# US 9,437,457 B2 · Chip package having a patterned conducting plate and method for forming the same

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- Number: US 9,437,457 B2
- Document ID: US9437457B2
- Status: Granted
- Kind: B2
- Application number: 14/015,012
- Filed: 2013-08-30
- Published: 2015-03-05
- Granted: 2016-09-06
- Earliest claimed: 2013-08-30
- Assignees: Mediatek Inc.
- Applicants: MediaTek Inc.
- Inventors: Wen-Sung Hsu; Ming-Chieh Lin; Ta-Jen Yu
- Web page: https://patentgrep.com/patent/US9437457B2

## CPC

- H10W 70/042: {Etching}
- H10W 70/479: {on or in insulating or insulated package substrates, interposers, or redistribution layers}
- H10W 74/016: {using moulds}
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H10W 70/635: {Through-vias}
- H10W 72/012: {of bump connectors, dummy bumps or thermal bumps}
- H10W 72/072: {of bump connectors}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 74/129: {forming a chip-scale package [CSP]}
- H10W 90/724: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

According to an embodiment of the present invention, a chip package is provided. The chip package includes: a patterned conducting plate having a plurality of conducting sections electrically separated from each other; a plurality of conducting pads disposed on an upper surface of the patterned conducting plate; a chip disposed on the conducting pads; a plurality of conducting bumps disposed on a lower surface of the patterned conducting plate, wherein each of the conducting bumps is electrically connected to a corresponding one of the conducting sections of the patterned conducting plate; and an insulating support layer partially surrounding the conducting bumps.

## Claims

### Claim 1

A chip package, comprising:
a patterned conducting plate having a plurality of conducting sections electrically separated from each other;
a plurality of conducting pads disposed on an upper surface of the patterned conducting plate;
a chip disposed on the conducting pads;
a plurality of conducting bumps disposed on a lower surface of the patterned conducting plate, wherein each of the conducting bumps is electrically connected to a corresponding one of the conducting sections of the patterned conducting plate; and
an insulating support layer partially surrounding the conducting bumps, wherein the conducting bumps have a tapered-shape.

### Claim 2 (depends on 1)

The chip package as claimed in claim 1, wherein the insulating support layer further surrounds sidewalls of the conducting sections of the patterned conducting plate.

### Claim 3 (depends on 2)

The chip package as claimed in claim 2, further comprising an insulating protection layer disposed on the insulating support layer and surrounding the conducting pads.

### Claim 4 (depends on 1)

The chip package as claimed in claim 1, wherein the conducting pads have a material different from that of the patterned conducting plate.

### Claim 5 (depends on 1)

The chip package as claimed in claim 1, wherein the insulating support layer directly contacts with at least one of the conducting pads through at least one opening between the conducting sections of the patterned conducting plate.

### Claim 6 (depends on 1)

The chip package as claimed in claim 1, wherein the insulating support layer does not directly contact with the conducting pads.

### Claim 7 (depends on 6)

The chip package as claimed in claim 6, wherein the insulating support layer does not surround the conducting sections of the patterned conducting plate.

### Claim 8 (depends on 1)

The chip package as claimed in claim 1, further comprising a recess extending from a surface of one of the conducting pads towards an inner portion of the corresponding one of the conducting pads.

### Claim 9 (depends on 1)

The chip package as claimed in claim 1, further comprising a molding compound disposed on the patterned conducting plate and covering the chip.

### Claim 10 (depends on 1)

The chip package as claimed in claim 1, further comprising an underfill disposed between the chip and the conducting pads.

### Claim 11 (depends on 1)

The chip package as claimed in claim 1, wherein the conducting pads directly contact with the conducting plate.

### Claim 12 (depends on 1)

The chip package as claimed in claim 1, wherein each of the conducting bumps is thicker than the conducting plate.

### Claim 13 (depends on 1)

The chip package as claimed in claim 1, wherein the materials of the conducting pads and the patterned conducting plates are the same.

### Claim 14 (depends on 1)

The chip package as claimed in claim 1, wherein each of the conducting bumps cover at least one of the conducting pads.

### Claim 15 (depends on 1)

The chip package as claimed in claim 1, further comprising:
a plurality of conducting structures are optionally disposed between the chip and the conducting pads.

### Claim 16 (depends on 15)

The chip package as claimed in claim 15, further comprising:
a molding compound disposed on the patterned conducting plate and covering the chip, and the molding compound covers the conducting structure and the conducting pads.

### Claim 17 (depends on 15)

The chip package as claimed in claim 15, further comprising an underfill disposed between the chip and the conducting pads and surrounded the conducting structures.