# US 9,435,016 B2 · Cu-Ni-Si-based copper alloy plate having excellent deep drawing workability and method of manufacturing the same

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- Number: US 9,435,016 B2
- Document ID: US9435016B2
- Status: Granted
- Kind: B2
- Application number: 13/808,351
- Filed: 2010-07-07
- Published: 2013-07-04
- Granted: 2016-09-06
- Earliest claimed: 2010-07-07
- Assignees: Mitsubishi Shindoh Co., Ltd.
- Applicants: Takeshi Sakurai; Yoshio Abe; Akira Saito; Yoshihiro Kameyama
- Inventors: Takeshi Sakurai; Yoshio Abe; Akira Saito; Yoshihiro Kameyama
- Web page: https://patentgrep.com/patent/US9435016B2

## CPC

- C22F 1/08: of copper or alloys based thereon
- C22C 9/04: with zinc as the next major constituent
- C22C 9/06: with nickel or cobalt as the next major constituent
- C22C 9/10: with silicon as the next major constituent
- C22F 1/00: Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working (apparatus for mechanical working of metal B21, B23, B24)
- H01B 1/026: {Alloys based on copper}
- C22F: CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS (surface treatment of metallic material involving at least one process provided for in class C23 and at least one process covered by this subclass, C23F17/00)
- C22C: ALLOYS (treatment of alloys C21D, C22F)
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})

## Abstract

The Cu—Ni—Si-based copper alloy plate contains 1.0 mass % to 3.0 mass % of Ni, and Si at a concentration of ⅙ to ¼ of the mass % concentration of Ni with a remainder of Cu and inevitable impurities, in which, when the average value of the aspect ratio (the minor axis of crystal grains/the major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, the average value of GOS in the all crystal grains is 1.2° to 1.5°, and the ratio (Lσ/L) of the total special grain boundary length Lσ of special grain boundaries to the total grain boundary length L of crystal grain boundaries is 60% to 70%, the spring bending elastic limit becomes 450 N/mm2 to 600 N/mm2, the solder resistance to heat separation is favorable and deep drawing workability is excellent at 150° C. for 1000 hours.

## Claims

### Claim 1

A Cu—Ni—Si-based copper alloy plate comprising:
1.0 mass % to 3.0 mass % of Ni;
0.2 mass % to 0.8 mass % of Sn;
0.3 mass % to 1.5 mass % of Zn;
0.001 mass % to 0.2 mass % of Mg; and
Si at a concentration of ⅙ to ¼ of a mass % concentration of Ni,
with a remainder of Cu and inevitable impurities,
wherein, an average value of aspect ratios (a minor axis of crystal grains/a major axis of crystal grains) of each crystal grains in an alloy structure is 0.4 to 0.6, an average value of GOS in all crystal grains, which is measured through an EBSD method using a scanning electron microscope equipped with an electron backscatter diffraction image system, is 1.2° to 1.5°, wherein a boundary for which an orientation difference between adjacent pixels is 5° or more as a crystal grain boundary, by measuring orientations of all pixels in a measurement area range; and a ratio (Lσ/L) of a total special grain boundary length Lσ of special grain boundaries to a total grain boundary length L of crystal grain boundaries is 60% to 70%, a spring bending elastic limit becomes 450 N/mm2 to 600 N/mm2, a solder resistance to heat separation is favorable and deep drawing workability is excellent at 150° C. for 1000 hours.

### Claim 2 (depends on 1)

The Cu—Ni—Si-based copper alloy plate according to claim 1, further comprising one or two of:
Fe: 0.007 mass % to 0.25 mass %;
P: 0.001 mass % to 0.2 mass %;
C: 0.0001 mass % to 0.001 mass %;
Cr: 0.001 mass % to 0.3 mass %; and
Zr: 0.001 mass % to 0.3 mass %.

### Claim 3 (depends on 1)

A method of manufacturing the Cu—Ni—Si-based copper alloy plate according to claim 1,
wherein, when a copper alloy plate is manufactured using a process including hot rolling, cold rolling, a solution treatment, an aging treatment, final cold rolling, and low-temperature annealing in this order, a working rate during the final cold rolling is set to 10% to 30%, the tensile force applied to a copper alloy plate in a furnace during the continuous low-temperature annealing is set to 300 N/mm2 to 900 N/mm2, and a floating distance of the copper alloy plate in the furnace during the continuous low-temperature annealing is set to 10 mm to 20 mm.