# US 9,437,515 B2 · Heat spreading layer with high thermal conductivity

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- Number: US 9,437,515 B2
- Document ID: US9437515B2
- Status: Granted
- Kind: B2
- Application number: 14/838,524
- Filed: 2015-08-28
- Published: 2015-12-24
- Granted: 2016-09-06
- Earliest claimed: 2013-03-22
- Assignees: International Business Machines Corporation
- Applicants: International Business Machines Corporation
- Inventors: Evan G. Colgan; Taryn J. Davis; Chenzhou Lian; Yi Pan; Kamal K. Sikka; Jeffrey A. Zitz
- Web page: https://patentgrep.com/patent/US9437515B2

## CPC

- H10W 40/00: Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60)
- H05K 7/20509: {Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures}
- H10W 40/10: Arrangements for heating
- H10W 40/22: characterised by their shape, e.g. having conical or cylindrical projections
- H10W 40/25: characterised by their materials
- H10W 72/865: {Die-attach connectors and bond wires}
- H10W 72/877: {Bump connectors and die-attach connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/15: on active surfaces of flip-chip devices, e.g. underfills
- H10W 90/00: Package configurations
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

Embodiments of the invention comprise a homogeneous heat spreading cap element in chip packages to facilitate better heat spreading and dissipation. The heat spreading cap comprises a single high-K graphite layer supported by a copper frame for increased stability and reduced thermal warpage during handling and operation while minimizing thermal penalty by reducing the amount of material having a relatively low heat conductivity that is needed in conventional heat spreading caps.

## Claims

### Claim 1

A cooling system for a semiconductor package comprising:
a heat spreading layer comprised of graphite partially encased in a supporting frame comprised of copper and wherein the heat spreading layer is affixed to the supporting frame with an adhesive layer, the heat spreading layer including a perimeter, the supporting frame being configured to encase the perimeter and an adjacent portion of the heat spreading layer, defining centrally exposed top and bottom portions of the heat spreading layer; and
a chip die thermally connected to the centrally exposed bottom portion of the heat spreading layer by a first thermal interface material, and further comprising a heat dissipating element thermally connected to a top surface of the heat spreading layer by a second thermal interface material, the heat dissipating element having a centrally protruding portion on a bottom surface thereof, wherein the centrally protruding portion is beveled.