# US 9,436,065 B2 · High-strength titanium copper foil and method for producing same

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- Number: US 9,436,065 B2
- Document ID: US9436065B2
- Status: Granted
- Kind: B2
- Application number: 14/834,682
- Filed: 2015-08-25
- Published: 2016-03-03
- Granted: 2016-09-06
- Earliest claimed: 2014-08-29
- Assignees: JX Nippon Mining & Metals Corporation
- Applicants: JX Nippon Mining & Metals Corporation
- Inventors: Masayuki Nagano
- Web page: https://patentgrep.com/patent/US9436065B2

## CPC

- G03B 13/36: Autofocus systems
- C22C 9/00: Alloys based on copper
- C22F 1/08: of copper or alloys based thereon
- G03B 3/10: Power-operated focusing
- G03B: APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR (optical parts of such apparatus G02B; photosensitive materials or processes for photographic purposes G03C; apparatus for processing exposed photographic materials G03D)
- C22C: ALLOYS (treatment of alloys C21D, C22F)
- C22F: CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS (surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by this subclass, C23F17/00)

## Abstract

To provide a high-strength titanium-copper foil that is more suitable as a conductive spring material that can be used in electronic device components such as an autofocus camera module. A titanium copper foil containing Ti in an amount of 2.0 to 4.0 mass %, a remainder being copper and unavoidable impurities, said foil having a 0.2% yield strength of 1000 MPa or more and a spring limit value of 800 MPa or more in both directions parallel and perpendicular to a rolling direction, wherein no cracking occurs at bending radius/foil thickness=2 when a W bending test in conformity with JIS H3130: 2012 is performed at a width of 0.5 mm in a direction perpendicular to the rolling direction.

## Claims

### Claim 1

A titanium copper foil containing Ti in an amount of 2.0 mass% to 4.0 mass%, optionally containing one or more elements selected from the group consisting of Ag, B, Co, Fe, Mg, Mn, Mo, Ni, P, Si, Cr, and Zr in a total amount of 0 mass% to 1.0 mass%, a remainder being copper and unavoidable impurities, said foil having a 0.2% yield strength of 1000 MPa or more in both directions parallel and perpendicular to a rolling direction, and a spring limit value of 800 MPa or more in both directions parallel and perpendicular to the rolling direction, wherein no cracking occurs at bending radius/foil thickness =2 when a W bending test in conformity with JIS H3130: 2012 is performed at a width of 0.5 mm in a direction perpendicular to the rolling direction.

### Claim 2 (depends on 1)

The titanium copper foil according to claim 1, having a 0.2% yield strength of 1100 MPa or more in both directions parallel and perpendicular to the rolling direction.

### Claim 3 (depends on 1)

The titanium copper foil according to claim 1, having a spring limit value of 1000 MPa or more in a direction perpendicular to the rolling direction.

### Claim 4 (depends on 1)

The titanium copper foil according to claim 1, wherein a thickness of the foil is 0.1 mm or less.

### Claim 5 (depends on 1)

A method for producing titanium copper foil according to claim 1 comprising steps of:
making an ingot containing Ti in an amount of 2.0 mass % to 4.0 mass %, optionally containing one or more elements selected from the group consisting of Ag, B, Co, Fe, Mg, Mn, Mo, Ni, P, Si, Cr, and Zr in a total amount of 0 mass% to 1.0 mass%, a remainder being copper and unavoidable impurities;
sequentially performing hot and cold rolling on the ingot;
then performing a solution treatment for 5 seconds to 30 minutes at 700° C. to 1000° C.;
then performing cold rolling with 95% or more total rolling reduction under a condition of 10% or less rolling reduction per one pass;
then performing aging treatment in which a temperature is raised at a rate of 15° C/h or less and kept in a range of 200° C. to 400° C. for 1 to 20 hours, and
then performing cooling down to 150° C. at a rate of 15° C/h or less.

### Claim 6 (depends on 1)

A wrought copper product provided with the titanium copper foil according to claim 1.

### Claim 7 (depends on 1)

An electronic device component provided with the titanium copper foil according to claim 1.

### Claim 8 (depends on 7)

The electronic device component according to claim 7, wherein the electronic device component constitutes an autofocus camera module.

### Claim 9 (depends on 1)

An autofocus camera module comprising:
a lens; and,
a spring member for elastically biasing the lens toward an initial position in an optical axis direction, and an electromagnetic driving means capable of driving the lens in the optical axis direction by generating an electromagnetic force against the biasing force of the spring member,
wherein the spring member is made of the titanium copper foil according to claim 1.
