# US 9,437,558 B2 · High frequency integrated circuit and packaging for same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,437,558 B2 - Document ID: US9437558B2 - Status: Granted - Kind: B2 - Application number: 14/613,005 - Filed: 2015-02-03 - Published: 2016-06-30 - Granted: 2016-09-06 - Earliest claimed: 2014-12-30 - Assignees: Analog Devices, Inc. - Applicants: Analog Devices, Inc. - Inventors: Andrew Pye; Rodrigo Carrillo-Ramirez - Web page: https://patentgrep.com/patent/US9437558B2 ## CPC - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 70/421: {Shapes or dispositions} - H10W 70/465: {Bumps or wires} - H10W 90/811: {Multiple chips on leadframes} - H10W 44/206: {Wires} - H10W 44/223: {Differential pair signal lines} - H10W 72/075: {of bond wires} - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10W 72/5473: {multiple bond wires connected to a common bond pad} - H10W 72/5522: {comprising gold [Au]} - H10W 72/5525: {comprising copper [Cu]} - H10W 72/59: Bond pads specially adapted therefor - H10W 72/923: {Bond pads having multiple stacked layers} - H10W 72/926: {Multiple bond pads having different sizes} - H10W 72/932: {Plan-view shape, i.e. in top view} - H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract An integrated circuit can include a group of bond pads alternating between bond pads configured to provide a return path and bond pads configured to provide a signal bond pad. For example, five bond pads can be arranged in a return-signal-return-signal-return arrangement. The integrated circuit can further be configured to receive or transmit high frequency signals. ## Claims ### Claim 1 An integrated circuit package comprising: an integrated circuit comprising a circuit and a plurality of bond pads electronically connected to the circuit; and a package structure comprising a plurality of leads connected to a plurality of the bond pads by a plurality of wire bonds, wherein a group of five consecutive bond pads of the plurality of bond pads connected to the leads comprise two signal bond pads configured to transmit the same signal and three return bond pads, one return bond pad being between the two signal bond pads and the other two return bond pads being adjacent the two signal bond pads on opposite sides of the group. ### Claim 2 (depends on 1) The integrated circuit package of claim 1, wherein the plurality of leads comprise at least one die paddle. ### Claim 3 (depends on 1) The integrated circuit package of claim 1, wherein the package structure comprises a lead frame. ### Claim 4 (depends on 3) The integrated circuit package of claim 3, wherein the lead frame comprises a group of five consecutive leads connected to the group of five consecutive bond pads by wire bonds. ### Claim 5 (depends on 4) The integrated circuit package of claim 4, wherein each of the five consecutive bond pads is connected to one of the five consecutive leads by at least two wire bonds. ### Claim 6 (depends on 1) The integrated circuit package of claim 1, wherein the at least two signal bond pads and at least three ground bond pads are arranged to be physically symmetric. ### Claim 7 (depends on 1) The integrated circuit package of claim 1, wherein the at least two signal bond pads and at least three ground bond pads are in sufficiently close physical proximity to provide mutual negative inductance. ### Claim 8 (depends on 1) The integrated circuit package of claim 1, wherein the circuit is configured to transmit or receive signals with a frequency of greater than or equal to about 1 GHz through the two signal bond pads. ### Claim 9 (depends on 1) The integrated circuit package of claim 1, wherein the circuit is configured to transmit or receive signals with a frequency greater than or equal to about 4 GHz. ### Claim 10 (depends on 1) The integrated circuit package of claim 1, wherein the group of five consecutive bond pads is part of a group of seven consecutive bond pads further comprising one additional signal bond pad on each side of the group of five consecutive bond pads. ### Claim 11 (depends on 1) The integrated circuit package of claim 1, wherein the group of three consecutive bond pads are in sufficiently close physical proximity to provide mutual negative inductance. ### Claim 12 (depends on 1) The integrated circuit package of claim 1, wherein the circuit is configured to transmit or receive signals with a frequency of greater than or equal to about 1 GHz through the signal bond pad and impedance for the transition between the bond pads and the leads is less than 10% of system impedance for the circuit. ### Claim 13 An integrated circuit configured for receiving and/or transmitting a high-frequency signal, the integrated circuit comprising: a group of five consecutive bond pads configured to communicate the high-frequency signals to or from the integrated circuit, three of the bond pads being return path bond pads and two of the bond pads being signal bond pads configured to carry the same signal, wherein the three return path bond pads and the two signal bond pads are arranged in a sequentially alternating configuration. ### Claim 14 (depends on 13) The integrated circuit of claim 13, wherein the three return path bond pads and two signal bond pads are all disposed on a single side of the integrated circuit. ### Claim 15 (depends on 13) The integrated circuit of claim 13, wherein the two signal bond pads are configured to carry an analog signal. ### Claim 16 (depends on 13) The integrated circuit of claim 13, wherein the two signal bond pads are configured to carry a digital signal. ### Claim 17 (depends on 13) The integrated circuit of claim 13, wherein the integrated circuit comprises at least one of an RF up-converter, RF down-converter, RF amplifier, frequency multiplier, RF synthesizer, and RF detector circuit. ### Claim 18 (depends on 13) The integrated circuit of claim 13, wherein the integrated circuit is configured to receive or transmit signals of at least 1 GHz through the two signal bond pads. ### Claim 19 (depends on 13) The integrated circuit of claim 13, wherein the integrated circuit is configured to receive or transmit signals of at least 10 GHz through the two signal bond pads. ### Claim 20 (depends on 13) A package comprising the integrated circuit of claim 13, further comprising a lead frame connected to the integrated circuit by a plurality of wire bonds such that the five consecutive bond pads are connected by wires to five consecutive leads of the lead frame. ### Claim 21 (depends on 20) A system comprising the package of claim 20 mounted on a printed circuit board. ### Claim 22 A method of assembling a printed circuit board comprising: mounting an integrated circuit to a package structure, the integrated circuit comprising a plurality of bond pads electronically connected to a radio frequency circuit, the plurality of bond pads comprising a group of five consecutive bond pads, three of the consecutive bond pads being return bond pads and two of the consecutive bond pads being signal bond pads configured to transmit the same signal, the five consecutive return bond pads and the signal bond pads being arranged in a sequentially alternating configuration; and wirebonding each of the group of five consecutive bond pads to a corresponding one of consecutively positioned leads of the package structure. ### Claim 23 An integrated circuit package comprising: an integrated circuit comprising a circuit and a plurality of bond pads electronically connected to the circuit; and a package structure comprising a plurality of leads connected to a plurality of the bond pads by a plurality of wire bonds, wherein a group of three consecutive bond pads of the plurality of bond pads connected to the leads comprise one signal bond pad and two return bond pads, the signal bond pad being between the two return bond pads, the two return bond pads configured to provide a return path only for signals carried on the signal bond pad, wherein the circuit is configured to transmit or receive signals with a frequency of greater than or equal to about 1 GHz through the signal bond pad and impedance for the transition between the bond pads and the leads is less than 10% of system impedance for the circuit. ### Claim 24 (depends on 23) The integrated circuit package of claim 23, wherein the plurality of leads comprise at least one paddle. ### Claim 25 (depends on 23) The integrated circuit package of claim 23, wherein the package structure comprises a lead frame. ### Claim 26 (depends on 25) The integrated circuit package of claim 25, wherein the lead frame comprises a group of three consecutive peripheral leads connected to the group of three consecutive bond pads by wire bonds. ### Claim 27 (depends on 23) The integrated circuit package of claim 23, wherein the circuit is configured to transmit or receive signals with a frequency greater than or equal to about 20 GHz.