# US 9,437,489 B2 · Method of manufacturing a wiring substrate

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- Number: US 9,437,489 B2
- Document ID: US9437489B2
- Status: Granted
- Kind: B2
- Application number: 14/095,182
- Filed: 2013-12-03
- Published: 2014-03-27
- Granted: 2016-09-06
- Earliest claimed: 2010-05-07
- Assignees: Seiko Epson Corporation
- Applicants: Seiko Epson Corporation
- Inventors: Tsuyoshi Yoda
- Web page: https://patentgrep.com/patent/US9437489B2

## CPC

- H10W 20/023: {the interconnections being through-semiconductor vias}
- B81B 7/0006: {Interconnects}
- G01C 19/56: Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C 19/5776: Signal processing not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
- H05K 3/225: {Correcting or repairing of printed circuits (H05K1/0292, H05K3/222, H05K3/288, H05K3/4685 take precedence)}
- H05K 3/321: by conductive adhesives
- H05K 3/4038: {Through-connections; Vertical interconnect access [VIA] connections (H05K3/403, H05K3/42 take precedence)}
- H05K 3/429: {Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers}
- H05K 3/462: {characterized by laminating only or mainly similar double-sided circuit boards}
- H10W 20/0234: {comprising etching via holes that stop on pads or on electrodes}
- H10W 20/0242: {comprising etching via holes from the back sides of the chips, wafers or substrates}
- H10W 20/056: {by filling conductive material into holes, grooves or trenches}
- H10W 20/20: Interconnections within wafers or substrates, e.g. through-silicon vias [TSV]
- H10W 20/2125: {Top-view shapes}
- B81B 2201/0242: Gyroscopes
- B81B 2201/0271: Resonators; ultrasonic resonators
- Y10T 29/49126: Assembling bases
- Y10T 29/49128: Assembling formed circuit to base
- Y10T 29/49139: by inserting component lead or terminal into base aperture
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)
- G01C: MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY (measuring liquid level G01F; radio navigation, determining distance or velocity by use of propagation effects, e.g. Doppler effects, propagation time, of radio waves, analogous arrangements using other waves G01S)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method of manufacturing a wiring substrate including a step of forming a through hole that includes forming a first concave portion in a substrate that extends from a second surface to a first insulating layer without passing through the first insulating layer; forming a second insulating layer at least within the first concave portion; and forming a second concave portion through the second insulating layer and the first insulating layer to expose a surface of a pad electrode, wherein the second concave portion is formed within the first concave portion; and filling the first concave portion and the second concave portion with a conductive body or forming the conductive body to coat inner walls of the first concave portion and the second concave portion, and forming the through electrode such that it is connected to the pad electrode.

## Claims

### Claim 1

A method of manufacturing a wiring substrate which includes a substrate which has a first surface and a second surface, a first insulating layer which is stacked on the first surface of the substrate, a pad electrode which is formed on the first insulating layer, and a through electrode which passes through the substrate and the first insulating layer, comprising:
forming a through hole which passes through the substrate toward the pad electrode from the second surface of the substrate, the step of forming the through hole including:
forming a first concave portion in the substrate that extends from the second surface to the first insulating layer without passing through the first insulating layer;
forming a second insulating layer at least within the first concave portion; and
forming a second concave portion through the second insulating layer and the first insulating layer to expose a surface of the pad electrode, the second concave portion being formed within the first concave portion; and
filling the first concave portion and the second concave portion with a conductive body or forming the conductive body to coat inner walls of the first concave portion and the second concave portion, and forming the through electrode such that the through electrode is connected to the pad electrode.

### Claim 2 (depends on 1)

The method according to claim 1,
wherein the first insulating layer and the second insulating layer are formed of different materials.

### Claim 3 (depends on 2)

The method according to claim 2,
wherein the first insulating layer is removed by dry etching when the second concave portion is formed.