# US 9,435,825 B2 · Multi-channel probe plate for semiconductor package test systems > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,435,825 B2 - Document ID: US9435825B2 - Status: Granted - Kind: B2 - Application number: 14/812,633 - Filed: 2015-07-29 - Published: 2015-11-19 - Granted: 2016-09-06 - Earliest claimed: 2013-06-07 - Assignees: Infineon Technologies AG - Applicants: Infineon Technologies AG - Inventors: Ming Xue; Chow York Lee - Web page: https://patentgrep.com/patent/US9435825B2 ## CPC - G01R 1/0466: {concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding} - G01R 1/07: Non contact-making probes - G01R 31/2889: {Interfaces, e.g. between probe and tester (G01R31/31905 and G01R1/07364 take precedence)} - G01R 31/2896: {Testing of IC packages; Test features related to IC packages (containers per se H10W76/10, encapsulations per se H10W74/00)} - G01R 31/312: by capacitive methods - G01R 31/67: Testing the correctness of wire connections in electric apparatus or circuits - G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12) ## Abstract A test apparatus includes a multi-channel probe plate having an electrically insulating body with opposing first and second main surfaces, and a plurality of spaced apart electrically conductive coupling regions embedded in or attached to the body at the first main surface. Each of the electrically conductive coupling regions is configured to cover a different zone of a semiconductor package when the semiconductor package is positioned in close proximity to the first main surface of the plate. The test apparatus further includes circuitry electrically connected to each of the coupling regions of the probe plate via a different channel. The circuitry is operable to measure a parameter indicative of the degree of capacitive coupling between each electrically conductive coupling region of the probe plate and the zone of the semiconductor package covered by the corresponding electrically conductive coupling region. ## Claims ### Claim 1 A test apparatus, comprising: a multi-channel probe plate comprising an electrically insulating body with opposing first and second main surfaces, and a plurality of spaced apart electrically conductive coupling regions embedded in or attached to the body at the first main surface, each of the electrically conductive coupling regions configured to cover a different zone of a semiconductor package when the semiconductor package is positioned in close proximity to the first main surface of the plate; and circuitry electrically connected to each of the coupling regions of the probe plate via a different channel, the circuitry operable to measure a parameter indicative of the degree of capacitive coupling between each electrically conductive coupling region of the probe plate and the zone of the semiconductor package covered by the corresponding electrically conductive coupling region. ### Claim 2 (depends on 1) The test apparatus of claim 1, wherein the probe plate comprises a single electrically conductive coupling region extending in parallel with each side of the body and spaced apart from the other electrically conductive coupling regions of the probe plate. ### Claim 3 (depends on 1) The test apparatus of claim 1, wherein the probe plate comprises at least two spaced apart electrically conductive coupling regions extending in the same plane and in parallel with each side of the body. ### Claim 4 (depends on 1) The test apparatus of claim 1, wherein the circuitry comprises amplifier circuitry operable to amplify the parameter measured for each of the electrically conductive coupling regions of the probe plate to provide capacitance signals. ### Claim 5 (depends on 4) The test apparatus of claim 4, wherein the circuitry comprises a multiplexer operable to select different ones of the capacitance signals for analysis. ### Claim 6 (depends on 5) The test apparatus of claim 5, wherein pairs of adjacent ones of the electrically conductive coupling regions extend in planes that intersect perpendicular to each other in corner zones of the probe plate, and the wherein multiplexer is operable to select the capacitance signals for one pair of the electrically conductive coupling regions at the same time for analysis. ### Claim 7 (depends on 1) The test apparatus of claim 1, wherein the circuitry is operable to measure the parameter for at least some but not all of the electrically conductive coupling regions of the probe plate at the same time. ### Claim 8 (depends on 7) The test apparatus of claim 7, wherein the circuitry is operable to measure the parameter for pairs of adjacent ones of the electrically conductive coupling regions of the probe plate at the same time. ### Claim 9 A test system, comprising: probes configured to contact leads of a semiconductor package; a multi-channel probe plate comprising an electrically insulating body with opposing first and second main surfaces, and a plurality of spaced apart electrically conductive coupling regions embedded in or attached to the body at the first main