# US 9,437,527 B2 · Method for manufacturing electrical connections in a semiconductor device and the semiconductor device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,437,527 B2 - Document ID: US9437527B2 - Status: Granted - Kind: B2 - Application number: 14/630,171 - Filed: 2015-02-24 - Published: 2015-10-01 - Granted: 2016-09-06 - Earliest claimed: 2014-04-01 - Assignees: Fuji Electric Co., Ltd. - Applicants: Fuji Electric Co., Ltd. - Inventors: Takeshi Yokoyama - Web page: https://patentgrep.com/patent/US9437527B2 ## CPC - H10W 70/421: {Shapes or dispositions} - H10W 76/157: having interconnections parallel to the insulating or insulated base - H10W 72/0198: {batch processes} - H10W 72/07336: {Soldering or alloying} - H10W 72/07337: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy} - H10W 72/075: {of bond wires} - H10W 72/07536: {Soldering or alloying} - H10W 72/07554: {changes in dispositions} - H10W 72/325: {Die-attach connectors having a filler embedded in a matrix} - H10W 72/352: {comprising metals or metalloids, e.g. solders} - H10W 72/354: {comprising polymers} - H10W 72/5445: {being orthogonal to a side surface of the chip, e.g. parallel arrangements} - H10W 72/552: {comprising metals or metalloids, e.g. silver} - H10W 72/884: {Die-attach connectors and bond wires} - H10W 74/00: Encapsulations, e.g. protective coatings - H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL} - H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink} - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A resin casing is insert-molded while clamp protrusions of clamp portions formed in bonding portions of lead terminals are put between an upper mold and a lower mold. An insulating substrate which has a wiring pattern mounted with semiconductor elements is fitted into an opening portion of the resin casing and adhesively bonded to the resin casing. Electric connection between the semiconductor elements and the bonding portions of the lead terminals and between the wiring pattern on the insulating substrate and the bonding portions of the lead terminals is made by bonding wires. Thus, it is possible to provide a method for manufacturing a semiconductor device and the semiconductor device, in which stress applied to lead terminals of a lead frame formed by insert molding can be suppressed, and wire bonding properties and reliability can be improved even when the thickness of each of the lead terminals is reduced. ## Claims ### Claim 1 A semiconductor device including a semiconductor element received in an annular resin casing which has an opening portion and which is molded integrally with lead terminals by insert molding, the semiconductor device comprising: the lead terminals each of which is provided with a bonding portion and a terminal portion; the resin casing which is formed by the insert molding, while clamp portions having clamp protrusions formed in the bonding portions of the lead terminals are put between molds opposed to each other in a state in which the clamp portions are protruded into the opening portion; an insulating substrate which has a wiring pattern mounted with the semiconductor element disposed in the opening portion; and bonding wires which make electric connection between the semiconductor element and one of the bonding portions of the lead terminals and between the wiring pattern on the insulating substrate and another of the bonding portions of the lead terminals; wherein: the clamp portions are provided with notch portions. ### Claim 2 (depends on 1) The semiconductor device according to claim 1, wherein: the notch portions are provided in positions to which the bonding wires making electric connection between the bonding portions of the lead terminals and at least one of the semiconductor element and the wiring pattern on the insulating substrate are opposed. ### Claim 3 (depends on 2) The semiconductor device according to claim 2, wherein: the notch portions are provided in centers of the clamp portions and the clamp protrusions are formed on opposite sides of the notch portions. ### Claim 4 (depends on 2) The semiconductor device according to claim 2, wherein: the notch portions are provided so that the clamp protrusions are left in center portions of the clamp portions. ### Claim 5 (depends on 2) The semiconductor device according to claim 2, wherein: the notch portions are provided so that the clamp protrusions are left in one of end portions of the clamp portions parallel to a perpendicular direction to an end surface of the opening portion of the resin casing. ### Claim 6 (depends on 2) The semiconductor device according to claim 2, wherein: the notch portions are formed so that bottom portions of the notch portions align with an end edge of the opening portion. ### Claim 7 (depends on 2) The semiconductor device according to claim 2, wherein: resin injection spaces are formed between the bottom portions of the notch portions and an end edge of the opening portion in the notch portions so that a resin material forming the resin casing can enter the resin injection spaces to form resin protrusion layers. ### Claim 8 (depends on 2) The semiconductor device according to claim 2, wherein: the notch portions are formed so that a width of each of the clamp protrusions of the clamp portions in a parallel direction to an end surface of the opening portion of the resin casing is not smaller than a thickness of each of the lead terminals. ### Claim 9 (depends on 1) The semiconductor device according to claim 1, wherein: the notch portions are formed so that bottom portions of the notch portions align with an end edge of the opening portion. ### Claim 10 (depends on 1) The semiconductor device according to claim 1, wherein: resin injection spaces are formed between the bottom portions of the notch portions and an end edge of the opening portion in the notch portions so that a resin material forming the resin casing can enter the resin injection spaces to form resin protrusion layers. ### Claim 11 (depends on 1) The semiconductor device according to claim 1, wherein: a length with which each of the clamp protrusions of the clamp portions protrudes into the opening portion of the resin casing is not smaller than a thickness of each of the lead terminals. ### Claim 12 (depends on 1) The semiconductor device according to claim 1, wherein: the notch portions are formed so that a width of each of the clamp protrusions of the clamp portions in a parallel direction to an end surface of the opening portion of the resin casing is not smaller than a thickness of each of the lead terminals.