# US 9,437,559 B2 · High-frequency module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,437,559 B2 - Document ID: US9437559B2 - Status: Granted - Kind: B2 - Application number: 14/686,922 - Filed: 2015-04-15 - Published: 2015-08-06 - Granted: 2016-09-06 - Earliest claimed: 2012-12-07 - Assignees: Murata Manufacturing Co., Ltd. - Applicants: Murata Manufacturing Co., Ltd. - Inventors: Yuki Wakabayashi - Web page: https://patentgrep.com/patent/US9437559B2 ## CPC - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H04B 5/77: for interrogation - H05K 1/0218: {by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence)} - H05K 1/0243: {Printed circuits associated with mounted high frequency components} - H05K 1/11: Printed elements for providing electric connections to or between printed circuits - H05K 1/181: associated with surface mounted components - H10W 70/611: {for connecting multiple chips together} - H10W 70/635: {Through-vias} - H10W 90/00: Package configurations - H05K 1/0298: {Multilayer circuits} - H05K 2201/09354: Ground conductor along edge of main surface - H05K 2201/09618: Via fence, i.e. one-dimensional array of vias - H10W 44/209: {Vertical interconnections, e.g. vias} - H10W 44/234: {Arrangements for impedance matching} - H10W 44/248: {for antennas} - H10W 70/685: comprising multiple insulating layers - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H04B: TRANSMISSION - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract A high-frequency module includes a laminate, a bottom surface electrode, and internal electrodes that provide grounding. The bottom surface electrode is provided on a bottom surface of the laminate. The laminate includes a wiring region through which wiring of a high-frequency circuit passes. The internal electrodes that provide grounding are provided between layers of the laminate and connected to the bottom surface electrode, respectively. The internal electrodes that provide grounding each include a line including ends extending outside of the wiring region along an outer edge of the laminate. The internal electrodes that provide grounding are endlessly continuous with each other when seen in a lamination direction of the laminate. ## Claims ### Claim 1 A high-frequency module comprising: a laminate including a plurality of base materials, the plurality of base materials being stacked on each other in a lamination direction; a plurality of bottom surface electrodes configured to provide grounding provided on one principal surface of the laminate in the lamination direction; a high-frequency circuit electrically connected to at least any of the bottom surface electrodes, a portion of the high-frequency circuit being provided inside the laminate; and a plurality of internal electrodes configured to provide grounding, each of the plurality of internal electrodes being provided on a respective one of the plurality of base materials of the laminate; wherein the plurality of internal electrodes are electrically connected to respective ones of the plurality of bottom surface electrodes; each of the plurality of internal electrodes has a line shape including ends and extends outside of the high-frequency circuit along an outer periphery of the laminate; each of the plurality of internal electrodes extends along less than an entirety of the outer periphery of the laminate when seen in the lamination direction such that a portion of each of the respective ones of the plurality of base materials is in direct contact with a portion of another one of the plurality of base materials along the outer periphery of the laminate; and the plurality of internal electrodes in combination extend along the entirety of the outer periphery of the laminate when seen in the lamination direction. ### Claim 2 (depends on 1) The high-frequency module according to claim 1, wherein the high-frequency circuit includes a surface mount element mounted on another principal surface opposite to the one principal surface of the laminate; and the bottom surface electrodes overlap with the high-frequency circuit when seen in the lamination direction. ### Claim 3 (depends on 1) The high-frequency module according to claim 1, wherein end portions of the respective plurality of internal electrodes overlap with each other at corner portions of the laminate when seen in the lamination direction. ### Claim 4 (depends on 1) The high-frequency module according to claim 1, wherein the laminate is a cube including first, second, third and fourth base materials; and the plurality of internal electrodes includes: a first internal electrode provided on the first base material along a first side of the laminate when seen in the lamination direction; a second internal electrode provided on the second base material along a second side perpendicular or substantially perpendicular to the first side; a third internal electrode provided on the third base material along a third side perpendicular or substantially perpendicular to the second side; and a fourth internal electrode provided on the fourth base material along a fourth side perpendicular or substantially perpendicular to the third side. ### Claim 5 (depends on 4) The high-frequency module according to claim 4, wherein the first base material, the second base material, the third base material, and the fourth base material are arrayed in the lamination direction in order according to the described order. ### Claim 6 (depends on 1) The high-frequency module according to claim 1, wherein the laminate is a cube including first and second base materials; and the plurality of internal electrodes includes: a first internal electrode provided on the first base material along a first side of the laminate when seen in the lamination direction; a second internal electrode provided on the second base material along a second side perpendicular or substantially perpendicular to the first side; a third internal electrode provided on the first base material along a third side perpendicular or substantially perpendicular to the second side; and a fourth internal electrode provided on the second base material along a fourth side perpendicular or substantially perpendicular to the third side. ### Claim 7 (depends on 1) The high-frequency module according to claim 1, wherein the laminate is a cube including first and second base materials; and the plurality of internal electrodes includes: a first internal electrode provided on the first base material along a first side of the laminate when seen in the lamination direction and a second side perpendicular or substantially perpendicular to the first side; and a second internal electrode provided on the second base material along a third side perpendicular or substantially perpendicular to the second side and a fourth side perpendicular or substantially perpendicular to the third side. ### Claim 8 (depends on 1) The high-frequency module according to claim 1, wherein the high-frequency circuit is a reader-writer circuit of a near field communication system. ### Claim 9 (depends on 1) The high-frequency module according to claim 1, wherein the high-frequency circuit is configured to be connected to antenna of a near field communication system. ### Claim 10 (depends on 1) The high-frequency module according to claim 1, wherein the high-frequency circuit includes an RF-IC, a low pass filter circuit and a matching circuit. ### Claim 11 (depends on 1) The high-frequency module according to claim 1, further comprising a plurality of bottom surface electrodes that provide input/output provided on the one principal surface of the laminate. ### Claim 12 (depends on 1) The high-frequency module according to claim 1, further comprising a first resist and a second resist provided on the laminate. ### Claim 13 (depends on 1) The high-frequency module according to claim 1, wherein the high-frequency circuit is a chip element. ### Claim 14 (depends on 1) The high-frequency module according to claim 1, wherein the laminate includes via electrodes configured to provide grounding. ### Claim 15 (depends on 1) The high-frequency module according to claim 1, wherein the laminate includes a wiring region at a location where none of the plurality of internal electrodes that provide grounding is located. ### Claim 16 (depends on 15) The high-frequency module according to claim 15, wherein an internal electrode and a via electrode configured to provide connection wiring are located in the wiring region. ### Claim 17 (depends on 14) The high-frequency module according to claim 14, wherein the plurality of internal electrodes configured to provide ground and the via electrodes configured to provide grounding are located at outer edges of the base materials.