# US 9,437,458 B2 · Method of electrically isolating leads of a lead frame strip > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,437,458 B2 - Document ID: US9437458B2 - Status: Granted - Kind: B2 - Application number: 14/077,742 - Filed: 2013-11-12 - Published: 2015-05-14 - Granted: 2016-09-06 - Earliest claimed: 2013-11-12 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Nee Wan Khoo; Vigneswaran Letcheemana - Web page: https://patentgrep.com/patent/US9437458B2 ## CPC - H10P 54/00: Cutting or separating of wafers, substrates or parts of devices - B23K 26/361: for deburring or mechanical trimming (B23K26/351 takes precedence) - B23K 26/362: Laser etching - B23K 26/40: taking account of the properties of the material involved - B23K 26/402: involving non-metallic material, e.g. isolators - H10W 70/041: {Connecting or disconnecting interconnections to or from leadframes, e.g. connecting bond wires or bumps} - H10W 70/048: {Mechanical treatments, e.g. punching, cutting, deforming or cold welding} - H10W 74/014: {using batch processing} - B23K 2101/40: Semiconductor devices - B23K 2103/166: {Multilayered materials} - B23K 2103/50: {Inorganic materials other than metals or composite materials} - H10P 74/207: {Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics} - H10W 72/0198: {batch processes} - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 ## Abstract A lead frame strip includes a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame. The lead frame strip is processed by attaching a semiconductor die to each of the die paddles and covering the unit lead frames with a molding compound after the semiconductor dies are attached to the die paddles. Spaced apart cuts are formed in the periphery of each unit lead frame that sever the leads from the periphery of each unit lead frame and extend at least partially into the molding compound in regions of the periphery where the leads are located so that the molding compound remains intact between the cuts. The lead frame strip is processed after the cuts are formed, and the unit lead frames are later separated into individual packages. ## Claims ### Claim 1 A method of processing a lead frame strip including a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame, the method comprising: attaching a semiconductor die to each of the die paddles; covering the unit lead frames with a molding compound after the semiconductor dies are attached to the die paddles; forming spaced apart cuts in the periphery of each unit lead frame that sever the leads from the periphery of each unit lead frame and extend at least partially into the molding compound in regions of the periphery where the leads are located so that the molding compound remains intact between the cuts, wherein the spaced apart cuts are formed in the periphery of each unit lead frame by directing a pressurized liquid stream at the regions of the periphery of each unit lead frame where the leads are located to cut through the leads in these regions; processing the lead frame strip after the cuts are formed in the periphery of each unit lead frame; and cutting the entire periphery of each unit lead frame after the processing of the lead frame strip to separate the unit lead frames into individual packages using a saw blade, wherein a width of the cuts made in the periphery of each unit lead frame by the pressurized liquid stream is narrower than a width of the saw blade. ### Claim 2 (depends on 1) The method of claim 1, further comprising: placing a mask on the lead frame strip that covers the unit lead frames, the mask having cutouts over the regions of the periphery of each unit lead frame where the leads are located so that the pressurized liquid stream is blocked from cutting regions of the molding compound protected by the mask. ### Claim 3 (depends on 2) The method of claim 2, wherein the mask comprises carbonite or ceramic. ### Claim 4 (depends on 2) The method of claim 2, further comprising: varying a rate of movement of the pressurized liquid stream around the periphery of each unit lead frame so that the pressurized liquid stream is directed at the cutouts in the mask for a longer period of time than at the mask. ### Claim 5 (depends on 1) The method of claim 1, further comprising: varying a rate of movement of the pressurized liquid stream around the periphery of each unit lead frame so that the pressurized liquid stream is directed at the regions of the periphery where the leads are located for a longer period of time than in other regions around the periphery, to cut through the leads and the molding compound in the regions of the periphery where the leads are located and leave the molding compound at least partly intact in the other regions around the periphery. ### Claim 6 (depends on 1) The method of claim 1, wherein the width of the cuts made in the periphery of each unit lead frame by the pressurized liquid stream is 0.25 mm or less and the width of the saw blade is 0.3 mm or greater. ### Claim 7 (depends on 1) The method of claim 1, wherein processing the lead frame strip after forming the cuts in the periphery of each unit lead frame comprises: testing the semiconductor dies by probing the leads after the cuts are formed in the periphery of each unit lead frame. ### Claim 8 (depends on 1) The method of claim 1, further comprising: forming additional spaced apart cuts in the periphery of each unit lead frame that sever tie bars connecting adjacent ones of the die paddles from the periphery of each unit lead frame and extend at least partially into the molding compound in regions of the periphery where the tie bars are located so that the molding compound remains intact between the additional cuts, wherein the lead frame strip is processed after the additional cuts are formed in the periphery of each unit lead frame. ### Claim 9 A method of processing a lead frame strip including a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame, the method comprising: attaching a semiconductor die to each of the die paddles; covering the unit lead frames with a molding compound after the semiconductor dies are attached to the die paddles; placing a temporary mask on the lead frame strip that covers the unit lead frames, the temporary mask having cutouts over the regions of the periphery of each unit lead frame where the leads that are to be cut by a pressurized liquid stream are located, the temporary mask blocking regions of the molding compound that are not to be cut by the pressurized liquid stream; forming spaced apart cuts in the periphery of each unit lead frame that sever the leads from the periphery of each unit lead frame and extend at least partially into the molding compound in regions of the periphery where the leads are located so that the molding compound remains intact between the cuts, wherein the spaced apart cuts are formed in the periphery of each unit lead frame by directing the pressurized liquid stream through the cutouts in the temporary mask at the regions of the periphery of each unit lead frame where the leads are located to cut through the leads in these regions; removing the temporary mask after the forming of the spaced apart cuts; and processing the lead frame strip after the cuts are formed in the periphery of each unit lead frame. ### Claim 10 (depends on 9) The method of claim 9, wherein the mask comprises carbonite or ceramic. ### Claim 11 (depends on 9) The method of claim 9, further comprising: varying a rate of movement of the pressurized liquid stream around the periphery of each unit lead frame so that the pressurized liquid stream is directed at the cutouts in the mask for a longer period of time than at the mask. ### Claim 12 A method of processing a lead frame strip including a plurality of connected unit lead frames, each unit lead frame having a die paddle and a plurality of leads connected to a periphery of the unit lead frame, the method comprising: attaching a semiconductor die to each of the die paddles; covering the unit lead frames with a molding compound after the semiconductor dies are attached to the die paddles; forming spaced apart cuts in the periphery of each unit lead frame that sever the leads from the periphery of each unit lead frame and extend at least partially into the molding compound in regions of the periphery where the leads are located so that the molding compound remains intact between the cuts, wherein the spaced apart cuts are formed in the periphery of each unit lead frame by directing a pressurized liquid stream at the regions of the periphery of each unit lead frame where the leads are located to cut through the leads in these regions; varying a rate of movement of the pressurized liquid stream so as to direct the pressurized liquid stream at the regions of the periphery where the leads are located for a longer period of time than in other regions around the periphery, to cut through the leads and the molding compound in the regions of the periphery where the leads are located and leave the molding compound at least partly intact in the other regions around the periphery; and processing the lead frame strip after the cuts are formed in the periphery of each unit lead frame.