# US 9,437,523 B2 · Two-sided jet impingement assemblies and power electronics modules comprising the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,437,523 B2 - Document ID: US9437523B2 - Status: Granted - Kind: B2 - Application number: 14/291,686 - Filed: 2014-05-30 - Published: 2015-12-03 - Granted: 2016-09-06 - Earliest claimed: 2014-05-30 - Assignees: Toyota Motor Engineering & Manufacturing North America, Inc. - Applicants: Toyota Motor Engineering & Manufacturing North America, Inc. - Inventors: Shailesh N. Joshi; Ercan M. Dede - Web page: https://patentgrep.com/patent/US9437523B2 ## CPC - H10W 40/475: {using jet impingement (H10W40/776 takes precedence)} - H10W 90/00: Package configurations - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract Power electronics modules having jet impingement assemblies utilized to cool heat generating devices are disclosed. In one embodiment, a jet impingement assembly includes coupled manifold plates having a fluid inlet and outlet, a distribution surface, and a collection surface. The distribution surface of the first and second manifold plate is coupled to define a distribution manifold having a fluid distribution channel and one or more arrays of orifices extending through both manifold plates. Heat transfer plates are coupled to each manifold plate's collection surface forming impingement chambers. The heat transfer plates include one or more arrays of fins extending toward the collection surface of each manifold plate fluidly coupled to the fluid outlet. The first and second manifold plates and the first and second heat transfer plates are positioned in a horizontal stack such that the fluid inlets of both manifold plates are adjacent. ## Claims ### Claim 1 A jet impingement assembly comprising: a first manifold plate coupled to a second manifold plate, wherein the first manifold plate and the second manifold plate each comprise: a fluid inlet; a fluid outlet; a distribution surface comprising a fluid distribution channel in fluid communication with the fluid inlet; a collection surface comprising a fluid collection channel in fluid communication with the fluid outlet, wherein the distribution surface of the first manifold plate is coupled to the distribution surface of the second manifold plate such that the fluid distribution channel of the first manifold plate and the fluid distribution channel of the second manifold plate define a distribution manifold; a variable slotted channel fluidly coupled to the fluid outlet at the distribution surface; and an array of orifices extending from the distribution surface to the collection surface; a first heat transfer plate coupled to the collection surface of the first manifold plate such that the first heat transfer plate and the collection surface of the first manifold plate form a first impingement chamber, the first heat transfer plate comprising an array of fins that extends toward the collection surface of the first manifold plate; and a second heat transfer plate coupled to the collection surface of the second manifold plate such that the second heat transfer plate and the collection surface of the second manifold plate form a second impingement chamber, the second heat transfer plate comprising an array of fins that extends toward the collection surface of the second manifold plate; wherein the first manifold plate, the second manifold plate, the first heat transfer plate, and the second heat transfer plate are positioned in a horizontal stack such that the fluid inlet of the first manifold plate is adjacent to the fluid inlet of the second manifold plate. ### Claim 2 (depends on 1) The jet impingement assembly of claim 1 wherein the variable slotted channel is fluidly coupled to an outlet channel positioned on the distribution surface of the manifold plate such that the variable slotted channel provides fluid communication between the fluid collection channel and the fluid outlet. ### Claim 3 (depends on 1) The jet impingement assembly of claim 1 wherein a height of the variable slotted channel increases from an inlet side of the variable slotted channel to an outlet side of the variable slotted channel. ### Claim 4 (depends on 1) The jet impingement assembly of claim 1 wherein the fluid inlet is positioned diagonally from the fluid outlet. ### Claim 5 (depends on 1) The jet impingement assembly of claim 1 wherein one or more walls of the fluid distribution channel further comprise a contour configured to provide uniform fluid velocity of a coolant fluid flowing through the fluid distribution channel. ### Claim 6 (depends on 1) The jet impingement assembly of claim 1 wherein an array of fluid distribution features is aligned with the array of orifices to provide uniform fluid velocity of a coolant fluid flowing through the array of orifices. ### Claim 7 (depends on 1) The jet impingement assembly of claim 1 wherein multiple arrays of orifices are positioned on each manifold plate and multiple arrays of fins are positioned on each heat transfer plate such that each individual array of orifices is positioned proximate an individual array of fins. ### Claim 8 A power electronics module comprising: a jet impingement assembly comprising: a first manifold plate coupled to a second manifold plate, wherein the first manifold plate and the second manifold plate each comprise: a fluid inlet; a fluid outlet; a distribution surface comprising a fluid distribution channel in fluid communication with the fluid inlet; a collection surface comprising a fluid collection channel in fluid communication with the fluid outlet, wherein the distribution surface of the first manifold plate is coupled to the distribution surface of the second manifold plate such that the fluid distribution channel of the first manifold plate and the fluid distribution channel of the second manifold plate define a distribution manifold; a variable slotted channel fluidly coupled to the fluid outlet at the distribution surface; and an array of orifices extending from the distribution surface to the collection surface; a first heat transfer