# US 9,437,564 B2 · Interconnect structure and method of fabricating same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 9,437,564 B2
- Document ID: US9437564B2
- Status: Granted
- Kind: B2
- Application number: 13/937,599
- Filed: 2013-07-09
- Published: 2015-01-15
- Granted: 2016-09-06
- Earliest claimed: 2013-07-09
- Assignees: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicants: Taiwan Semiconductor Manufacturing Company, Ltd.
- Inventors: Wen-Hsiung Lu; Hsuan-Ting Kuo; Cheng-Ting Chen; Ai-Tee Ang; Ming-Da Cheng; Chung-Shi Liu
- Web page: https://patentgrep.com/patent/US9437564B2

## CPC

- H10W 74/137: {the encapsulations being directly on the semiconductor body (H10W74/134 takes precedence)}
- H10W 74/017: {Auxiliary layers for moulds, e.g. release layers or layers preventing residue}
- H10W 74/147: {the encapsulations being multilayered}
- H10W 70/60: Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40)
- H10W 72/012: {of bump connectors, dummy bumps or thermal bumps}
- H10W 72/072: {of bump connectors}
- H10W 72/07236: {Soldering or alloying}
- H10W 72/223: {characterised by the structure of the outermost layers, e.g. multilayered coatings}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/242: {relative to the surface, e.g. recessed, protruding}
- H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/245: {of outermost layers of multilayered bumps, e.g. bump coating being only on a part of a bump core}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/255: {of outermost layers of multilayered bumps, e.g. material of a coating}
- H10W 72/283: {Reinforcing structures, e.g. bump collars}
- H10W 72/29: Bond pads specially adapted therefor
- H10W 72/922: {Bond pads being integral with underlying chip-level interconnections}
- H10W 72/9223: {with redistribution layers [RDL]}
- H10W 72/923: {Bond pads having multiple stacked layers}
- H10W 72/9415: {relative to the surface, e.g. recessed, protruding}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A structure comprises a passivation layer formed over a semiconductor substrate, a connection pad enclosed by the passivation layer, a redistribution layer formed over the passivation layer, wherein the redistribution layer is connected to the connection pad, a bump formed over the redistribution layer, wherein the bump is connected to the redistribution layer and a molding compound layer formed over the redistribution layer. The molding compound layer comprises a flat portion, wherein a bottom portion of the bump is embedded in the flat portion of the molding compound layer and a protruding portion, wherein a middle portion of the bump is surrounded by the protruding portion of the molding compound layer.

## Claims

### Claim 1

A structure comprising:
a passivation layer formed over a semiconductor substrate;
a connection pad enclosed by the passivation layer;
a redistribution layer formed over the passivation layer, wherein the redistribution layer is directly connected to the connection pad, the redistribution layer being a topmost metallization layer;
a bump directly connected to the redistribution layer, the bump being a sphere, the bump physically contacting the redistribution layer from a first contact edge of the bump to a second contact edge of the bump, the second contact edge being opposite the first contact edge, the redistribution layer having a planar top surface extending from the first contact edge of the bump to the second contact edge of the bump, wherein the bump comprises:
a solder ball;
a metal coating layer formed over the solder ball, the metal coating layer having a thickness in a range from about 2 um to about 20 um; and
a solder layer formed over the metal coating layer, the solder layer physically contacting the redistribution layer; and
a molding compound layer formed over the redistribution layer, wherein the molding compound layer comprises:
a flat portion, and wherein a bottom portion of the bump is embedded in the flat portion of the molding compound layer; and
a protruding portion, and wherein a middle portion of the bump is surrounded by the protruding portion of the molding compound layer, and wherein the protruding portion of the molding compound layer and the flat portion of the molding compound layer form an angle in a range from about 10 degrees to about 60 degrees.

### Claim 2 (depends on 1)

The structure of claim 1, further comprising:
a first polymer layer formed between the passivation layer and the redistribution layer.

### Claim 3 (depends on 1)

The structure of claim 1, further comprising:
a second polymer layer formed between the redistribution layer and the molding compound layer, the second polymer layer physically contacting the redistribution layer, wherein:
the bump is partially embedded in the second polymer layer, the second polymer layer physically contacting the bump.

### Claim 4 (depends on 1)

The structure of claim 1, wherein:
the metal coating layer is a copper coating layer.

### Claim 5 (depends on 1)

The structure of claim 1, wherein:
the flat portion of the molding compound layer is of a thickness in a range from about 50 um to about 350 um.

