# US 9,437,529 B2 · Chip package structure and manufacturing method thereof

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- Number: US 9,437,529 B2
- Document ID: US9437529B2
- Status: Granted
- Kind: B2
- Application number: 14/490,683
- Filed: 2014-09-19
- Published: 2015-10-08
- Granted: 2016-09-06
- Earliest claimed: 2014-04-03
- Assignees: ChipMOS Technologies Inc.
- Applicants: ChipMOS Technologies Inc.
- Inventors: Yu-Tang Pan; Shih-Wen Chou
- Web page: https://patentgrep.com/patent/US9437529B2

## CPC

- H10W 70/461: {specially adapted for cooling}
- H10W 40/258: {Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence)}
- H10W 70/02: of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04)
- H10W 70/023: {Connecting or disconnecting interconnections thereto or therefrom, e.g. connecting bond wires or bumps}
- H10W 70/042: {Etching}
- H10W 70/411: {Chip-supporting parts, e.g. die pads}
- H10W 70/421: {Shapes or dispositions}
- H10W 70/466: {Tape carriers or flat leads}
- H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers}
- H10W 72/012: {of bump connectors, dummy bumps or thermal bumps}
- H10W 72/90: Bond pads, in general
- H10W 74/01: Manufacture or treatment
- H10W 74/129: {forming a chip-scale package [CSP]}
- H10W 70/458: {of insulating layers on leadframes}
- H10W 72/59: Bond pads specially adapted therefor
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/111: {the semiconductor body being completely enclosed}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A chip package structure includes a lead frame having first and second patterned metal layers and an insulation layer, a chip, and an encapsulant covering the first patterned metal layer and the chip. The first patterned metal layer includes a chip pad with first recesses and bonding pads in the first recesses. A first groove exists between each bonding pad and the chip pad. The second patterned metal layer connecting the first patterned metal layer includes terminal pads and a heat dissipation block thermally coupled to the chip pad. The heat dissipation block includes second recesses where the terminal pads are located and electrically connected to the corresponding bonding pads. A second groove exists between each terminal pad and the heat dissipation block. The insulation layer is located between the bonding pads and the terminal pads. The chip on the chip pad is electrically connected to the bonding pads.

## Claims

### Claim 1

A chip package structure comprising:
a lead frame comprising:
a first patterned metal layer comprising a chip pad and a plurality of bonding pads, the chip pad comprising a first main body, a plurality of first extensions and a plurality of first recesses, the first extensions extending in a direction away from the first main body, such that the first extensions and the first main body collectively define the first recesses, each of the first extensions respectively extending between every two adjacent bonding pads, and at least one edge of each of the first extensions aligned to at least one edge of the adjacent bonding pads, the first recesses being located at a periphery of the chip pad, the bonding pads being respectively located in the first recesses, and a first groove existing between each of the bonding pads and the chip pad;
a second patterned metal layer connected to the first patterned metal layer, the second patterned metal layer comprising a heat dissipation block and a plurality of terminal pads, the heat dissipation block being thermally coupled to the chip pad and comprising a plurality of second recesses, the second recesses being located at a periphery of the heat dissipation block, the terminal pads being respectively located in the second recesses and electrically connected to the corresponding bonding pads, a second groove existing between each of the terminal pads and the heat dissipation block; and
an insulation layer located between the bonding pads and the terminal pads;
a chip disposed on the first main body of the chip pad and electrically connected to the bonding pads; and
an encapsulant covering the first patterned metal layer and the chip.

### Claim 2 (depends on 1)

The chip package structure as recited in claim 1, further comprising a plurality of conductive vias, the conductive vias respectively penetrating the bonding pads and the insulation layer and being connected to the corresponding terminal pads respectively so as to electrically connect the bonding pads with the terminal pads.

### Claim 3 (depends on 1)

The chip package structure as recited in claim 1, wherein a size of the heat dissipation block is not smaller than a size of the chip pad.

### Claim 4 (depends on 1)

The chip package structure as recited in claim 1, wherein a minimum horizontal distance from each of the bonding pads to one side of the chip is smaller than a minimum horizontal distance from each of the corresponding terminal pad to an orthogonal projection of the side of the chip on the heat dissipation block.

### Claim 5 (depends on 1)

The chip package structure as recited in claim 1, wherein the heat dissipation block comprises a second main body and a plurality of second extensions, the second extensions extend in a direction away from the second main body, such that the second extensions and the second main body collectively define the second recesses, each of the second extensions respectively extends between every two adjacent terminal pads, and at least one edge of each of the second extensions is aligned to at least one edge of the adjacent terminal pads.

### Claim 6 (depends on 1)

The chip package structure as recited in claim 1, further comprising a connection bump located between the first patterned metal layer and the second patterned metal layer, the connection bump connecting the chip pad and the heat dissipation block, so as to thermally couple the chip pad to the heat dissipation block.

### Claim 7 (depends on 6)

The chip package structure as recited in claim 6, wherein the insulation layer surrounds the connection bump and is distributed between the bonding pads and the terminal pads.

### Claim 8 (depends on 1)

The chip package structure as recited in claim 1, wherein the insulation layer is distributed between the chip pad and the heat dissipation block and between the bonding pads and the terminal pads.

### Claim 9 (depends on 8)

The chip package structure as recited in claim 8, further comprising a plurality of thermal vias, the thermal vias penetrating the chip pad and the insulation layer and being connected to the heat dissipation block, so as to thermally couple the chip pad to the heat dissipation block.