# US 9,435,032 B2 · Method for forming patterned conductive film

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- Number: US 9,435,032 B2
- Document ID: US9435032B2
- Status: Granted
- Kind: B2
- Application number: 14/253,459
- Filed: 2014-04-15
- Published: 2014-08-14
- Granted: 2016-09-06
- Earliest claimed: 2010-01-28
- Assignees: Japan Science and Technology Agency
- Applicants: Japan Science and Technology Agency
- Inventors: Tatsuya Shimoda; Yasuo Matsuki; Zhongrong Shen
- Web page: https://patentgrep.com/patent/US9435032B2

## CPC

- C23C 18/1603: {coating on selected surface areas}
- C23C 18/06: Coating on selected surface areas, e.g. using masks
- C23C 18/08: characterised by the deposition of metallic material
- C23C 18/10: Deposition of aluminium only
- C23C 18/42: Coating with noble metals
- C23C 22/73: characterised by the process
- H05K 3/182: {characterised by the patterning method}
- H05K 2203/0709: Catalytic ink or adhesive for electroless plating
- H05K 2203/1105: Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
- Y10T 428/12028: Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, etc.]
- Y10T 428/12493: Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T 428/1275: Next to Group VIII or IB metal-base component
- Y10T 428/24917: including metal layer
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

The present invention is directed to a method for forming a patterned conductive film, which comprises the step of bringing a substrate having a layer made of platinum microcrystal particles formed thereon in a pattern and a complex of an amine compound and an aluminum hydride into contact with each other at a temperature of 50 to 120° C. According to the present invention, there is provided a method for forming a patterned conductive layer, which can ensure electrical bonding with a substrate and also can be suitably applied to various electronic devices, simply without requiring a massive and heavy apparatus.

## Claims

### Claim 1

A method for forming a patterned conductive film, the method comprising:
bringing a substrate and a complex of an amine compound and an aluminum hydride into contact with each other at a temperature of 50 to 120° C.,
wherein the substrate has a layer made of platinum microcrystal particles formed thereon in a pattern and
the platinum microcrystal particles are crystalline platinum cubes obtained by a method comprising bringing a platinum complex compound;
an acid;
a primary alcohol having 2 to 12 carbon atoms; and
a hydrophilic polymer,
into contact with each other in a polar solvent.

### Claim 2 (depends on 1)

The method according to claim 1,
wherein the platinum microcrystal particles have an average particle diameter of 15 nm or less.