# US 9,437,553 B2 · Electronic device

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 9,437,553 B2
- Document ID: US9437553B2
- Status: Granted
- Kind: B2
- Application number: 14/283,396
- Filed: 2014-05-21
- Published: 2014-11-27
- Granted: 2016-09-06
- Earliest claimed: 2013-05-27
- Assignees: Fujitsu Component Limited
- Applicants: Fujitsu Component Limited
- Inventors: Tohru Muramatsu; Takeshi Wakui; Toshiya Koyama; Masakazu Muranaga
- Web page: https://patentgrep.com/patent/US9437553B2

## CPC

- H10W 42/20: protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
- H10W 90/00: Package configurations
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

An electronic device includes a first substrate including a first electrode formed on a surface of the first substrate, an electronic component mounted on another surface of the first substrate, a second substrate placed on the first substrate via the electronic component, and a shield disposed between the first substrate and the second substrate.

## Claims

### Claim 1

An electronic device, comprising:
a first substrate including a first electrode formed on a surface of the first substrate;
a second substrate placed on the first substrate;
a plurality of chip electronic components mounted on another surface of the first substrate; and
a shield disposed between the first substrate and the second substrate;
wherein the chip electronic components support the second substrate on the first substrate;
wherein the shield is provided on the another surface of the first substrate; and
wherein the shield supports the second substrate on the first substrate.

### Claim 2 (depends on 1)

The electronic device as claimed in claim 1, further comprising:
a circuit component mounted on the another surface of the first substrate in an area enclosed by the shield.

### Claim 3 (depends on 2)

The electronic device as claimed in claim 2, wherein the shield includes a top plate that faces the second substrate.

### Claim 4 (depends on 2)

The electronic device as claimed in claim 2, wherein
at least one of the first substrate and the second substrate includes a conductive layer that is maintained at a reference potential; and
the shield is connected to the conductive layer.

### Claim 5 (depends on 1)

The electronic device as claimed in claim 1, wherein the second substrate includes a second electrode formed on a surface of the second substrate.

### Claim 6 (depends on 5)

The electronic device as claimed in claim 5, wherein the first electrode and the second electrode are configured for interfaces of different standards.

### Claim 7 (depends on 1)

The electronic device as claimed in claim 1, wherein
each chip electronic component includes a first terminal formed on a first surface of the chip electronic component and a second terminal formed on a second surface of the chip electronic component;
the first terminal is electrically connected to the first substrate; and
the second terminal is electrically connected to the second substrate.

### Claim 8 (depends on 1)

The electronic device as claimed in claim 1, wherein
each chip electronic component includes a first terminal and a second terminal formed on a side surface of the chip electronic component;
the first terminal is electrically connected to the first substrate; and
the second terminal is electrically connected to the second substrate.

### Claim 9

An electronic device, comprising:
a first substrate including a first electrode formed on a surface of the first substrate;
a second substrate placed on the first substrate;
an electronic component mounted on another surface of the first substrate; and
a shield disposed between the first substrate and the second substrate;
wherein the second substrate is placed on the first substrate via the electronic component;
wherein the second substrate includes a conductive layer, an insulating layer that covers the conductive layer, and a via that is formed in the insulating layer and that electrically contacts the conductive layer; and
wherein the conductive layer is connected to a ground potential, and extends uniformly over the another surface of the first substrate.

### Claim 10

An electronic device, comprising:
a first substrate including a first electrode formed on a first surface of the first substrate;
a second substrate placed over the first substrate, a first surface of the second substrate facing a second surface of the first substrate;
a plurality of electronic components connected to both the second surface of the first substrate and the first surface of the second substrate; the electronic components supporting the second substrate on the first substrate; and
a shield disposed between the first substrate and the second substrate, the shield being provided on the second surface of the first substrate, and the shield supporting the second substrate on the first substrate.