# US 9,437,509 B2 · Package for electronic components suppressing multipactor discharge

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- Number: US 9,437,509 B2
- Document ID: US9437509B2
- Status: Granted
- Kind: B2
- Application number: 14/673,328
- Filed: 2015-03-30
- Published: 2015-10-01
- Granted: 2016-09-06
- Earliest claimed: 2014-03-31
- Assignees: Sumitomo Electric Device Innovations, Inc.
- Applicants: Sumitomo Electric Device Innovations, Inc.
- Inventors: Ken Osawa; Harutoshi Saigusa
- Web page: https://patentgrep.com/patent/US9437509B2

## CPC

- H10W 76/134: having other interconnections parallel to the conductive base
- H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
- H10W 72/5522: {comprising gold [Au]}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A package for electronic components that suppresses multipactor discharge is disclosed. The package includes a metal base and a casing. The metal base provides a pocket in the side thereof. The casing, mounted on the metal base to surround electronic components therein, provides a lead terminal connecting the electronic components to the outside and a feedthrough to isolate the lead terminal from the metal base. The pocket in the metal base is positioned beneath the lead terminal with an insulator therebetween.

## Claims

### Claim 1

A package for enclosing electronic components, comprising:
an electrically conductive base having a top surface that mounts the electronic components thereon;
a casing provided on the top surface of the base, the casing surrounding the electronic components therein; and
a feedthrough including an insulator and a conductive pattern formed on the insulator, the feedthrough passing through the casing,
wherein the base provides a pocket cut from an edge thereof the pocket being positioned beneath the feedthrough.

### Claim 2 (depends on 1)

The package of claim 1,
further comprising a lead terminal extending outward from the conductive pattern in a portion outside of the casing, wherein the pocket has a width perpendicular to a direction of the lead terminal wider than or equal to a width of the insulator perpendicular to the lead terminal.

### Claim 3 (depends on 2)

The package of claim 2,
wherein the conductive pattern has an outer edge retreated from an outer edge of the insulator, and the lead terminal forms a gap against the insulator at a portion where the conductive pattern is retreated.

### Claim 4 (depends on 3)

The package of claim 3,
wherein the lead terminal has a reversed U-shape curved upwardly at the outer edge of the insulator.

### Claim 5 (depends on 2)

The package of claim 2,
wherein the lead terminal is fixed to the conductive pattern with brazing metal.

### Claim 6 (depends on 2)

The package of claim 2,
wherein the lead terminal has a width perpendicular to the lead terminal narrower than a width of the conductive pattern perpendicular to the lead terminal, and the width of the conductive pattern is narrower than the width of the insulator.

### Claim 7 (depends on 1)

The package of claim 1,
wherein the conductive pattern has an outer edge aligned with an outer edge of the insulator.

### Claim 8 (depends on 1)

The package of claim 1,
wherein the base provides a bottom surface opposite to the top surface, the pocket being cut from the bottom surface to the top surface.

### Claim 9 (depends on 8)

The package of claim 8,
wherein the pocket provides a top end, a bottom end, and a deep end, the top end matching with the top surface of the base, the bottom end matching with the bottom surface of the base, and the deep end being in a position corresponding to the position on the top surface of the base outside from the casing.

### Claim 10 (depends on 1)

The package of claim 1,
wherein the casing is made of metal.

### Claim 11 (depends on 10)

The package of claim 10,
wherein the feedthrough has another insulator surrounding the conductive pattern accompanied with the insulator at the casing.

### Claim 12 (depends on 1)

The package of claim 1,
wherein the electronic components include a field effect transistor (FET) including nitride semiconductor materials, the FET outputting a high frequency signal with power exceeding 100 W.

### Claim 13 (depends on 1)

The package of claim 1,
wherein the insulator is made of ceramics.