# US 9,437,535 B2 · Wireless module and production method for wireless module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,437,535 B2 - Document ID: US9437535B2 - Status: Granted - Kind: B2 - Application number: 14/388,349 - Filed: 2014-01-29 - Published: 2015-11-19 - Granted: 2016-09-06 - Earliest claimed: 2013-01-29 - Assignees: Panasonic Intellectual Property Management Co., Ltd. - Applicants: Panasonic Corporation - Inventors: Maki Nakamura; Suguru Fujita - Web page: https://patentgrep.com/patent/US9437535B2 ## CPC - H10W 70/65: Shapes or dispositions of interconnections - H05K 3/368: {parallel to each other (H05K3/361 takes precedence)} - H10W 44/20: at high-frequency [HF] or radio frequency [RF] - H10W 74/01: Manufacture or treatment - H10W 74/016: {using moulds} - H10W 74/114: {by a substrate and the encapsulations} - H10W 90/401: {characterised by multiple insulating or insulated package substrates, interposers or RDLs} - H05K 1/144: {Stacked arrangements of planar printed circuit boards} - H05K 1/186: {manufactured by mounting on or connecting to patterned circuits before or during embedding} - H05K 3/4614: {the electrical connections between the circuit boards being made during lamination} - H05K 2201/0379: Stacked conductors - H05K 2201/042: Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other - H05K 2201/10098: Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas - H05K 2201/10234: Metallic balls - H05K 2203/061: of previously made multilayered subassemblies - H10W 44/248: {for antennas} - H10W 70/099: {Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers} - H10W 70/63: Vias, e.g. via plugs - H10W 72/877: {Bump connectors and die-attach connectors} - H10W 74/142: {the encapsulations exposing the passive side of the semiconductor body} - H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts} - H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ## Abstract Provided is a wireless module whose size can be made smaller. The wireless module includes: a first substrate on which an antenna is mounted; a second substrate which opposes the first substrate and on which an electronic component is mounted; and a plurality of electric conductors which connect the first substrate and the second substrate and which transmit a signal between the antenna and the electronic components, wherein the plurality of electric conductors are disposed between the first substrate and the second substrate in series in a substantially vertical direction with respect to mounting surfaces of the first substrate and the second substrate. ## Claims ### Claim 1 A wireless module comprising: a first substrate on which an antenna is mounted; a second substrate which opposes the first substrate and on which an electronic component is mounted; and a plurality of electric conductors which connect the first substrate and the second substrate and which transmit a signal between the antenna and the electronic component, wherein the plurality of electric conductors are disposed between the first substrate and the second substrate in series in a vertical direction with respect to mounting surfaces of the first substrate and the second substrate, wherein in addition to the plurality of electric conductors, a third electric conductor having a diameter longer than diameters of the plurality of electric conductors is disposed between the first substrate and the second substrate, and wherein the third electric conductor is disposed to contact the first substrate and the second substrate. ### Claim 2 (depends on 1) The wireless module according to claim 1, wherein a molding compound is filled between the first substrate and the second substrate. ### Claim 3 (depends on 2) The wireless module according to claim 2, wherein the molding compound comprises a first layer of molding compound filled on a second substrate side and a second layer of molding compound filled on a first substrate side, and wherein a length of the first layer of molding compound in a thickness direction thereof is equal to or lower than a length of the electric conductor mounted on the second substrate in a thickness direction thereof. ### Claim 4 (depends on 2) The wireless module according to claim 2, wherein the molding compound comprises a first layer of molding compound filled on a second substrate side and a second layer of molding compound filled on a first substrate side, wherein a length of the first layer of molding compound in a thickness direction thereof is longer than a length of the electric conductor disposed inside the second substrate in a thickness direction thereof, and wherein an opening through which the electric conductor is exposed is formed in the first layer of molding compound. ### Claim 5 (depends on 3) The wireless module according to claim 3, wherein a material of the first layer of molding compound is different from a material of the second layer of molding compound. ### Claim 6 (depends on 1) The wireless module according to claim 1, wherein a material of the first substrate is different from a material of the second substrate. ### Claim 7 (depends on 1) The wireless module according to claim 1, wherein each of the plurality of electric conductors has conductivity and comprises a core section and a solder layer enclosing the core section. ### Claim 8 (depends on 7) The wireless module according to claim 7, wherein diameters of the plurality of electric conductors are the same. ### Claim 9 A wireless module, comprising: a first substrate on which an antenna is mounted; a second substrate which opposes the first substrate and on which an electronic component is mounted; and a plurality of electric conductors which connect the first substrate and the second substrate and which transmit a signal between the antenna and the electronic component, wherein the plurality of electric conductors are disposed between the first substrate and the second substrate in series in a vertical direction with respect to mounting surfaces of the first substrate and the second substrate, wherein the plurality of electric conductors have conductivity, wherein a first electric conductor connected to the first substrate is an electric conductor having no material difference between a core section and a surrounding shell, wherein a second electric conductor connected to the second substrate is an electric conductor having a material difference between a core section and a surrounding shell, and wherein a diameter of the first electric conductor is shorter than a diameter of the second electric conductor. ### Claim 10 (depends on 1) The wireless module according to claim 1, wherein the first substrate and the second substrate are partly covered with a resist, and wherein lands are exposed from the resist at pad sections to which the plurality of electric conductors disposed on the first substrate and the second substrate are connected.