# US 9,435,855 B2 · Interconnect for transmitting signals between a device and a tester > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,435,855 B2 - Document ID: US9435855B2 - Status: Granted - Kind: B2 - Application number: 14/084,414 - Filed: 2013-11-19 - Published: 2015-05-21 - Granted: 2016-09-06 - Earliest claimed: 2013-11-19 - Assignees: Teradyne, Inc. - Applicants: Teradyne, Inc. - Inventors: David Walter Lewinnek; Roger Allen Sinsheimer; Luis Antonio Valiente; Craig Anthony DiPalo - Web page: https://patentgrep.com/patent/US9435855B2 ## CPC - G01R 31/2889: {Interfaces, e.g. between probe and tester (G01R31/31905 and G01R1/07364 take precedence)} - G01R 1/07378: {using an intermediate adapter, e.g. space transformers (G01R1/07371 takes precedence)} - G01R 1/24: Transmission-line, e.g. waveguide, measuring sections, e.g. slotted section - G01R 3/00: Apparatus or processes specially adapted for the manufacture {or maintenance} of measuring instruments {, e.g. of probe tips} - Y10T 29/4913: Assembling to base an electrical component, e.g., capacitor, etc. - Y10T 29/49147: Assembling terminal to base - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A system includes: a circuit board including electrical elements arranged at a first pitch; a wafer including contacts arranged at a second pitch, where the second pitch is less than the first pitch; and an interconnect including additively-manufactured electrical conduits that are part of an electrical pathway between the electrical elements and the contacts, where the additively-manufactured electrical conduits include electrically-conductive material. ## Claims ### Claim 1 A system comprising: a circuit board comprising electrical elements arranged at a first pitch; a wafer comprising contacts arranged at a second pitch, the second pitch being less than the first pitch; and an interconnect comprising electrical conduits comprised of layers of material, the electrical conduits being part of an electrical pathway between the electrical elements and the contacts, the electrical conduits comprising electrically-conductive material; wherein the electrical conduits have matching electrical impedances, the electrical conduits comprising coaxial structures, the coaxial structures having different physical configurations that produce the matching electrical impedances. ### Claim 2 (depends on 1) The system of claim 1, wherein the coaxial structures comprise at least one dielectric material. ### Claim 3 (depends on 2) The system of claim 2, wherein the at least one dielectric comprises air. ### Claim 4 (depends on 2) The system of claim 2, wherein the at least one dielectric material comprises air, plastic and/or ceramic. ### Claim 5 (depends on 1) The system of claim 1, further comprising: an interposer between the interconnect and the circuit board, the interposer comprising a part of the electrical pathway between the electrical elements and the contacts. ### Claim 6 (depends on 1) The system of claim 1, further comprising: electrically-conductive pins between electrical conduits in the interconnect and corresponding contacts on the wafer. ### Claim 7 (depends on 5) The system of claim 5, further comprising: contacts on the interposer that are electrically-conductive and mechanically-compliant, the contacts to provide a mechanically-compliant electrical connection between the interposer and the corresponding contacts on the wafer. ### Claim 8 (depends on 7) The system of claim 7, wherein the contacts on the wafer form an electrical circuit. ### Claim 9 (depends on 1) The system of claim 1, wherein the coaxial structures comprise multiple dielectrics. ### Claim 10 (depends on 1) The system of claim 1, wherein the circuit board further comprises: electronics associated with each of the electrical elements, wherein electronics associated with a corresponding electrical element are for supporting operation of the corresponding electrical element. ### Claim 11 (depends on 1) The system of claim 1, further comprising: pins between the interconnect and the wafer, the pins for providing at least part of an electrical pathway between the contacts and the interconnect; and an interface board between the pins and the interconnect, the interface board being at least part of the electrical pathway between the contacts and the interconnect, the interface board comprising electronic components in the electrical pathway. ### Claim 12 (depends on 11) The system of claim 11, wherein the electronic components are passive electronic components. ### Claim 13 (depends on 12) The system of claim 12, wherein the electronic components comprise at least one of capacitors, baluns or switches. ### Claim 14 (depends on 11) The system of claim 11, wherein the electronic components comprise active electronic components. ### Claim 15 (depends on 1) The system of claim 1, wherein each of the electrical elements comprises part of a radio frequency (RF) probe card. ### Claim 16 (depends on 1) The system of claim 1, wherein the electrical elements comprise electrical cables that terminate on the circuit board. ### Claim 17 (depends on 1) The system of claim 1, wherein the contacts are arranged in parallel rows on the wafer; and wherein the system further comprises: a tester to make electrical contact between the interconnect and a subset of the contacts. ### Claim 18 (depends on 1) The system of claim 1, wherein the electrical conduits are configured to have matching electrical path lengths, impedances, and signal attenuation. ### Claim 19 (depends on 1) The system of claim 1, wherein at least some of the electrical conduits are configured to have substantially matching electrical path lengths, impedances, and signal attenuation. ### Claim 20 (depends on 1) The system of claim 1, wherein the electrical conduits comprise curved or serpentine portions that produce substantially matching electrical path lengths and time-of-flight, impedances, and signal attenuation between different electrical conduits. ### Claim 21 (depends on 1) The system of claim 1, wherein the electrical conduits comprised three-dimensionally (3D) printed electrical conduits. ### Claim 22 (depends on 1) The system of claim 1, wherein the second pitch maintains a single dimension of the first pitch. ### Claim 23 A system comprising: a circuit board comprising electrical elements arranged at a first pitch; a wafer comprising contacts arranged at a second pitch, the second pitch being less than the first pitch; and an interconnect comprising electrical conduits comprised of layers of material, at least one of the layers missing at least some material, the electrical conduits being part of an electrical pathway between the electrical elements and the contacts, the electrical conduits comprising electrically-conductive material; wherein the electrical conduits have matching electrical impedances, the electrical conduits comprising coaxial structures, the coaxial structures having different physical configurations to achieve the matching electrical impedances. ### Claim 24 (depends on 23) The system of claim 23, wherein the electrical conduits have a stripline configuration, a microstrip configuration, or a co-planar waveguide configuration.