# US 9,437,251 B1 · Apparatus and method having TDMR reader to reader shunts

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- Number: US 9,437,251 B1
- Document ID: US9437251B1
- Status: Granted
- Kind: B1
- Application number: 14/579,785
- Filed: 2014-12-22
- Granted: 2016-09-06
- Earliest claimed: 2014-12-22
- Assignees: Western Digital (Fremont), LLC
- Applicants: Western Digital (Fremont), LLC
- Inventors: Steven C. Rudy; Luc Ving Chung; Christopher L. Beaudry; Shaoping Li; Jimmy J. Shen; Guolun Hao; Yingbo Zhang
- Web page: https://patentgrep.com/patent/US9437251B1

## CPC

- G11B 5/3163: {Fabrication methods or processes specially adapted for a particular head structure, e.g. using base layers for electroplating, using functional layers for masking, using energy or particle beams for shaping the structure or modifying the properties of the basic layers}
- G11B 5/115: Shielding devices arranged between heads or windings ({G11B5/265} , G11B5/29 take precedence)
- G11B 5/1272: {Assembling or shaping of elements (G11B5/1278 takes precedence)}
- G11B 5/29: Structure or manufacture of unitary devices formed of plural heads for more than one track {(G11B5/33, G11B5/49 and subgroups take precedence; in thin film structure G11B5/31)}
- G11B 5/3912: {Arrangements in which the active read-out elements are transducing in association with active magnetic shields, e.g. magnetically coupled shields (G11B5/3916 takes precedence)}
- G11B 5/3951: {the active elements being arranged on several parallel planes}
- G11B 5/3977: {from different information tracks}
- G11B 33/1493: {Electro-Magnetic Interference [EMI] or Radio Frequency Interference [RFI] shielding; grounding of static charges}
- G11B 5/4886: {relative to rotating disc}
- G11B 5/4976: {Disposition of heads, e.g. matrix arrangement}
- G11B 5/6094: {Preventing or discharging electrostatic charge build-up on the flying head}
- Y10T 29/49032: Fabricating head structure or component thereof
- G11B: INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER (recording measured values in a way that does not require playback through a transducer G01D9/00; recording or playback apparatus using mechanically marked tape, e.g. punched paper tape, or using unit records, e.g. punched or magnetically marked cards G06K; transferring data from one type of record carrier to another G06K1/18; circuits for coupling output of reproducer to radio receiver H04B1/20; gramophone pick-ups or like acoustic electromechanical transducers or circuits therefor H04R)
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A method of making a magnetic head is provided. The method includes forming a first read sensor and a first electrical contact formed with a first shunt region. The method further includes forming a first mid-shield layer on the first read sensor, the first mid-shield layer being electrically connected to the first electrical contact. Additionally the method also includes forming a second mid-shield layer over the first mid-shield layer. Further, the method also includes forming a second read sensor over the second mid-shield layer, the second read sensor having a second electrical contact formed with a second shunt region electrically connected to the first shunt region.

## Claims

### Claim 1

A layered micro-structure for a magnetic head, the micro-structure comprising:
a first read sensor and a first electrical contact with a first shunt region;
a first mid-shield layer formed on the first read sensor, the first mid-shield layer being electrically connected to the first electrical contact;
a second mid-shield layer formed over the first mid-shield layer; and
a second read sensor formed over the second mid-shield layer, the second read sensor having a second electrical contact between the second read sensor and the second mid-shield layer, the second electrical contact having a second shunt region electrically connected to the first shunt region; and
a first electrical connection layer formed between, and electrically connecting, the first shunt region and the second shunt region.

### Claim 2 (depends on 1)

The micro-structure of claim 1, wherein the first electrical connection layer comprises an electrically resistive layer formed between the first shunt region and the second shunt region.

### Claim 3 (depends on 1)

The micro-structure of claim 1, further comprising:
a first outer shield layer, wherein the first read sensor is formed over the first outer shield layer; and
a second outer shield layer formed over the second read sensor.

### Claim 4 (depends on 1)

The micro-structure of claim 1, wherein the first shunt region is formed in a region of the micro-structure that is removable to form an air bearing surface; and
wherein the second shunt region is formed in the region of the micro-structure that is removable to form the air bearing surface.

### Claim 5 (depends on 1)

The micro-structure of claim 1, wherein the second read sensor further comprises a third electrical contact having a third shunt region; and
wherein the micro-structure further comprises:
a third mid-shield layer formed over the second read sensor, the third mid-shield layer being electrically connected to the third electrical contact;
a fourth mid-shield layer formed over the third mid-shield layer; and
a third read sensor formed over the fourth mid-shield layer, the third read sensor having a fourth electrical contact including a fourth shunt region electrically connected to the third shunt region; and
a second electrical connection layer formed between, and electrically connecting, the fourth shunt region and the third shunt region.

### Claim 6 (depends on 5)

The micro-structure of claim 5, wherein the first electrical connection layer comprises a first electrically resistive layer formed between the first shunt region and the second shunt region; and
wherein the second electrical connection layer comprises a second electrically resistive layer formed between the third shunt region and the fourth shunt region.

### Claim 7 (depends on 5)

The micro-structure of claim 5, further comprising:
a first outer shield layer, wherein the first read sensor is formed over the first outer shield layer; and
a second outer shield layer formed over the third read sensor.

### Claim 8 (depends on 5)

The micro-structure of claim 5, wherein the first shunt region is formed in a region of the microstructure that is removable to form an air bearing surface;
wherein the second shunt region is formed in the region of the micro-structure that is removable to form the air bearing surface;
wherein the third shunt region is formed in the region of the micro-structure that is removable to form the air bearing surface; and
wherein the fourth shunt region is formed in the region of the micro-structure that is removable to form the air bearing surface.

### Claim 9 (depends on 1)

A storage device comprising:
a storage medium; and
a slider disposed proximate to the storage medium, the slider comprising the micro-structure according to claim 1 mounted on the slider.