### Claim 6

A method comprising:
forming a passivation layer over a semiconductor substrate, wherein a metal pad is embedded in the passivation layer and exposed through an opening of the passivation layer;
depositing a first polymer layer on the passivation layer;
forming a redistribution layer over the first polymer layer;
mounting a bump over the redistribution layer and electrically coupled to the redistribution layer;
forming a liquid molding compound layer over the passivation layer, wherein the bump is embedded in the liquid molding compound layer; and
pressing the liquid molding compound layer until a portion of a release film is lower than a top surface of the bump.

### Claim 7 (depends on 6)

The method of claim 6, further comprising:
curing the liquid molding compound layer to form a molding compound layer.

### Claim 8 (depends on 6)

The method of claim 6, further comprising:
depositing a second polymer layer over the passivation layer;
applying a patterning process to the second polymer layer to form an opening;
forming a seed layer over the opening;
forming an under bump metallization structure over the seed layer; and
mounting the bump over the under bump metallization structure.

### Claim 9 (depends on 6)

The method of claim 6, further comprising:
mounting the bump on the redistribution layer through a first reflow process.

### Claim 10 (depends on 6)

The method of claim 6, further comprising:
bonding the semiconductor substrate on a packaging substrate through a second flow process, wherein the bump and a pad on the packaging substrate form a joint structure.

### Claim 11 (depends on 10)

The method of claim 10, wherein:
a ratio of a diameter of the bump to a length of the pad is in a range from about 1 to about 1. 2.

### Claim 12 (depends on 6)

The method of claim 6, wherein:
the bump is a solder ball comprising a copper coating layer.

### Claim 13

A device comprising:
an interconnect structure over a substrate;
a passivation layer over the interconnect structure, wherein a metal pad is embedded in the passivation layer and exposed through an opening of the passivation layer;
a first dielectric layer formed over the passivation layer;
a post passivation interconnect structure formed in the first dielectric layer, wherein the post passivation interconnect structure is directly connected to the metal pad;
a bump directly mounted to the post passivation interconnect structure, the bump being a sphere, wherein the bump comprises:
a solder ball;
a metal coating layer formed over the solder ball, the metal coating layer having a thickness in a range from about 2 um to about 20 um; and
a solder layer formed over the metal coating layer, the solder layer physically contacting the post passivation interconnect structure, the post passivation interconnect structure contacting the solder layer having a first material composition, the post passivation interconnect structure in the first dielectric layer having the first material composition;
a second dielectric layer physically contacting the post passivation interconnect structure and the first dielectric layer, the second dielectric layer surrounding and physically contacting a lower portion of the bump;
a molding compound layer formed over the second dielectric layer, wherein the molding compound layer comprises:
a flat portion, and wherein a bottom portion of the bump is embedded in the flat portion; and
a protruding portion, and wherein a middle portion of the bump is surrounded by the protruding portion , and wherein the protruding portion of the molding compound layer and the flat portion of the molding compound layer form an angle in a range from about 10 degrees to about 60 degrees.

### Claim 14 (depends on 13)

The device of claim 13, wherein:
the interconnect structure comprises a plurality of metallization layers formed between the substrate and the metal pad.

### Claim 15 (depends on 14)

The device of claim 14, wherein:
a top metal line of a top metallization layer is electrically coupled to the metal pad.

### Claim 16 (depends on 13)

The device of claim 13, wherein:
the first dielectric layer is a first polymer layer comprising PBO.

### Claim 17

A method comprising:
forming a passivation layer over a semiconductor substrate, wherein a metal pad is embedded in the passivation layer and exposed through an opening of the passivation layer;
depositing a first polymer layer on the passivation layer;
forming a redistribution layer over the first polymer layer;
mounting a bump over the redistribution layer and electrically coupled to the redistribution layer;
forming a molding compound layer over the passivation layer, wherein the bump is embedded in the molding compound layer; and
pressing the molding compound layer until a portion of a release film is lower than a top surface of the bump, wherein after the pressing the molding compound layer, the molding compound layer has a protruding portion proximate and surrounding the bump, the protruding portion being surrounding by a flat portion of the molding compound layer.

### Claim 18 (depends on 17)

The method of claim 17, further comprising:
curing the molding compound layer.

### Claim 19 (depends on 17)

The method of claim 17, wherein the protruding portion of the molding compound layer and the flat portion of the molding compound layer form an angle in a range from about 10 degrees to about 60 degrees.

### Claim 20 (depends on 17)

The method of claim 17 further comprising:
removing the release film from the bump, wherein after the removing the release film, a portion of the bump is exposed through the protruding portion of the molding compound layer.

### Claim 21 (depends on 17)

The method of claim 17, wherein the bump further comprises:
a solder ball;
a metal coating layer formed over the solder ball, the metal coating layer having a thickness in a range from about 2 um to about 20 um; and
a solder layer formed over the metal coating layer.