# US 9,437,521 B2 · Thermally conductive sheet

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- Number: US 9,437,521 B2
- Document ID: US9437521B2
- Status: Granted
- Kind: B2
- Application number: 14/989,686
- Filed: 2016-01-06
- Published: 2016-04-28
- Granted: 2016-09-06
- Earliest claimed: 2013-07-10
- Assignees: Dexerials Corporation
- Applicants: Dexerials Corporation
- Inventors: Keisuke Aramaki; Takuhiro Ishii; Masahiko Ito; Shinichi Uchida; Atsuya Yoshinari; Syunsuke Uchida
- Web page: https://patentgrep.com/patent/US9437521B2

## CPC

- H10W 40/251: {Organics}
- B29C 48/0022: {combined with cutting}
- C08L 83/00: Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L 83/04: Polysiloxanes
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/257: {having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence)}
- B29L 2031/18: Heat-exchangers or parts thereof
- C08G 77/12: containing silicon bound to hydrogen
- C08G 77/20: containing silicon bound to unsaturated aliphatic groups
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- B29L: INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS

## Abstract

A thermally conductive sheet, comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, wherein the thermally conductive sheet has a compressibility of 40% or more.

## Claims

### Claim 1

A thermally conductive sheet comprising:
a curable resin composition;
thermally conductive fibers; and
thermally conductive particles,
wherein the thermally conductive sheet has a thickness of more than 1.5 mm and 3.0 mm or less,
wherein the thermally conductive sheet has a compressibility of 40% or more, and has a minimum value of a thermal resistance in a load range of 0.5 kgf/cm2 or more and 3 kgf/cm2 or less, and
wherein the thermally conductive sheet has a peak value of a thermal conductivity of 15 W/mK or more in the compressibility thereof of 20% or less.

### Claim 2 (depends on 1)

The thermally conductive sheet according to claim 1, wherein
the thermally conductive sheet has a maximum compression stress of less than 780 N when the thermally conductive sheet is compressed by 40% at a rate of 25 mm/min or less.

### Claim 3 (depends on 1)

The thermally conductive sheet according to claim 1, wherein
the thermally conductive sheet has a residual stress of less than 204 N when the thermally conductive sheet is compressed by 40% at a rate of 25 mm/min or less and is held for 10 min in a state of being compressed by 40%.

### Claim 4 (depends on 1)

The thermally conductive sheet according to claim 1, wherein
the curable resin composition is a two-part addition reaction type liquid silicone resin of a silicone base resin and a curing agent; and the silicone base resin and the curing agent are blended at a ratio (silicone base resin:curing agent) of 5:5 to 6:4.

### Claim 5 (depends on 1)

The thermally conductive sheet according to claim 1, wherein
the thermally conductive fibers have an average fiber length of 50 μm or more and 250 μm or less.

### Claim 6 (depends on 1)

The thermally conductive sheet according to claim 1, wherein the thermally conductive sheet has a peak value of a thermal conductivity of 20 W/mK or more in the compressibility thereof of 20% or less.

### Claim 7 (depends on 1)

The thermally conductive sheet according to claim 1, wherein
the thermally conductive sheet has a content of the thermally conductive particles and the thermally conductive fibers of 70% by volume or less.

### Claim 8 (depends on 1)

The thermally conductive sheet according to claim 1, wherein
the thermally conductive sheet is made by cutting a columnar cured product obtained by extruding a thermally conductive composition comprising the curable resin composition, the thermally conductive fibers and the thermally conductive particles, in a substantially perpendicular direction to a longitudinal direction of the columnar cured product.

### Claim 9 (depends on 1)

A device comprising:
a heat source;
a heat-dissipating member; and
the thermally conductive sheet according to claim 1 interposed between the heat source and the heat-dissipating member.

### Claim 10 (depends on 9)

The device according to claim 9, wherein
the thermally conductive sheet has a thermal resistance of less by 3% or more than an initial value of the thermal resistance of the thermally conductive sheet interposed between the heat source and the heat-dissipating member.

### Claim 11

A method for producing a thermally conductive sheet, the method comprising:
extruding a thermally conductive composition comprising a curable resin composition, thermally conductive fibers and thermally conductive particles; and
cutting an extruded columnar cured product in a substantially perpendicular direction to a longitudinal direction of the extruded columnar cured product to thereby obtain the thermally conductive sheet,
wherein in the cutting, the extruded columnar cured product is cut to have a predetermined thickness of more than 1.5 mm and 3.0 mm or less so that the thermally conductive sheet exhibits a maximum compression stress of less than 780 N when the thermally conductive sheet is compressed by 40% at a rate of 25 mm/min or less, and the thermally conductive sheet has a peak value of a thermal conductivity of 15 W/mK or more in a compressibility thereof of 20% or less.

### Claim 12 (depends on 11)

The method for producing a thermally conductive sheet according to claim 11, wherein
in the cutting, the extruded columnar cured product is cut to have the predetermined thickness so that the thermally conductive sheet exhibits a residual stress of less than 204 N when the thermally conductive sheet is compressed by 40% at a rate of 25 mm/min or less and held for 10 min in a state of being compressed by 40%.

### Claim 13 (depends on 11)

The method for producing a thermally conductive sheet according to claim 11, wherein
in the cutting, the extruded columnar cured product is cut to have the predetermined thickness so that the thermally conductive sheet exhibits a thermal resistance of 2.0 K·cm2/W or less in a load range of 0.5 kgf/cm2 or more and 7.5 kgf/cm2 or less.

### Claim 14 (depends on 11)

The method for producing a thermally conductive sheet according to claim 11, further comprising pressing the thermally conductive sheet cut in the substantially perpendicular direction, wherein
the pressing is carried out so that the thermally conductive sheet has a thermal resistance of 2.0 K·cm2/W or less in a load range of 0.5 kgf/cm2 or more and 7.5 kgf/cm2 or less.

### Claim 15 (depends on 14)

The method for producing a thermally conductive sheet according to claim 14, wherein
the pressing is carried out at a pressure of 0.1 MPa or more and 30 MPa or less.

### Claim 16 (depends on 14)

The method for producing a thermally conductive sheet according to claim 14, wherein
the pressing is carried out at a temperature of room temperature or more and 140° C. or less.

### Claim 17 (depends on 11)

A thermally conductive sheet which is obtained by the method for producing a thermally conductive sheet according to claim 11.

### Claim 18 (depends on 17)

A device comprising:
a heat source;
a heat-dissipating member; and
the thermally conductive sheet according to claim 17 interposed between the heat source and the heat-dissipating member.

### Claim 19 (depends on 18)

The device according to claim 18, wherein
the thermally conductive sheet has a thermal resistance of less by 3% or more than an initial value of the thermal resistance of the thermally conductive sheet interposed between the heat source and the heat-dissipating member.