, the outer regions that are at an outer side and other than the corner regions, and the inner regions that are at an inner side, and
laser outputs of the laser oscillators for the inner regions, the outer regions and the corner regions are set to satisfy that
the laser output for the inner regions is smaller than that for the outer regions, and
the laser output for the outer regions is smaller than that for the corner regions, and
an insulation part is disposed at a middle section between two of the heat regions, the insulation part suppressing a heat transfer between the heat regions.

### Claim 2 (depends on 1)

The bonding device of claim 1, wherein
the insulation part is shaped as a groove formed on the bonding tool.

### Claim 3 (depends on 2)

The bonding device of claim 2, wherein
the bonding tool has a chip suck path that is a hole through which a negative pressure is imported so that the electronic part is sucked and held by the negative pressure on the bonding tool, and
when the electronic part is sucked on the bonding tool, the groove as the insulation part becomes airtight by the electronic part, and is communicatively connected to the chip suck path.

### Claim 4 (depends on 1)

The bonding device of claim 1, wherein
the heat regions are further segmented into corner adjacent regions that surround the corner regions,
laser output of the laser oscillators for the corner adjacent regions is set to be above the laser output for the outer regions and below the laser output for the corner regions.