# US 9,437,549 B2 · Method for manufacturing ceramic substrate

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- Number: US 9,437,549 B2
- Document ID: US9437549B2
- Status: Granted
- Kind: B2
- Application number: 14/808,656
- Filed: 2015-07-24
- Published: 2016-02-18
- Granted: 2016-09-06
- Earliest claimed: 2014-07-24
- Assignees: Viking Tech Corporation
- Applicants: Viking Tech Corporation
- Inventors: Chien-Hung Ho; Chen-Shen Kuo; Chun-Chu Wu
- Web page: https://patentgrep.com/patent/US9437549B2

## CPC

- H10W 70/614: {the multiple chips being integrally enclosed}
- B23K 26/364: for making a groove or trench, e.g. for scribing a break initiation groove
- B23K 26/38: by boring or cutting
- B23K 26/402: involving non-metallic material, e.g. isolators
- B24C 1/04: for treating only selected parts of a surface, e.g. for carving stone or glass
- B28B 11/0863: {for profiling, e.g. making grooves}
- H10F 77/50: Encapsulations or containers (for photovoltaic modules H10F19/80)
- H10H 20/858: Means for heat extraction or cooling
- H10W 70/05: of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04)
- H10W 70/65: Shapes or dispositions of interconnections
- H10W 70/69: Insulating materials thereof
- B23K 2103/52: {Ceramics}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 76/47: Solid or gel fillings
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B24C: ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B28B: SHAPING CLAY OR OTHER CERAMIC COMPOSITIONS; SHAPING SLAG; SHAPING MIXTURES CONTAINING CEMENTITIOUS MATERIAL, e.g. PLASTER (foundry moulding B22C; working stone or stone-like material B28D; shaping of substances in a plastic state, in general B29C; making layered products not composed wholly of these substances B32B)
- H10F: INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS

## Abstract

A method for manufacturing a ceramic substrate is characterized in using a preformed trench, a patterned protective layer and a sand blasting process to manufacture a cavity in a ceramic substrate and control the cavity size and shape of the ceramic substrate. The ceramic substrate is collocated with a base substrate to form a package substrate for packaging a semiconductor chip. The manufacturing method set forth above can lower the manufacturing cost and raise the accuracy of the size and shape of the cavity of the ceramic substrate. The abovementioned method can reduce the fabrication cost and increase the precision of the shape and size of a ceramic substrate.

## Claims

### Claim 1

A method for manufacturing a ceramic substrate having a cavity, comprising steps:
providing a ceramic substrate having a first surface and a second surface;
fabricating a preformed trench in said first surface of said ceramic substrate;
fabricating a patterned protective layer on said second surface of said ceramic substrate; and
sand-blasting said second surface of said ceramic substrate to form a cavity, wherein said cavity penetrates said first surface and said second surface of said ceramic substrate and has a vertical portion and a gradually-varying portion, wherein said vertical portion is near said first surface and has an inner diameter identical to a first diameter of said cavity on said first surface, and wherein said gradually-varying portion is near said second surface and has an inner diameter gradually increasing from said first diameter to a second diameter of said cavity on said second surface.

### Claim 2 (depends on 1)

The method for manufacturing a ceramic substrate having a cavity according to claim 1, wherein said sand blasting process includes a first sand blasting step and a second sand blasting step, which respectively have different impact forces.

### Claim 3 (depends on 1)

The method for manufacturing a ceramic substrate having a cavity according to claim 1, wherein a laser beam is used to cut said first surface of said ceramic substrate to form said preformed trench.

### Claim 4 (depends on 1)

The method for manufacturing a ceramic substrate having a cavity according to claim 1, wherein a position of said preformed trench is corresponding to said first diameter of said cavity on said first surface.

### Claim 5 (depends on 1)

The method for manufacturing a ceramic substrate having a cavity according to claim 1 further comprising a step of removing said patterned protective layer.

### Claim 6 (depends on 1)

The method for manufacturing a ceramic substrate having a cavity according to claim 1, wherein a cross section of said cavity, which is intersected by said first surface or said second surface, has a rectangular shape, wherein at least one corner of said rectangular shape is convexed outward to form a recess.