# US 9,437,347 B2 · Method for manufacturing an electrostatic discharge device

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- Number: US 9,437,347 B2
- Document ID: US9437347B2
- Status: Granted
- Kind: B2
- Application number: 13/380,227
- Filed: 2010-06-22
- Published: 2012-09-06
- Granted: 2016-09-06
- Earliest claimed: 2009-06-22
- Assignees: Condalign AS
- Applicants: Eldrid Svasand; Mark Buchanan; Matti Knappila; Geir Helgesen; Arnulf Maeland
- Inventors: Eldrid Svasand; Mark Buchanan; Matti Knappila; Geir Helgesen; Arnulf Maeland
- Web page: https://patentgrep.com/patent/US9437347B2

## CPC

- H05K 9/0079: {Electrostatic discharge protection, e.g. ESD treated surface for rapid dissipation of charges}
- B05D 1/005: {Spin coating}
- B05D 1/40: Distributing applied liquids or other fluent materials by members moving relatively to surface
- B05D 3/14: by electrical means
- H01B 1/24: the conductive material comprising carbon-silicon compounds, carbon or silicon
- H01G 9/0003: {Protection against electric or thermal overload; cooling arrangements; means for avoiding the formation of cathode films (H01G9/12 takes precedence)}
- H01M 4/628: {Inhibitors, e.g. gassing inhibitors, corrosion inhibitors}
- H05F 3/025: {Floors or floor coverings specially adapted for discharging static charges}
- B05D 2601/20: used for non-pigmentation effect
- H01M 4/02: Electrodes composed of, or comprising, active material
- H01M 4/0471: {involving thermal treatment, e.g. firing, sintering, backing particulate active material, thermal decomposition, pyrolysis}
- H01M 2004/024: {Insertable electrodes}
- Y02E 10/50: Photovoltaic [PV] energy
- Y02E 60/10: Energy storage using batteries
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B05D: PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL (conveying articles or workpieces through baths of liquid B65G, e.g. B65G49/02)
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- H01M: PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H05F: STATIC ELECTRICITY; NATURALLY-OCCURRING ELECTRICITY
- Y02E: REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION

## Abstract

The invention is achieved by applying a layer of the mixture that contains polymer and conductive particles over a first surface, when the mixture has a first viscosity that allows the conductive particles to rearrange within the layer. An electric field is applied over the layer, so that a number of the conductive particles are aligned with the field and thereafter the viscosity of the layer is changed to a second, higher viscosity, in order to mechanically stabilize the layer. This leads to a stable layer with enhanced and anisotropic conductivity that can be used in the manufacture of ESD devices.

## Claims

### Claim 1

A method for manufacturing an ESD device having at least one anisotropic conductive or dissipative layer comprising a mixture of a nonconductive matrix and conductive particles, wherein the method comprises:
a) applying a layer of the mixture over a first surface of the ESD device, the mixture having a first viscosity which allows the conductive particles to rearrange within the layer;
b) applying an electric field between two alignment electrodes over the layer, so that a number of the conductive particles are aligned with the field, thus creating conductive pathways, wherein at least one of the electrodes is not in direct contact with the layer while the electric field is applied; and
c) changing the viscosity of the layer to a second viscosity, said second viscosity being higher than the first viscosity in order to mechanically stabilize the layer and preserve the conductive pathways,
wherein a concentration of the conductive particles in the layer is below the percolation threshold.

### Claim 2 (depends on 1)

The method in accordance with claim 1, wherein the matrix comprises one or more polymers.

### Claim 3 (depends on 2)

The method in accordance with claim 2, wherein the matrix is an adhesive.

### Claim 4 (depends on 1)

The method in accordance with claim 1, wherein one of the alignment electrodes is in direct contact with the layer, while the electric field is applied.

### Claim 5 (depends on 1)

The method in accordance with claim 1, wherein the alignment electrodes are insulated from the layer.

### Claim 6 (depends on 1)

The method in accordance with claim 1, wherein the electric field is 0.05 to 0 kV/cm.

### Claim 7 (depends on 1)

The method in accordance with claim 1, wherein the electric field is an AC field.

### Claim 8 (depends on 1)

The method in accordance with claim 1, wherein the electric field is applied between the first surface and a second surface.

### Claim 9 (depends on 4)

The method in accordance with claim 4, wherein the application of the electric field is stopped before the conductive pathway has connected the alignment electrodes.

### Claim 10 (depends on 1)

The method in accordance with claim 1, further comprising totally or partly removing the matrix from the layer after c).

### Claim 11 (depends on 1)

The method in accordance with claim 1, wherein the conductive particles comprise one or more of carbon black, carbon nanodiscs, carbon nanocones, metals, metal oxides and colloidal metal containing particles.

### Claim 12 (depends on 1)

The method in accordance with claim 1, wherein the matrix is a thermoplastic resin which comprises one or more of polyurethane, polyvinyl chloride, polyolefins and copolymers of vinyl chloride and copolymers of olefins.

### Claim 13 (depends on 1)

The method in accordance with claim 1, wherein the electrically conducting or dissipative layer has a thickness from 0.1-5 mm.

### Claim 14 (depends on 11)

The method in accordance with claim 11, wherein the matrix is a thermoplastic resin which comprises one or more of polyurethane, polyvinyl chloride, polyolefins and copolymers of vinyl chloride and copolymers of olefins.

### Claim 15 (depends on 1)

The method in accordance with claim 1, wherein the concentration of the conductive particles in the layer is 0.2-2 vol %.

### Claim 16 (depends on 1)

The method in accordance with claim 1, wherein both of the two electrodes are not in direct contact with the layer while the electric field is applied.

### Claim 17 (depends on 1)

The method in accordance with claim 1, wherein after the layer of the mixture has been applied over the first surface of the ESD device in a), the conductive particles are randomly distributed in the nonconductive matrix.

### Claim 18

A method for manufacturing an ESD device having at least one anisotropic conductive or dissipative layer comprising a mixture of a nonconductive matrix and conductive particles, wherein the method comprises:
a) applying a layer of the mixture over a first surface of the ESD device, the mixture having a first viscosity which allows the conductive particles to rearrange within the layer;
b) applying an electric field between two alignment electrodes over the layer, so that a number of the conductive particles are aligned with the field, thus creating conductive pathways, wherein at least one of the electrodes is not in direct contact with the layer while the electric field is applied; and
c) changing the viscosity of the layer to a second viscosity, said second viscosity being higher than the first viscosity in order to mechanically stabilize the layer and preserve the conductive pathways,
wherein a concentration of the conductive particles in the layer is 0.2-2 vol %.
