# US 9,437,346 B2 · Semiconductor device connected by anisotropic conductive adhesive film

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- Number: US 9,437,346 B2
- Document ID: US9437346B2
- Status: Granted
- Kind: B2
- Application number: 14/049,243
- Filed: 2013-10-09
- Published: 2014-04-10
- Granted: 2016-09-06
- Earliest claimed: 2012-10-10
- Assignees: Cheil Industries Inc.
- Applicants: Kyoung Hun Shin; Do Hyun Park; Hyun Joo Seo; Young Ju Shin; Kyu Bong Kim; Woo Jun Lim
- Inventors: Kyoung Hun Shin; Do Hyun Park; Hyun Joo Seo; Young Ju Shin; Kyu Bong Kim; Woo Jun Lim
- Web page: https://patentgrep.com/patent/US9437346B2

## CPC

- H01B 1/22: the conductive material comprising metals or alloys
- C09J 2301/314: the adhesive layer and/or the carrier being conductive
- H10W 72/07332: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07337: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
- H10W 72/261: {Functions other than electrical connecting}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 72/354: {comprising polymers}
- H10W 90/731: {of die-attach connectors}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.

## Claims

### Claim 1

A display device connected using an anisotropic conductive adhesive film, the anisotropic conductive adhesive film comprising:
a thermosetting polymerization initiator; and
tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the film in an amount of 1 wt % to 25 wt %, based on the total weight of the film in terms of solid content, and
wherein the anisotropic conductive adhesive film has a tensile strength before curing of 5 kgf/cm2 or more.

### Claim 2 (depends on 1)

The display device as claimed in claim 1, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is an alkoxylated tetrahydrofurfuryl (meth)acrylate or alkoxylated furfuryl (meth)acrylate.

### Claim 3 (depends on 2)

The display device as claimed in claim 2, wherein the anisotropic conductive adhesive film includes the alkoxylated tetrahydrofurfuryl acrylate, the alkoxylated tetrahydrofurfuryl acrylate having a structure represented by Formula 1:
wherein n is an integer from 1 to 10.

### Claim 4 (depends on 1)

The display device as claimed in claim 1, wherein the anisotropic conductive adhesive film further includes a thermoplastic resin and conductive particles.

### Claim 5 (depends on 4)

The display device as claimed in claim 4, wherein the anisotropic conductive adhesive film further includes a radical polymerizable material, the radical polymerizable material being different from the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate.

### Claim 6 (depends on 1)

The display device as claimed in claim 1, wherein an anisotropic conductive adhesive film has an adhesive strength reduction rate of greater than 0 to 25% or less as measured according to Equation 1:
Adhesive strength reduction rate (%)=|(A−B)/A|×100, [Equation 1]
in which:
A is an adhesive strength of the adhesive film after being subjected to pre-compression at 80° C. under a load of 1 MPa for 1 second and primary compression at 180° C. under a load of 3 MPa for 5 seconds, and
B is an adhesive strength of the film after being subjected to the pre-compression and the primary compression, followed by reliability testing at 85° C. and 85% RH for 500 hours.

### Claim 7 (depends on 1)

The display device as claimed in claim 1, wherein the anisotropic conductive adhesive film further includes a thermoplastic resin that is present in an amount of 50 wt % to 80 wt %, based on the total weight of the anisotropic conductive adhesive film in terms of solid content.

### Claim 8

A display device, comprising:
a first connecting member having a first electrode;
a second connecting member having a second electrode; and
an anisotropic conductive adhesive film between the first connecting member and the second connecting member and connecting the first electrode to the second electrode, the anisotropic conductive adhesive film being prepared from a composition including:
a thermosetting polymerization initiator, and
1 wt % to 25 wt % of tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate based on a total weight of the anisotropic conductive adhesive film in terms of solid content, and
wherein the anisotropic conductive adhesive film has a tensile strength before curing of 5 kgf/cm2 or more.