# US 9,437,405 B2 · Hot rolled plate made of copper alloy used for a sputtering target and sputtering target

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- Number: US 9,437,405 B2
- Document ID: US9437405B2
- Status: Granted
- Kind: B2
- Application number: 14/654,210
- Filed: 2013-12-03
- Published: 2015-11-05
- Granted: 2016-09-06
- Earliest claimed: 2012-12-28
- Assignees: Mitsubishi Materials Corporation
- Applicants: Mitsubishi Materials Corporation
- Inventors: Kiyoyuki Okubo; Masato Koide
- Web page: https://patentgrep.com/patent/US9437405B2

## CPC

- H01J 37/3429: {Plural materials}
- B21B 3/00: Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences {; Rolling of aluminium, copper, zinc or other non-ferrous metals}(altering special metallurgical properties of alloys, other than structure consolidation or mechanical properties resulting therefrom C21D, C22F)
- C22C 9/00: Alloys based on copper
- C22C 9/01: with aluminium as the next major constituent
- C22C 9/05: with manganese as the next major constituent
- C22F 1/08: of copper or alloys based thereon
- C23C 14/3414: {Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy}
- B22D 11/00: Continuous casting of metals, i.e. casting in indefinite lengths (metal drawing, metal extruding B21C)
- H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H)
- B21B: ROLLING OF METAL (auxiliary operations used in connection with metal-working operations covered in B21, see B21C; bending by rolling B21D; manufacture of particular objects, e.g. screws, wheels, rings, barrels, balls, by rolling B21H; pressure welding by means of a rolling mill B23K20/04)
- C22C: ALLOYS (treatment of alloys C21D, C22F)
- C22F: CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS (surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by this subclass, C23F17/00)
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- B22D: CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES (shaping of plastics or substances in a plastic state B29C; metallurgical processing, selection of substances to be added to metal C21, C22)

## Abstract

Disclosed is a hot rolled plate produced by hot rolling an ingot cast by continuous casting, in which the plate is made of a copper alloy containing 0.5 to 10.0 at % of Ca and the balance consisting of Cu and inevitable impurities and the average grain size of Cu-α phase crystal grains is 5 to 60 μm in a Cu matrix.

## Claims

### Claim 1

A hot rolled plate for a sputtering target, said hot rolled plate comprising:
a copper alloy, wherein
the copper alloy contains 0.5 to 10.0 at % of Ca and the balance consisting of Cu and inevitable impurities,
an average grain size of Cu-α phase crystal grains is 5 to 60 μm in a Cu matrix, and
Cu—Ca-based crystals are dispersed in the Cu matrix.

### Claim 2 (depends on 1)

The hot rolled plate for a sputtering target according to claim 1,
wherein an amount of Ca in the copper alloy is 0.5 to 6.0 at %.

### Claim 3 (depends on 1)

The hot rolled plate for a sputtering target according to claim 1,
wherein the copper alloy further contains a total of 10.0 at % or less of one or more elements selected from the group consisting of: 0.1 to 5.0 at % of Mg, 0.1 to 5.0 at % of Mn, 0.1 to 5.0 at % of Al, and 0.001 to 0.1 at % of P.

### Claim 4 (depends on 1)

A sputtering target made of the hot rolled plate according to claim 1.

### Claim 5 (depends on 2)

The hot rolled plate for a sputtering target according to claim 2,
wherein the copper alloy further contains a total of 10.0 at % or less of one or more elements selected from the group consisting of: 0.1 to 5.0 at % of Mg, 0.1 to 5.0 at % of Mn, 0.1 to 5.0 at % of Al, and 0.001 to 0.1 at % of P.

### Claim 6 (depends on 2)

A sputtering target made of the hot rolled plate according to claim 2.

### Claim 7 (depends on 3)

A sputtering target made of the hot rolled plate according to claim 3.

### Claim 8 (depends on 5)

A sputtering target made of the hot rolled according to claim 5.