# US 9,437,431 B2 · Electronic device manufacture

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- Number: US 9,437,431 B2
- Document ID: US9437431B2
- Status: Granted
- Kind: B2
- Application number: 12/069,857
- Filed: 2008-02-13
- Published: 2008-11-27
- Granted: 2016-09-06
- Earliest claimed: 2007-02-13
- Assignees: Rohm and Haas Electronic Materials LLC
- Applicants: Peter Trefonas, III; Dong Won Chung
- Inventors: Peter Trefonas, III; Dong Won Chung
- Web page: https://patentgrep.com/patent/US9437431B2

## CPC

- H10P 76/2041: {Photolithographic processes}
- G03F 7/40: Treatment after imagewise removal, e.g. baking
- H10P 76/4088: {Processes for improving the resolution of the masks}
- G03F 7/0035: {Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)

## Abstract

New methods are provided for manufacturing a semiconductor device. Preferred methods of the invention include depositing a photoresist on a semiconductor substrate surface followed by imaging and development of resist coating layer; applying a curable organic or inorganic composition over the resist relief image; etching to provide a relief image of the resist encased by the curable composition; and removing the resist material whereby the curable organic or inorganic composition remains in a relief image of increased pitch relative to the previously developed resist image.

## Claims

### Claim 1

A method for fabricating an electronic device, comprising:
(a) providing a chemically-amplified positive-acting photoresist relief image on a substrate;
(b) applying a curable composition over the photoresist relief image to provide a composite of the photoresist and curable composition, wherein the curable composition comprises a silicon-containing component;
(c) treating the composite to provide relief image of photoresist encased by curable composition;
(d) exposing the composite to activating radiation to permit hardening of the curable composition and then development to remove the photoresist, wherein the curable composition crosslinks in presence of acid that migrates from the photoresist,
wherein following removing the photoresist, the curable composition remains in a relief image of decreased pitch relative to the photoresist.

### Claim 2 (depends on 1)

The method of claim 1 wherein a single exposure step is utilized.

### Claim 3 (depends on 1)

The method of claim 1 wherein the composite is substantially free of the curable composition on the top surface of the imageable material.

### Claim 4 (depends on 1)

The method of claim 1 wherein the photoresist and curable composition each contains one or more organic components and are applied by spin coating.

### Claim 5 (depends on 1)

The method of claim 1 wherein the curable composition is cured after applying and prior to treating to provide a relief image.

### Claim 6

A method for fabricating an electronic device, comprising:
(a) applying a chemically-amplified positive-acting photoresist on a substrate surface;
(b) exposing the photoresist to patterned activating radiation and developing the exposed material to provide a positive photoresist relief image;
(c) applying a curable organic composition over the positive relief image to provide a composite of the photoresist and curable composition, and wherein the curable organic composition comprises a silicon-containing component;
(d) curing the curable organic composition of the composite whereby the organic composition crosslinks in the presence of acid that crosslinks in the presence of acid that migrates from the photoresist;
(e) treating the composite to provide a relief image of photoresist encased by the curable composition;
(f) exposing the composite to activating radiation to permit hardening of the curable organic composition and then development to remove the photoresist,
wherein following removing the photoresist, the curable organic composition remains in a relief image of decreased pitch relative to the previously developed photoresist.

### Claim 7 (depends on 6)

The method of claim 6 wherein the curable composition is cured by flood exposure with activating radiation.

### Claim 8 (depends on 6)

The method of claim 6 wherein the curable composition is cured by thermal treatment.