# US 9,437,520 B2 · Semiconductor device including a semiconductor element and a fixed member to which the semiconductor element is fixed

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- Number: US 9,437,520 B2
- Document ID: US9437520B2
- Status: Granted
- Kind: B2
- Application number: 14/774,444
- Filed: 2013-03-13
- Published: 2016-01-28
- Granted: 2016-09-06
- Earliest claimed: 2013-03-13
- Assignees: Toyota Jidosha Kabushiki Kaisha
- Applicants: Norimune Orimoto; Makoto Imai
- Inventors: Norimune Orimoto; Makoto Imai
- Web page: https://patentgrep.com/patent/US9437520B2

## CPC

- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/10: Arrangements for heating
- H10W 42/121: {protecting against mechanical damage (H10W76/00, H10W74/00 take precedence)}
- H10W 70/68: Shapes or dispositions thereof
- H10W 72/073: {of die-attach connectors}
- H10W 72/07323: {Active alignment, e.g. using optical alignment using marks or sensors}
- H10W 72/07336: {Soldering or alloying}
- H10W 72/07352: {changes in structures or sizes}
- H10W 72/07354: {changes in dispositions}
- H10W 72/321: {Structures or relative sizes of die-attach connectors}
- H10W 72/342: {relative to the surface, e.g. recessed, protruding}
- H10W 72/344: {relative to underlying supporting features, e.g. bond pads, RDLs or vias}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/387: {Flow barriers}
- H10W 72/931: {Shapes of bond pads}
- H10W 72/952: {comprising metals or metalloids, e.g. PbSn, Ag or Cu}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor device includes a semiconductor element having a rectangular shape in a plan view, and a fixed member to which the semiconductor element is fixed. The semiconductor element is disposed so that a rectangular face of the semiconductor element is faced toward a surface of the fixed member. A part of the rectangular face of the semiconductor element is fixed to the surface of the fixed member. At least corner parts of the rectangular face of the semiconductor element are not fixed to the surface of the fixed member.

## Claims

### Claim 1

A semiconductor device comprising:
a semiconductor element having a rectangular shape in a plan view; and
a fixed member to which the semiconductor element is fixed, wherein
the semiconductor element is disposed so that a rectangular face of the semiconductor element is faced toward a surface of the fixed member,
a part of the rectangular face of the semiconductor element is fixed to the surface of the fixed member with a joint material,
a dent having a pointed bottom is provided on the surface of the fixed member at a position corresponding to each of the corner parts of the rectangular face of the semiconductor element, and
at least corner parts of the rectangular face of the semiconductor element are not fixed to the surface of the fixed member.

### Claim 2 (depends on 1)

The semiconductor device according to claim 1, wherein
the pointed bottom of each of the dents is positioned inside the corresponding dent in a plan view of the fixed member.

### Claim 3 (depends on 2)

The semiconductor device according to claim 2, wherein
each of the dents has a semi-conical shape, a conical shape, an elliptic conical shape, or a polygonal pyramid shape.

### Claim 4 (depends on 2)

The semiconductor device according to claim 2, wherein
each of the dents has a three-sided pyramid shape.

### Claim 5 (depends on 4)

The semiconductor device according to claim 4, wherein
each of the dents includes a center-sided face positioned on a center side of the semiconductor element, and
an angle formed by the center-sided face of each of the dents and a surface of the fixed member is less than 45 degrees.

### Claim 6 (depends on 1)

The semiconductor device according to claim 1, wherein
each of the dents has a semi-conical shape, a conical shape, an elliptic conical shape, or a polygonal pyramid shape.

### Claim 7 (depends on 1)

The semiconductor device according to claim 1, wherein
each of the dents has a three-sided pyramid shape.

### Claim 8 (depends on 7)

The semiconductor device according to claim 7, wherein
each of the dents includes a center-sided face positioned on a center side of the semiconductor element, and
an angle formed by the center-sided face of each of the dents and a surface of the fixed member is less than 45 degrees.