surface, each of the electrically conductive coupling regions configured to cover a different zone of the semiconductor package when the semiconductor package is positioned in close proximity to the first main surface of the plate; circuitry electrically connected to each of the coupling regions of the probe plate via a different channel, the circuitry operable to measure a parameter indicative of the degree of capacitive coupling between each electrically conductive coupling region of the probe plate and the zone of the semiconductor package covered by the corresponding electrically conductive coupling region; and a controller operable to apply test signals and ground to the semiconductor package via the probes during testing of the semiconductor package and analyze capacitance signals provided by the circuitry to determine whether an electrical connection of the semiconductor package in any of the zones of the semiconductor package or between the zones violates one or more test criteria. ### Claim 10 (depends on 9) The test system of claim 9, wherein the circuitry is operable to provide to the controller for analysis a capacitance signal based on the parameter measured for each of the electrically conductive coupling regions of the probe plate and select different ones of the capacitance signals for analysis, and wherein the controller is operable to control how the circuitry selects the capacitance signals for analysis. ### Claim 11 (depends on 9) The test system of claim 9, wherein the probe plate comprises a single electrically conductive coupling region extending in parallel with each side of the body and spaced apart from the other electrically conductive coupling regions of the probe plate. ### Claim 12 (depends on 9) The test system of claim 9, wherein the probe plate comprises at least two spaced apart electrically conductive coupling regions extending in the same plane and in parallel with each side of the body. ### Claim 13 (depends on 9) The test system of claim 9, wherein the circuitry comprises: amplifier circuitry operable to amplify the parameter measured for each of the electrically conductive coupling regions of the probe plate to provide the capacitance signals; and a multiplexer operable to select different ones of the capacitance signals for analysis by the controller. ### Claim 14 (depends on 13) The test system of claim 13, wherein pairs of adjacent ones of the electrically conductive coupling regions extend in planes that intersect perpendicular to each other in corner zones of the probe plate, and the multiplexer is operable to select the capacitance signals for one pair of the electrically conductive coupling regions at the same time for analysis by the controller. ### Claim 15 (depends on 9) The test system of claim 9, wherein the circuitry is operable to measure the parameter for each of the electrically conductive coupling regions of the probe plate by detecting the current in each of the electrically conductive coupling regions during application of the test signals to the semiconductor package. ### Claim 16 (depends on 15) The test system of claim 15, wherein the controller is operable to control the circuitry to measure the parameter for pairs of adjacent ones of the electrically conductive coupling regions of the probe plate at the same time. ### Claim 17 A capacitive test method for semiconductor packages, the method comprising: positioning a semiconductor package in close proximity to a main surface of a multi-channel probe plate, the probe plate comprising an electrically insulating body and a plurality of spaced apart electrically conductive coupling regions embedded in or attached to the body at the first main surface, each of the electrically conductive coupling regions covering a different zone of the semiconductor package; applying test signals and ground to the semiconductor package; measuring a parameter indicative of the degree of capacitive coupling between each electrically conductive coupling region of the probe plate and the zone of the semiconductor package covered by the corresponding electrically conductive coupling region; and analyzing capacitance signals to determine whether an electrical connection of the semiconductor package in any of the zones of the semiconductor package or between the zones violates one or more test criteria. ### Claim 18 (depends on 17) The method of claim 17, wherein measuring the parameter for each of the electrically conductive coupling regions of the probe plate comprises detecting the current in each of the electrically conductive coupling regions during application of the test signals to the semiconductor package. ### Claim 19 (depends on 17) The method of claim 17, wherein the parameter is measured for at least some but not all of the electrically conductive coupling regions of the probe plate at the same time. ### Claim 20 (depends on 19) The method of claim 19, wherein the parameter is measured for pairs of adjacent ones of the electrically conductive coupling regions of the probe plate at the same time.