# US 9,437,554 B2 · Semiconductor package having magnetic substance and related equipment

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- Number: US 9,437,554 B2
- Document ID: US9437554B2
- Status: Granted
- Kind: B2
- Application number: 14/330,636
- Filed: 2014-07-14
- Published: 2015-05-14
- Granted: 2016-09-06
- Earliest claimed: 2013-11-12
- Assignees: Samsung Electronics Co., Ltd.
- Applicants: Sang-Wook Ji; Hyoung-Yol Mun; Yeong-Lyeol Park; In-Kyum Lee
- Inventors: Sang-Wook Ji; Hyoung-Yol Mun; Yeong-Lyeol Park; In-Kyum Lee
- Web page: https://patentgrep.com/patent/US9437554B2

## CPC

- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 90/00: Package configurations
- H10W 46/00: Marks applied to devices, e.g. for alignment or identification
- H10W 70/635: {Through-vias}
- H10W 72/0198: {batch processes}
- H10W 72/07141: {Means for applying energy, e.g. ovens or lasers}
- H10W 72/07178: {Means for aligning}
- H10W 72/072: {of bump connectors}
- H10W 72/07227: {involving guiding structures, e.g. spacers or supporting members}
- H10W 72/07254: {changes in dispositions}
- H10W 72/241: {Dispositions, e.g. layouts}
- H10W 72/244: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/247: {Dispositions of multiple bumps}
- H10W 72/252: {comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu}
- H10W 72/285: {Alignment aids, e.g. alignment marks}
- H10W 74/012: {of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/231: {the stacked chips being on both top and bottom sides of an auxiliary carrier having no electrical connection structure}
- H10W 90/297: {characterised by the through-semiconductor vias [TSVs] in the stacked chips}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 90/722: {between stacked chips}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

Provided is a semiconductor device. A semiconductor chip is disposed on a substrate. A first magnetic substance, a second magnetic substance and a third magnetic substance which are spaced apart from one another are formed on the semiconductor chip. The first magnetic substance and the second magnetic substance can be adjacent an edge of the semiconductor chip. The third magnetic substance can be adjacent a center of the semiconductor chip. The third magnetic substance is between the first magnetic substance and the second magnetic substance.

## Claims

### Claim 1

A semiconductor package comprising:
a substrate;
a semiconductor chip disposed on the substrate;
a first magnetic substance, a second magnetic substance and a third magnetic substance which are spaced apart from one another on the semiconductor chip; and
a fourth magnetic substance, a fifth magnetic substance and a sixth magnetic substance which are spaced apart from one another on the substrate,
wherein the first magnetic substance and the second magnetic substance are adjacent an edge of the semiconductor chip, the third magnetic substance is adjacent a center of the semiconductor chip, and the third magnetic substance is between the first magnetic substance and the second magnetic substance,
wherein the fourth magnetic substance faces the first magnetic substance, the fifth magnetic substance faces the second magnetic substance, and the sixth magnetic substance faces the third magnetic substance,
wherein a lower end of the first magnetic substance has the same magnetic polarity as an upper end of the fourth magnetic substance that faces the lower end of the first magnetic substance, a lower end of the second magnetic substance has the same magnetic polarity as an upper end of the fifth magnetic substance that faces the lower end of the second magnetic substance, and a lower end of the third magnetic substance has an opposite magnetic polarity from an upper end of the sixth magnetic substance that faces the lower end of the third magnetic substance.

### Claim 2 (depends on 1)

The semiconductor package of claim 1, wherein each of the first magnetic substance, the second magnetic substance and the third magnetic substance protrudes from the semiconductor chip and between the substrate and the semiconductor chip.

### Claim 3 (depends on 1)

The semiconductor package of claim 1, wherein the substrate includes a printed circuit board, an interposer, another semiconductor chip, or a combination thereof.

### Claim 4 (depends on 1)

The semiconductor package of claim 1, wherein the semiconductor chip includes through electrodes.

### Claim 5

A semiconductor package comprising:
a substrate;
a semiconductor chip disposed on the substrate;
a first magnetic substance and a second magnetic substance which are spaced apart from each other on the semiconductor chip; and
a third magnetic substance and a fourth magnetic substance which are spaced apart from each other on the substrate,
wherein the first magnetic substance and the second magnetic substance are adjacent an edge of the semiconductor chip,
wherein the third magnetic substance faces the first magnetic substance, and the fourth magnetic substance faces the second magnetic substance,
wherein a lower end of the first magnetic substance has the same magnetic polarity as an upper end of the third magnetic substance that faces the lower end of the first magnetic substance, and a lower end of the second magnetic substance has the same magnetic polarity as an upper end of the fourth magnetic substance that faces the lower end of the second magnetic substance.

### Claim 6 (depends on 5)

The semiconductor package of claim 5, further comprising:
a fifth magnetic substance disposed on the semiconductor chip between the first magnetic substance and the second magnetic substance; and
a sixth magnetic substance disposed on the substrate that faces the fifth magnetic substance.

### Claim 7 (depends on 6)

The semiconductor package of claim 6, wherein a lower end of the fifth magnetic substance has an opposite magnetic polarity from an upper end of the sixth magnetic substance that faces the lower end of the fifth magnetic substance.

### Claim 8

A semiconductor package comprising:
a substrate;
a semiconductor chip disposed on the substrate;
a first magnetic member and a second magnetic member which are spaced apart from each other on the semiconductor chip; and
a third magnetic member and a fourth magnetic member which are spaced apart from each other on the substrate,
wherein the first magnetic member and the second magnetic member are at an edge portion of the semiconductor chip,
wherein the third magnetic member is aligned with and faces the first magnetic member, and the fourth magnetic member is aligned with and faces the second magnetic member,
wherein a lower end of the first magnetic member has the same magnetic polarity from an upper end of the third magnetic member that faces the lower end of the first magnetic member, and a lower end of the second magnetic member has the same magnetic polarity from an upper end of the fourth magnetic member that faces the lower end of the second magnetic member.

### Claim 9 (depends on 8)

The semiconductor package of claim 8, further comprising:
a fifth magnetic member disposed on the semiconductor chip at a center portion thereof and between the first magnetic member and the second magnetic member; and
a sixth magnetic member disposed on the substrate that is aligned with and faces the fifth magnetic member.

### Claim 10 (depends on 9)

The semiconductor package of claim 9, wherein a lower end of the fifth magnetic member has an opposite magnetic polarity from an upper end of the sixth magnetic member that faces the lower end of the fifth magnetic member.

### Claim 11 (depends on 1)

The semiconductor package of claim 1, wherein the first magnetic substance is at a first corner portion of the semiconductor chip, the second magnetic substance is at a second corner portion of the semiconductor chip, and the third magnetic substance is at a center portion of the semiconductor chip.

### Claim 12 (depends on 11)

The semiconductor package of claim 11, wherein the first and second magnetic substances each have a triangular shape.

### Claim 13 (depends on 11)

The semiconductor package of claim 11, wherein the third magnetic substance has a rectangular shape.

### Claim 14 (depends on 1)

The semiconductor package of claim 1, wherein a lower end of the first magnetic substance has an opposite magnetic polarity as a lower end of the third magnetic substance, and the lower end of the first magnetic substance has the same magnetic polarity as a lower end of the second magnetic substance.