# US 9,435,853 B2 · Socket device for an IC test > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,435,853 B2 - Document ID: US9435853B2 - Status: Granted - Kind: B2 - Application number: 14/346,813 - Filed: 2012-09-18 - Published: 2014-08-28 - Granted: 2016-09-06 - Earliest claimed: 2011-09-23 - Assignees: Hicon Co., Ltd. - Applicants: Hicon Co., Ltd. - Inventors: Dong Weon Hwang - Web page: https://patentgrep.com/patent/US9435853B2 ## CPC - G01R 31/2886: {Features relating to contacting the IC under test, e.g. probe heads; chucks (G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06)} - G01R 1/0466: {concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding} - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract Disclosed herein is a socket device for an integrated circuit (IC) test. The device includes: a socket which is provided with a pin guide plate that can guide and protect a spring contact so as to prevent damage to or breakage of the spring contact that electrically connects an IC lead to a PCB; and an IC insert provided with a guide plate. According to said configuration, ball grid array (BGA) ICs in which IC leads are balls can be more efficiently tested. Particularly, contact pins of the socket and the IC leads can be mechanically and electrically more precisely positioned for narrow pitches of the IC leads such as 0.4 mm, 0.35 mm, and 0.3 mm. Thereby, damage to or breakage not only of the ICs to be tested but also of the socket can be minimized. ## Claims ### Claim 1 A socket device for IC tests, the socket device comprising: a socket body including an upper plate having first through holes, movement guide holes formed in a central portion of the upper plate, and stop protrusions formed to protrude toward lateral directions of the upper plate, a lower plate coupled to a bottom side of the upper plate and having second through holes formed in a position corresponding to the first through holes, and spring contacts, each of the spring contacts being inserted into corresponding one pair of the first and second through holes; a pin guide plate coupled to a top side of the socket body, the pin guide plate having first spring contact guide holes formed in a position corresponding to the first and second through holes so that the spring contacts protrude from the pin guide plate through the first spring contact guide holes, lower guide pins protruding from a bottom side of the in guide plate and inserted into the movement guide holes of the socket body, locking protrusions protruding from the bottom side of the in guide plate and engaged with the stop protrusions of the socket body, and upper guide pins protruding from a top side of the in guide plate; an IC insert body having an IC receiving hole formed in a central portion of the IC insert body, into which an integrated circuit (IC) is inserted from an upper side thereof and seated, and assembly guide holes formed around the IC receiving hole in a bottom side of the IC insert body; and a guide plate coupled to the bottom side of the IC insert body and separated from the pin guide plate, the guide plate having second spring contact guide holes formed in a position corresponding to the first spring contact guide holes of the pin guide plate so that the spring contacts protrude from the guide plate through the second spring contact guide holes, positioning guide holes into which the upper guide pins of the in guide plate are inserted, and assembly guide pins protruding from a top side of the guide plate and inserted into the assembly guide holes of the IC insert body. ### Claim 2 (depends on 1) The socket device for IC tests of claim 1, wherein each of the first spring contact guide holes has a first mouth in a lower portion thereof having a diameter greater than a diameter of the first spring contact guide hole. ### Claim 3 (depends on 1) The socket device for IC tests of claim 1, wherein each of the second spring contact guide holes has a second mouth in a lower portion thereof having a diameter greater than a diameter of the second spring contact guide hole. ### Claim 4 (depends on 1) The socket device for IC tests of claim 1, wherein the guide plate has a lead receiving space formed in an upper portion of each of the second spring contact guide holes, the lead receiving space having a diameter greater than a diameter of the second spring contact guide hole. ### Claim 5 (depends on 1) The socket device for IC tests of claim 1, wherein the guide plate comprises a common lead receiving space formed by connecting upper portions of the two or more second spring contact guide holes to each other. ### Claim 6 (depends on 5) The socket device for IC tests of claim 5, wherein the common lead receiving space has a block or line shape in response to a pattern of arrangement of leads provided on the IC. ### Claim 7 (depends on 1) The socket device for IC tests of claim 1, wherein a first inclined surface is formed on a peripheral edge of the pin guide plate, a second inclined surface is formed in a bottom side of the guide plate, the second inclined surface engaging with the first inclined surface of the pin guide plate, and a depressed contact surface is formed in the bottom side of the guide plate so that the pin guide plate is seated into the depressed contact surface. ### Claim 8 (depends on 1) The socket device for IC tests of claim 1, wherein the guide plate and the pin guide plate respectively have assembly surfaces facing each other, and the upper guide pins are inserted into the positioning guide holes, whereby the guide plate and the pin guide plate are assembled with each other at a correct position. ### Claim 9 (depends on 8) The socket device for IC tests of claim 8, wherein the upper guide pins and the positioning guide holes respectively have inclined surfaces so that the upper guide pins and the positioning guide holes engage with each other. ### Claim 10 (depends on 1) The socket device for IC tests of claim 1, wherein the socket body and the pin guide plate are coupled to each other by a bolt. ### Claim 11 (depends on 1) The socket device for IC tests of claim 1, wherein the lower plate and the upper plate are coupled to each other by a bolt. ### Claim 12 (depends on 1) The socket device for IC tests of claim 1, wherein said each of the spring contact includes an upper pin disposed in the corresponding one of the first through holes, a lower pin disposed in the corresponding one of the second through holes, and a spring disposed between the upper pin and the lower pin. ### Claim 13 (depends on 1) The socket device for IC tests of claim 1, further comprising elastic bodies disposed between the upper plate of the socket body and the pin guide plate and elastically supporting the pin guide plate on the socket body. ### Claim 14 (depends on 1) The socket device for IC tests of claim 1, further comprising socket guide for fixing the socket body to the IC insert body, the socket guide including socket guide pins on a top side thereof, wherein the IC insert body includes socket guide holes into which the socket guide pins of the socket guide are inserted. ### Claim 15 (depends on 14) The socket device for IC tests of claim 14, wherein the socket guide further includes socket position guide pins, and the upper plate of the socket body includes socket position guide holes into which the socket position guide pins of the socket guide are inserted.