# US 9,434,865 B2 · Adhesive composition, an adhesive sheet and a production method of a semiconductor device

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- Number: US 9,434,865 B2
- Document ID: US9434865B2
- Status: Granted
- Kind: B2
- Application number: 13/832,170
- Filed: 2013-03-15
- Published: 2013-09-19
- Granted: 2016-09-06
- Earliest claimed: 2012-03-16
- Assignees: Lintec Corporation
- Applicants: LINTEC Corporation
- Inventors: Sayaka Tsuchiyama; Isao Ichikawa
- Web page: https://patentgrep.com/patent/US9434865B2

## CPC

- C09J 133/00: Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J 5/00: Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J 7/35: Heat-activated
- C09J 133/06: of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J 133/066: {containing -OH groups}
- C09J 133/14: of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
- C09J 133/24: Homopolymers or copolymers of amides or imides
- C09J 143/04: Homopolymers or copolymers of monomers containing silicon
- H10P 54/00: Cutting or separating of wafers, substrates or parts of devices
- H10P 72/7402: {Wafer tapes, e.g. grinding or dicing support tapes}
- H10W 74/47: comprising organic materials, e.g. plastics or resins
- H10W 90/00: Package configurations
- H10P 72/7416: {used during dicing or grinding}
- H10P 72/742: {involving stretching of the auxiliary support post dicing}
- H10P 72/7422: {used to protect an active side of a device or wafer}
- H10P 72/7438: {with parts of the auxiliary support remaining in the finished device}
- H10P 72/744: {Details of chemical or physical process used for separating the auxiliary support from a device or a wafer}
- H10W 72/01304: {using temporary auxiliary members, e.g. using sacrificial coatings or handle substrates}
- H10W 72/01336: {in solid form, e.g. by using a powder or by laminating a foil}
- H10W 72/01365: {Thermally treating (reflowing H10W72/01357)}
- H10W 72/0198: {batch processes}
- H10W 72/073: {of die-attach connectors}
- H10W 72/07311: {Treating the bonding area before connecting, e.g. by applying flux or cleaning}
- H10W 72/07331: {Connecting techniques}
- H10W 72/07332: {Compression bonding, e.g. thermocompression bonding}
- H10W 72/07337: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
- H10W 72/07338: {hardening the adhesive by curing, e.g. thermosetting}
- H10W 72/075: {of bond wires}
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/353: {not comprising solid metals or solid metalloids, e.g. ceramics}
- H10W 72/354: {comprising polymers}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/732: {between stacked chips}
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 99/00: Subject matter not provided for in other groups of this subclass
- Y10T 428/2826: Synthetic resin or polymer
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An adhesive composition includes an acrylic polymer (A), a heat curable resin (B) having unsaturated hydrocarbon group, and a coupling agent (C) having reactive a double bond group.

## Claims

### Claim 1

An adhesive composition comprising:
an acrylic polymer (A),
a heat curable resin (B), and
a silane coupling agent (C) having a reactive double bond group selected from the group consisting of a (meth)acryl group, a vinyl group, a styryl group, and an allyl group,
wherein the acrylic polymer (A) is included in a ratio of 50-90 wt. % in an entire weight of the adhesive composition and a weight average molecular weight of the acrylic polymer (A) is 100,000 to 2,000,000, and
wherein the heat curable resin (B) comprises an epoxy resin and a heat curing agent, and at least one of the epoxy resin and the heat curing agent comprises an unsaturated hydrocarbon group.

### Claim 2 (depends on 1)

The adhesive composition as set forth in claim 1 further comprising a filler (G).

### Claim 3 (depends on 1)

A single layer adhesive film comprising the adhesive composition as set forth in claim 1.

### Claim 4 (depends on 1)

An adhesive sheet wherein an adhesive layer comprising the adhesive composition as set forth in claim 1 is formed on a support.

### Claim 5 (depends on 4)

The adhesive sheet as set forth in claim 4 wherein said support is a resin film.

### Claim 6 (depends on 4)

The adhesive sheet as set forth in claim 4 wherein said support is a dicing sheet.

### Claim 7 (depends on 5)

A production method of a semiconductor device comprising:
laminating the adhesive layer of the adhesive sheet as set forth in claim 5 to a semiconductor wafer, dicing said semiconductor wafer and the adhesive layer, thereby obtaining a semiconductor chip,
releasing the semiconductor chip from the support while the adhesive layer is transferred to said semiconductor chip, and
adhering said semiconductor chip on a die pad portion or on other semiconductor chip via said adhesive layer.

### Claim 8 (depends on 1)

The adhesive composition as forth in claim 1, wherein said unsaturated hydrocarbon group is selected from the group consisting of vinyl group, allyl group, acryloyl group, methacryloyl group, acrylamide group, and methacrylamide group.

### Claim 9

An adhesive composition comprising:
an acrylic polymer (A),
a heat curable resin (B), and
a silane coupling agent (C) having a reactive double bond group comprising a (meth)acryl group, a vinyl group, a styryl group, or an allyl group,
wherein the acrylic polymer (A) is included in a ratio of 50-90 wt. % in an entire weight of the adhesive composition and a weight average molecular weight of the acrylic polymer (A) is 100,000 to 2,000,000, and
wherein the heat curable resin (B) comprises an epoxy resin and a heat curing agent, and the heat curing agent comprises an unsaturated hydrocarbon group.