# US 9,437,522 B2 · Semiconductor device and method for manufacturing semiconductor device

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- Number: US 9,437,522 B2
- Document ID: US9437522B2
- Status: Granted
- Kind: B2
- Application number: 14/126,077
- Filed: 2012-04-27
- Published: 2014-08-14
- Granted: 2016-09-06
- Earliest claimed: 2011-06-17
- Assignees: Calsonic Kansei Corporation
- Applicants: Toshikazu Yoshihara; Satoshi Tamagawa; Yasuyuki Oi; Hideki Kobayashi
- Inventors: Toshikazu Yoshihara; Satoshi Tamagawa; Yasuyuki Oi; Hideki Kobayashi
- Web page: https://patentgrep.com/patent/US9437522B2

## CPC

- H10W 40/47: by flowing liquids, e.g. forced water cooling
- H10W 40/778: {in encapsulations}
- H10W 95/00: Packaging processes not covered by the other groups of this subclass
- H10W 74/114: {by a substrate and the encapsulations}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor device according to the present invention has a semiconductor module 2; a cooling unit 3, the semiconductor module 2 being joined to an upper surface of the cooling unit 3, and a pipe 14, 15 for circulating a refrigerant being fixed to a side surface 20, 22 of the cooling unit 3; and a resin mold layer 4 that covers outer peripheries of the semiconductor module 2 and the cooling unit 3. Further, a protruding portion 25, 26 that protrudes from the side surface 20, 22 of the cooling unit 3 and surrounds the pipe 14, 15 is provided on the side surface 20, 22 of the cooling unit 3.

## Claims

### Claim 1

A semiconductor device comprising:
a semiconductor module;
a cooling unit, the semiconductor module being joined to an upper surface of the cooling unit, and a pipe for circulating a refrigerant being fixed to aside surface of the cooling unit;
a resin mold layer that covers outer peripheries of the semiconductor module and the cooling unit, a peripheral surface of the resin mold layer being exposed; and
a protruding portion that is provided on the side surface of the cooling unit and protrudes from the resin mold layer and surrounds the pipe.

### Claim 2 (depends on 1)

The semiconductor device as claimed in claim 1, wherein:
a groove is formed close to an outer peripheral edge of the protruding portion, and
a protruding line is provided at an outer side of the groove.

### Claim 3 (depends on 1)

The semiconductor device as claimed in claim 1, wherein:
an outside shape of the protruding portion is set so that a width of the protruding portion gradually narrows or widens from an upper surface side toward a bottom surface side of the cooling unit.

### Claim 4 (depends on 1)

The semiconductor device as claimed in claim 1, wherein;
the cooling unit has a heat sink, a jacket and a pipe.

### Claim 5 (depends on 4)

The semiconductor device as claimed in claim 4, wherein:
the heat sink has a base portion and a heat radiating fin, and
the heat radiating fin protrudes from a lower surface side of the base portion, and the semiconductor module is joined to an upper surface of the base portion.

### Claim 6 (depends on 5)

The semiconductor device as claimed in claim 5, wherein:
the jacket has a box shape whose one surface is open, and has an accommodating portion that accommodates therein the heat radiating fin, and
the one surface of the jacket is closed by the base portion of the heat sink with the heat radiating fin accommodated in the accommodating portion.