plate coupled to the collection surface of the first manifold plate such that the first heat transfer plate and the collection surface of the first manifold plate form a first impingement chamber, the first heat transfer plate comprising an array of fins that extends toward the collection surface of the first manifold plate; and a second heat transfer plate coupled to the collection surface of the second manifold plate such that the second heat transfer plate and the collection surface of the second manifold plate form a second impingement chamber, the second heat transfer plate comprising an array of fins that extends toward the collection surface of the second manifold plate; wherein the first manifold plate, the second manifold plate, the first heat transfer plate, and the second heat transfer plate are positioned in a horizontal stack such that the fluid inlet of the first manifold plate is adjacent to the fluid inlet of the second manifold plate; a first electronics device positioned in contact with the first heat transfer plate opposite the array of fins; and a second electronics device positioned in contact with the second heat transfer plate opposite the array of fins. ### Claim 9 (depends on 8) The power electronics module of claim 8 wherein the variable slotted channel is fluidly coupled to an outlet channel positioned on the distribution surface of the manifold plate such that the variable slotted channel provides fluid communication between the fluid collection channel and the fluid outlet. ### Claim 10 (depends on 8) The power electronics module of claim 8 wherein a height of the variable slotted channel increases from an inlet side of the variable slotted channel to an outlet side of the variable slotted channel. ### Claim 11 (depends on 8) The power electronics module of claim 8 wherein the fluid inlet is positioned diagonally from the fluid outlet. ### Claim 12 (depends on 8) The power electronics module of claim 8 wherein one or more walls of the fluid distribution channel further comprise a contour configured to provide uniform fluid velocity of a coolant fluid flowing through the fluid distribution channel. ### Claim 13 (depends on 8) The power electronics module of claim 8 wherein an inlet pipe extends between the fluid inlet of the first manifold plate and the fluid inlet of the second manifold plate and an outlet pipe extends between the fluid outlet of the first manifold plate and the fluid outlet of the second manifold plate. ### Claim 14 (depends on 8) The power electronics module of claim 8 wherein the first electronics device and the second electronics device each comprise a semiconductor device. ### Claim 15 A power electronics module comprising: a plurality of jet impingement assemblies, each jet impingement assembly comprising: a first manifold plate coupled to a second manifold plate, wherein the first manifold plate and the second manifold plate each comprise: a fluid inlet; a fluid outlet; a distribution surface comprising a fluid distribution channel in fluid communication with the fluid inlet; a collection surface comprising a fluid collection channel in fluid communication with the fluid outlet, wherein the distribution surface of the first manifold plate is coupled to the distribution surface of the second manifold plate such that the fluid distribution channel of the first manifold plate and the fluid distribution channel of the second manifold plate define a distribution manifold; a variable slotted channel fluidly coupled to the fluid outlet at the distribution surface; and an array of orifices extending from the distribution surface to the collection surface; a first heat transfer plate coupled to the collection surface of the first manifold plate such that the first heat transfer plate and the collection surface of the first manifold plate form a first impingement chamber, the first heat transfer plate comprising an array of fins that extends toward the collection surface of the first manifold plate; and a second heat transfer plate coupled to the collection surface of the second manifold plate such that the second heat transfer plate and the collection surface of the second manifold plate form a second impingement chamber, the second heat transfer plate comprising an array of fins that extends toward the collection surface of the second manifold plate; wherein the first manifold plate, the second manifold plate, the first heat transfer plate, and the second heat transfer plate are positioned in a horizontal stack such that the fluid inlet of the first manifold plate is adjacent to the fluid inlet of the second manifold plate, wherein the plurality of jet impingement assemblies are interleaved such that each jet impingement assembly is adjacent to at least one other jet impingement assembly, the fluid inlets of adjacent jet impingement assemblies are aligned, and the fluid outlets of adjacent jet impingement assemblies are aligned; and at least one electronics device is positioned between adjacent jet impingement assemblies. ### Claim 16 (depends on 15) The power electronics module of claim 15 wherein the variable slotted channel is fluidly coupled to an outlet channel positioned on the distribution surface of the manifold plate such that the variable slotted channel provides fluid communication between the fluid collection channel and the fluid outlet. ### Claim 17 (depends on 15) The power electronics module of claim 15 wherein a height of the variable slotted channel increases from an inlet side of the variable slotted channel to an outlet side of the variable slotted channel. ### Claim 18 (depends on 15) The power electronics module of claim 15 wherein the fluid inlet is positioned diagonally from the fluid outlet. ### Claim 19 (depends on 15) The power electronics module of claim 15 wherein an inlet pipe extends between at least two fluid inlets and an outlet pipe extends between at least two fluid outlets. ### Claim 20 (depends on 15) The power electronics module of claim 15 wherein the at least one electronics device comprises a semiconductor device.